C67x floating-point DSP- up to 150MHz, McBSP, 16-Bit EMIFA
产品详细信息
参数
封装|引脚|尺寸
特性
- Low-Price/High-Performance Floating-Point Digital Signal Processor (DSP):
- TMS320C6712D
- Eight 32-Bit Instructions/Cycle
- 150-MHz Clock Rate
- 6.7-ns Instruction Cycle Time
- 900 MFLOPS
- Advanced Very Long Instruction Word (VLIW) C67x™ DSP Core
- Eight Highly Independent Functional Units:
- Four ALUs (Floating- and Fixed-Point)
- Two ALUs (Fixed-Point)
- Two Multipliers (Floating- and Fixed-Point)
- Load-Store Architecture With 32 32-Bit General-Purpose Registers
- Instruction Packing Reduces Code Size
- All Instructions Conditional
- Eight Highly Independent Functional Units:
- Instruction Set Features
- Hardware Support for IEEE Single-Precision and Double-Precision Instructions
- Byte-Addressable (8-, 16-, 32-Bit Data)
- 8-Bit Overflow Protection
- Saturation
- Bit-Field Extract, Set, Clear
- Bit-Counting
- Normalization
- L1/L2 Memory Architecture
- 32K-Bit (4K-Byte) L1P Program Cache (Direct Mapped)
- 32K-Bit (4K-Byte) L1D Data Cache (2-Way Set-Associative)
- 512K-Bit (64K-Byte) L2 Unified Mapped RAM/Cache (Flexible Data/Program Allocation)
- Device Configuration
- Boot Mode: 8- and 16-Bit ROM Boot
- Little Endian, Big Endian
- Enhanced Direct-Memory-Access (EDMA) Controller (16 Independent Channels)
- 16-Bit External Memory Interface (EMIF)
- Glueless Interface to Asynchronous Memories: SRAM and EPROM
- Glueless Interface to Synchronous Memories: SDRAM and SBSRAM
- 256M-Byte Total Addressable External Memory Space
- Two Multichannel Buffered Serial Ports (McBSPs)
- Direct Interface to T1/E1, MVIP, SCSA Framers
- ST-Bus-Switching Compatible
- Up to 256 Channels Each
- AC97-Compatible
- Serial-Peripheral-Interface (SPI) Compatible (Motorola™)
- Two 32-Bit General-Purpose Timers
- Flexible Software-Configurable PLL-Based Clock Generator Module
- A Dedicated General-Purpose Input/Output (GPIO) Module With 5 Pins
- IEEE-1149.1 (JTAG
) Boundary-Scan-Compatible
- 272-Pin Ball Grid Array (BGA) Package (GDP and ZDP Suffix)
- CMOS Technology
- 0.13-µm/6-Level Copper Metal Process
- 3.3-V I/Os, 1.20
-V Internal
TMS320C67x and C67x are trademarks of Texas Instruments.
Motorola is a trademark of Motorola, Inc.
Other trademarks are the property of their respective owners. IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture.
These values are compatible with existing 1.26V designs.
TMS320C6000 and C6000 are trademarks of Texas Instruments.
Windows is a registered trademark of the Microsoft Corporation. Throughout the remainder of this document, the TMS320C6712D shall be referred to as its individual full device part number or abbreviated as C6712D or 12D.
描述
The TMS320C67x DSP (including the TMS320C6712, TMS320C6712C, TMS320C6712D devices) are members of the floating-point DSP family in the TMS320C6000. DSP platform. The C6712, C6712C, and C6712D devices are based on the high-performance, advanced very-long-instruction-word (VLIW) architecture developed by Texas Instruments (TI), making these DSPs an excellent choice for multichannel and multifunction applications.
With performance of up to 900 million floating-point operations per second (MFLOPS) at a clock rate of 150 MHz, the C6712D device is the lowest-cost DSP in the C6000 DSP platform. The C6712D DSP possesses the operational flexibility of high-speed controllers and the numerical capability of array processors. This processor has 32 general-purpose registers of 32-bit word length and eight highly independent functional units. The eight functional units provide four floating-/fixed-point ALUs, two fixed-point ALUs, and two floating-/fixed-point multipliers. The C6712D can produce two MACs per cycle for a total of 300 MMACS.
