ZHCSS37J may   2009  – january 2021 XIO2001

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Revision History
  6. Pin Configuration and Functions
    1.     Pin Assignments
    2.     Pin Descriptions
  7. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Handling Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information #GUID-4E9F689A-942D-492C-8F28-F3CC5F1BD0E6/SCPS2129637AN1
    5. 6.5  Nominal Power Consumption
    6. 6.6  PCI Express Differential Transmitter Output Ranges
    7. 6.7  PCI Express Differential Receiver Input Ranges
    8. 6.8  PCI Express Differential Reference Clock Input Ranges #GUID-60875016-888B-4DD4-A309-543B497BAC9F/SCPS1718455
    9. 6.9  PCI Bus Electrical Characteristics
    10. 6.10 3.3-V I/O Electrical Characteristics
    11. 6.11 PCI Bus Timing Requirements
    12. 6.12 Power-Up/-Down Sequencing
      1. 6.12.1 Power-Up Sequence
      2. 6.12.2 Power-Down Sequence
  8. Parameter Measurement Information
    1.     25
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Bridge Reset Features
      2. 8.3.2  PCI Express Interface
        1. 8.3.2.1 2.5-Gb/s Transmit and Receive Links
        2. 8.3.2.2 Transmitter Reference Resistor
        3. 8.3.2.3 Reference Clock
        4. 8.3.2.4 Reset
        5. 8.3.2.5 Beacon
        6. 8.3.2.6 Wake
        7. 8.3.2.7 Initial Flow Control Credits
        8. 8.3.2.8 PCI Express Message Transactions
      3. 8.3.3  PCI Port Arbitration
        1. 8.3.3.1 Classic PCI Arbiter
      4. 8.3.4  Configuration Register Translation
      5. 8.3.5  PCI Interrupt Conversion to PCI Express Messages
      6. 8.3.6  PME Conversion to PCI Express Messages
      7. 8.3.7  PCI Express to PCI Bus Lock Conversion
      8. 8.3.8  Two-Wire Serial-Bus Interface
        1. 8.3.8.1 Serial-Bus Interface Implementation
        2. 8.3.8.2 Serial-Bus Interface Protocol
        3. 8.3.8.3 Serial-Bus EEPROM Application
        4. 8.3.8.4 Accessing Serial-Bus Devices Through Software
      9. 8.3.9  Advanced Error Reporting Registers
      10. 8.3.10 Data Error Forwarding Capability
      11. 8.3.11 General-Purpose I/O Interface
      12. 8.3.12 Set Slot Power Limit Functionality
      13. 8.3.13 PCI Express and PCI Bus Power Management
      14. 8.3.14 Auto Pre-Fetch Agent
    4. 8.4 Register Maps
      1. 8.4.1  Classic PCI Configuration Space
      2. 8.4.2  Vendor ID Register
      3. 8.4.3  Device ID Register
      4. 8.4.4  Command Register
      5. 8.4.5  Status Register
      6. 8.4.6  Class Code and Revision ID Register
      7. 8.4.7  Cache Line Size Register
      8. 8.4.8  Primary Latency Timer Register
      9. 8.4.9  Header Type Register
      10. 8.4.10 BIST Register
      11. 8.4.11 Device Control Base Address Register
      12. 8.4.12 Primary Bus Number Register
      13. 8.4.13 Secondary Bus Number Register
      14. 8.4.14 Subordinate Bus Number Register
      15. 8.4.15 Secondary Latency Timer Register
      16. 8.4.16 I/O Base Register
      17. 8.4.17 I/O Limit Register
      18. 8.4.18 Secondary Status Register
      19. 8.4.19 Memory Base Register
      20. 8.4.20 Memory Limit Register
      21. 8.4.21 Prefetchable Memory Base Register
      22. 8.4.22 Prefetchable Memory Limit Register
      23. 8.4.23 Prefetchable Base Upper 32-Bit Register
      24. 8.4.24 Prefetchable Limit Upper 32-Bit Register
      25. 8.4.25 I/O Base Upper 16-Bit Register
      26. 8.4.26 I/O Limit Upper 16-Bit Register
      27. 8.4.27 Capabilities Pointer Register
      28. 8.4.28 Interrupt Line Register
      29. 8.4.29 Interrupt Pin Register
      30. 8.4.30 Bridge Control Register
      31. 8.4.31 Capability ID Register
      32. 8.4.32 Next Item Pointer Register
      33. 8.4.33 Subsystem Vendor ID Register
      34. 8.4.34 Subsystem ID Register
      35. 8.4.35 Capability ID Register
      36. 8.4.36 Next Item Pointer Register
      37. 8.4.37 Power Management Capabilities Register
      38. 8.4.38 Power Management Control/Status Register
      39. 8.4.39 Power Management Bridge Support Extension Register
      40. 8.4.40 Power Management Data Register
      41. 8.4.41 MSI Capability ID Register
      42. 8.4.42 Next Item Pointer Register
      43. 8.4.43 MSI Message Control Register
      44. 8.4.44 MSI Message Lower Address Register
      45. 8.4.45 MSI Message Upper Address Register
      46. 8.4.46 MSI Message Data Register
      47. 8.4.47 PCI Express Capability ID Register
      48. 8.4.48 Next Item Pointer Register
      49. 8.4.49 PCI Express Capabilities Register
      50. 8.4.50 Device Capabilities Register
      51. 8.4.51 Device Control Register
      52. 8.4.52 Device Status Register
      53. 8.4.53 Link Capabilities Register
      54. 8.4.54 Link Control Register
      55. 8.4.55 Link Status Register
      56. 8.4.56 Serial-Bus Data Register
      57. 8.4.57 Serial-Bus Word Address Register
      58. 8.4.58 Serial-Bus Slave Address Register
      59. 8.4.59 Serial-Bus Control and Status Register
      60. 8.4.60 GPIO Control Register
      61. 8.4.61 GPIO Data Register
      62. 8.4.62 TL Control and Diagnostic Register 0
      63. 8.4.63 Control and Diagnostic Register 1
      64. 8.4.64 Control and Diagnostic Register 2
      65. 8.4.65 Subsystem Access Register
      66. 8.4.66 General Control Register
      67. 8.4.67 Clock Control Register
      68. 8.4.68 Clock Mask Register
      69. 8.4.69 Clock Run Status Register
      70. 8.4.70 Arbiter Control Register
      71. 8.4.71 Arbiter Request Mask Register
      72. 8.4.72 Arbiter Time-Out Status Register
      73. 8.4.73 Serial IRQ Mode Control Register
      74. 8.4.74 Serial IRQ Edge Control Register
      75. 8.4.75 Serial IRQ Status Register
      76. 8.4.76 Pre-Fetch Agent Request Limits Register
      77. 8.4.77 Cache Timer Transfer Limit Register
      78. 8.4.78 Cache Timer Lower Limit Register
      79. 8.4.79 Cache Timer Upper Limit Register
    5. 8.5 PCI Express Extended Configuration Space
      1. 8.5.1  Advanced Error Reporting Capability ID Register
      2. 8.5.2  Next Capability Offset/Capability Version Register
      3. 8.5.3  Uncorrectable Error Status Register
      4. 8.5.4  Uncorrectable Error Mask Register
      5. 8.5.5  Uncorrectable Error Severity Register