The C6712D uses a two-level cache-based architecture and has a powerful and diverse set of peripherals. The Level 1 program cache (L1P) is a 32-Kbit direct mapped cache and the Level 1 data cache (L1D) is a 32-Kbit 2-way set-associative cache. The Level 2 memory/cache (L2) consists of a 512-Kbit memory space that is shared between program and data space. L2 memory can be configured as mapped memory, cache, or combinations of the two. The peripheral set includes two multichannel buffered serial ports (McBSPs), two general-purpose timers, and a glueless 16-bit external memory interface (EMIF) capable of interfacing to SDRAM, SBSRAM, and asynchronous peripherals. The C6712D device also includes a dedicated general-purpose input/output (GPIO) peripheral module.
The C6712D DSP also has application-specific hardware logic, on-chip memory, and additional on-chip peripherals.
The C6712D has a complete set of development tools which includes: a new C compiler, an assembly optimizer to simplify programming and scheduling, and a Windows debugger interface for visibility into source code execution.
Limited design support from TI available
This product has limited design support from TI for existing projects. If available, you will find relevant collateral, software and tools in the product folder. For existing designs using this product, you can request support in the TI E2ETM support forums, but limited support is available for this product.
技术文档
设计与开发
有关其他条款或所需资源,请点击下面的任何链接来查看详情页面。硬件开发
说明
XDS560v2 System Trace 是 XDS560v2 系列高性能 TI 处理器调试探针(仿真器)的第一种型号。XDS560v2 是 XDS 系列调试探针中性能最高的一款,同时支持传统 JTAG 标准 (IEEE1149.1) 和 cJTAG (IEEE1149.7)。
XDS560v2 System Trace 在其巨大的外部存储器缓冲区中加入了系统引脚跟踪。这种外部存储器缓冲区适用于指定的 TI 器件,通过捕获相关器件级信息,获得准确的总线性能活动和吞吐量,并对内核和外设进行电源管理。此外,对于带有嵌入式缓冲跟踪器 (ETB) 的所有 ARM 和 DSP 处理器,所有 XDS 调试探针均支持内核和系统跟踪。
Blackhawk XDS560v2 System Trace 通过 MIPI HSPT 60 引脚连接器(带有适合 TI 14 引脚、TI 20 引脚和 ARM 20 (...)
特性
XDS560v2 是 XDS560 系列高性能 TI 处理器调试探针(仿真器)的最新型号。XDS560v2 具有整个系列中最快的速度和最多的功能,对于 TI 微控制器、处理器和无线连接微控制器的调试来说,它是最全面的解决方案。
XDS560v2 是 XDS560 调试探针系列中最先提供系统跟踪 (STM) 功能的一款,这种类型的跟踪可以通过捕获系统事件(例如处理内核的状态、内部总线和外设)来监控整个设备。大多数 XDS560v2 模型还提供系统引脚跟踪模式,在这种模式中,系统跟踪数据被送到 XDS560v2 内的外部存储器缓冲区 (128MB),因此能够捕获大量系统事件。系统引脚跟踪数据连接需要通过额外的接线连接 JTAG 连接器。
在 XDS560 调试探针系列中,XDS560v2 PRO TRACE 是提供内核引脚跟踪功能(指令和数据)的第二代产品,这种跟踪可以捕获内核执行的所有指令并将其发送到 XDS560v2 PRO TRACE 内的外部存储器缓冲区 (1GB)。内核引脚跟踪并不干扰系统的实时行为,而且可以捕获更多的指令。内核引脚跟踪数据连接需要通过额外的接线连接 JTAG 连接器。
为了支持所有类型的引脚跟踪(指令和系统),XDS560v2 的所有型号都提供标准的 60 引脚 MIPI HSPT 连接器作为与目标之间的主要 JTAG 连接。此外,所有型号都提供针对 TI 和 ARM 标准 JTAG 连接器的模块化目标适配器(提供的适配器因型号而异)。
XDS560v2 支持传统的 IEEE1149.1 (JTAG) 仿真和 IEEE1149.7 (cJTAG),运行时的 JTAG 接口电平为 1.2V 至 +4.1V。
与传统 JTAG 相比,紧凑 JTAG (cJTAG) 有巨大的进步;因为它仅需使用两个引脚即可支持所有功能,可用于某些指定的 TI 无线连接微控制器中。
所有 XDS560v2 (...)