      6. 8.5.6  Correctable Error Status Register
      7. 8.5.7  Correctable Error Mask Register
      8. 8.5.8  Advanced Error Capabilities and Control Register
      9. 8.5.9  Header Log Register
      10. 8.5.10 Secondary Uncorrectable Error Status Register
      11. 8.5.11 Secondary Uncorrectable Error Severity
      12. 8.5.12 Secondary Error Capabilities and Control Register
      13. 8.5.13 Secondary Header Log Register
    6. 8.6 Memory-Mapped TI Proprietary Register Space
      1. 8.6.1  Device Control Map ID Register
      2. 8.6.2  Revision ID Register
      3. 8.6.3  GPIO Control Register
      4. 8.6.4  GPIO Data Register
      5. 8.6.5  Serial-Bus Data Register
      6. 8.6.6  Serial-Bus Word Address Register
      7. 8.6.7  Serial-Bus Slave Address Register
      8. 8.6.8  Serial-Bus Control and Status Register
      9. 8.6.9  Serial IRQ Mode Control Register
      10. 8.6.10 Serial IRQ Edge Control Register
      11. 8.6.11 Serial IRQ Status Register
      12. 8.6.12 Pre-Fetch Agent Request Limits Register
      13. 8.6.13 Cache Timer Transfer Limit Register
      14. 8.6.14 Cache Timer Lower Limit Register
      15. 8.6.15 Cache Timer Upper Limit Register
  10. Application, Implementation, and Layout
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 In-Card Implementation
        1. 9.2.1.1 Design Requirements
          1. 9.2.1.1.1 VCCP Clamping Rail
          2. 9.2.1.1.2 Combined Power Outputs
          3. 9.2.1.1.3 Auxiliary Power
          4. 9.2.1.1.4 VSS and VSSA Pins
          5. 9.2.1.1.5 Capacitor Selection Recommendations
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 PCI Bus Interface
            1. 9.2.1.2.1.1 Bus Parking
            2. 9.2.1.2.1.2 I/O Characteristics
            3. 9.2.1.2.1.3 Clamping Voltage
            4. 9.2.1.2.1.4 PCI Bus Clock Run
            5. 9.2.1.2.1.5 PCI Bus External Arbiter
            6. 9.2.1.2.1.6 MSI Messages Generated from the Serial IRQ Interface
            7. 9.2.1.2.1.7 PCI Bus Clocks
      2. 9.2.2 External EEPROM
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
      3. 9.2.3 JTAG Interface
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
      4. 9.2.4 Combined Power
        1. 9.2.4.1 Design Requirements
        2. 9.2.4.2 Detailed Design Procedure
      5. 9.2.5 Power Filtering
        1. 9.2.5.1 Design Requirements
        2. 9.2.5.2 Detailed Design Procedure
    3. 9.3 Layout
      1. 9.3.1 Layout Guidelines
      2. 9.3.2 Layout Example
    4. 9.4 Power Supply Recommendations
      1. 9.4.1 1.5-V and 3.3-V Digital Supplies
      2. 9.4.2 1.5-V and 3.3-V Analog Supplies
      3. 9.4.3 1.5-V PLL Supply
      4. 9.4.4 Power-Up/Down Sequencing
      5. 9.4.5 Power Supply Filtering Recommendations
  11. 10Device and Documentation Support
    1. 10.1 Documents Conventions
      1. 10.1.1 XIO2001 Definition
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documents
        1. 10.2.1.1 接收文档更新通知
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 静电放电警告
    6. 10.6 术语表
  12. 11Mechanical, Packaging, and Orderable Information

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Power Supply Filtering Recommendations

To meet the PCI-Express jitter specifications, low-noise power supplies are required on several of the XIO2001 voltage terminals. The power terminals that require low-noise power include VDDA_15 and VDDA_33. This section provides guidelines for the filter design to create low-noise power sources.

The least expensive solution for low-noise power sources is to filter existing 3.3-V and 1.5-V power supplies. This solution requires analysis of the noise frequencies present on the power supplies. The XIO2001 has external interfaces operating at clock rates of 25 MHz, 33 MHz, 50 MHz, 66 MHz, 100 MHz, 125 MHz, and 2.5 GHz. Other devices located near the XIO2001 may produce switching noise at different frequencies. Also, the power supplies that generate the 3.3 V and 1.5 V power rails may add low frequency ripple noise. Linear regulators have feedback loops that typically operate in the 100 kHz range. Switching power supplies typically have operating frequencies in the 500 KHz range. When analyzing power supply noise frequencies, the first, third, and fifth harmonic of every clock source should be considered.

Critical analog circuits within the XIO2001 must be shielded from this power supply noise. The fundamental requirement for a filter design is to reduce power supply noise to a peak-to-peak amplitude of less than 25 mV. This maximum noise amplitude should apply to all frequencies from 0 Hz to 12.5 GHz.

The following information should be considered when designing a power supply filter:

  • Ideally, the series resonance frequency for each filter component should be greater than the fifth harmonic of the maximum clock frequency. With a maximum clock frequency of 1.25 GHz, the third harmonic is 3.75 GHz and the fifth harmonic is 6.25 GHz. Finding inductors and capacitors with a series resonance frequency above 6.25 GHz is both difficult and expensive. Components with a series resonance frequency in the 4 to 6 GHz range are a good compromise.
  • The inductor(s) associated with the filter must have a DC resistance low enough to pass the required current for the connected power terminals. The voltage drop across the inductor must be low enough to meet the minus 10% voltage margin requirement associated with each XIO2001 power terminal. Power supply output voltage variation must be considered as well as voltage drops associated with any connector pins and circuit board power distribution geometries.
  • The Q versus frequency curve associated with the inductor must be appropriate to reduce power terminal noise to less than the maximum peak-to-peak amplitude requirement for the XIO2001. Recommending a specific inductor is difficult because every system design is different and therefore the noise frequencies and noise amplitudes are different. Many factors will influence the inductor selection for the filter design. Power supplies must have adequate input and output filtering. A sufficient number of bulk and bypass capacitors are required to minimize switching noise. Assuming that board level power is properly filtered and minimal low frequency noise is present, frequencies less than 10 MHz, an inductor with a Q greater than 20 from approximately 10 MHz to 3 GHz should be adequate for most system applications.
  • The series component(s) in the filter may either be an inductor or a ferrite bead. Testing has been performed on both component types. When measuring PCI-Express link jitter, the inductor or ferrite bead solutions produce equal results. When measuring circuit board EMI, the ferrite bead is a superior solution.
    Note:

    The XIO2001 reference schematics include ferrite beads in the analog power supply filters.

  • When designing filters associated with power distribution, the power supply is a low impedance source and the device power terminals are a low impedance load. The best filter for this application is a T filter. See Figure 9-12 for a T-filter circuit. Some system may require this type of filter design if the power supplies or nearby components are exceptionally noisy. This type of filter design is recommended if a significant amount of low frequency noise, frequencies less than 10 MHz, is present in a system.
  • For most applications a Pi filter will be adequate. See Figure 9-12 for a Pi-filter circuit. When implementing a Pi filter, the two capacitors and the inductor must be located next to each other on the circuit board and must be connected together with wide low impedance traces. Capacitor ground connections must be short and low impedance.
  • If a significant amount of high frequency noise, frequencies greater than 300 MHz, is present in a system, creating an internal circuit board capacitor will help reduce this noise. This is accomplished by locating power and ground planes next to each other in the circuit board stackup. A gap of 0.003 mils between the power and ground planes will significantly reduce this high frequency noise.
  • Another option for filtering high-frequency logic noise is to create an internal board capacitor using signal layer copper plates. When a component requires a low-noise power supply, usually the Pi filter is located near the component. Directly under the Pi filter, a plate capacitor may be created. In the circuit board stack-up, select a signal layer that is physically located next to a ground plane. Then, generate an internal 0.25 inch by 0.25 inch plate on that signal layer. Assuming a 0.006 mil gap between the signal layer plate and the internal ground plane, this will generate a 12 pF capacitor. By connecting this plate capacitor to the trace between the Pi filter and the component’s power pins, an internal circuit board high frequency bypass capacitor is created. This solution is extremely effective for switching frequencies above 300 MHz.

Figure 9-12 illustrates two different filter designs that may be used with the XIO2001 to provide lownoise power to critical power pins.

GUID-3F327801-9D43-4338-A061-B229C9B6C56A-low.gifFigure 9-12 Filter Designs