说明
XDS560v2 System Trace 是 XDS560v2 系列高性能 TI 处理器调试探针(仿真器)的第一种型号。XDS560v2 是 XDS 系列调试探针中性能最高的一款,同时支持传统 JTAG 标准 (IEEE1149.1) 和 cJTAG (IEEE1149.7)。
XDS560v2 System Trace 在其巨大的外部存储器缓冲区中加入了系统引脚跟踪。这种外部存储器缓冲区适用于指定的 TI 器件,通过捕获相关器件级信息,获得准确的总线性能活动和吞吐量,并对内核和外设进行电源管理。此外,对于带有嵌入式缓冲跟踪器 (ETB) 的所有 ARM 和 DSP 处理器,所有 XDS 调试探针均支持内核和系统跟踪。
Spectrum Digital XDS560v2 System Trace 通过 MIPI HSPT 60 引脚连接器(适合 TI 14 引脚、TI 20 引脚、ARM 20 引脚和 TI 60 (...)
特性
XDS560v2 是 XDS560 系列高性能 TI 处理器调试探针(仿真器)的最新型号。XDS560v2 具有整个系列中最快的速度和最多的功能,对于 TI 微控制器、处理器和无线连接微控制器的调试来说,它是最全面的解决方案。
XDS560v2 是 XDS560 调试探针系列中最先提供系统跟踪 (STM) 功能的一款,这种类型的跟踪可以通过捕获系统事件(例如处理内核的状态、内部总线和外设)来监控整个设备。大多数 XDS560v2 模型还提供系统引脚跟踪模式,在这种模式中,系统跟踪数据被送到 XDS560v2 内的外部存储器缓冲区 (128MB),因此能够捕获大量系统事件。系统引脚跟踪数据连接需要通过额外的接线连接 JTAG 连接器。
在 XDS560 调试探针系列中,XDS560v2 PRO TRACE 是提供内核引脚跟踪功能(指令和数据)的第二代产品,这种跟踪可以捕获内核执行的所有指令并将其发送到 XDS560v2 PRO TRACE 内的外部存储器缓冲区 (1GB)。内核引脚跟踪并不干扰系统的实时行为,而且可以捕获更多的指令。内核引脚跟踪数据连接需要通过额外的接线连接 JTAG 连接器。
为了支持所有类型的引脚跟踪(指令和系统),XDS560v2 的所有型号都提供标准的 60 引脚 MIPI HSPT 连接器作为与目标之间的主要 JTAG 连接。此外,所有型号都提供针对 TI 和 ARM 标准 JTAG 连接器的模块化目标适配器(提供的适配器因型号而异)。
XDS560v2 支持传统的 IEEE1149.1 (JTAG) 仿真和 IEEE1149.7 (cJTAG),运行时的 JTAG 接口电平为 1.2V 至 +4.1V。
与传统 JTAG 相比,紧凑 JTAG (cJTAG) 有巨大的进步;因为它仅需使用两个引脚即可支持所有功能,可用于某些指定的 TI 无线连接微控制器中。
所有 XDS560v2 (...)
软件开发
特性
- 自然 C 源码
- 优化的 C 代码,具有内建运算符
- 手工编码、经汇编语言优化的例程
- C 调用的例程,可内联且与 TMS320C6000 编译器完全兼容
- 接受单样片或向量输入的例程
- 提供的函数经 C 模型和现有实时支持函数测试
- 基准(周期和代码大小)
- 使用代码生成工具 v7.2.0 进行编译
特性
Optimized DSP routines including functions for:
- Adaptive filtering
- Correlation
- FFT
- Filtering and convolution: FIR, biquad, IIR, convolution
- Math: Dot products, max value, min value, etc.
- Matrix operations
设计工具和仿真
特性
- Supports many TI processors including Sitara and Jacinto Processors and DSPs
- Search by type of product, TI devices supported, or country
- Links and contacts for quick engagement
- Third-party companies located around the world
CAD/CAE 符号
封装 | 引脚 | 下载 |
---|---|---|
BGA (GDP) | 272 | 了解详情 |
BGA (ZDP) | 272 | 了解详情 |
订购与质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/FIT 估算
- 材料成分
- 认证摘要
- 持续可靠性监测