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CPU 1 Arm Cortex-A15 Frequency (MHz) 600, 1000 Coprocessors C66x DSP Display type 1 LCD PCIe 1 PCIe Gen 2 Hardware accelerators Industrial communications subsystem, Programable real-time unit, Security Accelerator Features Networking Operating system Linux, RTOS Security Cryptographic acceleration, Secure boot, Secure storage Rating Catalog Operating temperature range (°C) -40 to 125
CPU 1 Arm Cortex-A15 Frequency (MHz) 600, 1000 Coprocessors C66x DSP Display type 1 LCD PCIe 1 PCIe Gen 2 Hardware accelerators Industrial communications subsystem, Programable real-time unit, Security Accelerator Features Networking Operating system Linux, RTOS Security Cryptographic acceleration, Secure boot, Secure storage Rating Catalog Operating temperature range (°C) -40 to 125
FCCSP (ABY) 625 441 mm² (21 mm × 21 mm)
  • Processor cores:
  • Arm® Cortex®-A15 microprocessor unit (Arm A15) subsystem at up to 1000 MHz
    • Supports full Implementation of Armv7-A architecture instruction set
    • Integrated SIMDv2 (Arm® Neon™ Technology) and VFPv4 (Vector Floating Point)
    • 32KB of L1 program memory
    • 32KB of L1 data memory
    • 512KB of L2 memory
    • Error Correction Code (ECC) protection for L1 data memory ECC for L2 memory
    • Parity protection for L1 program memory
    • Global Timebase Counter (GTC)
      • 64-Bit free-running counter that provides timebase for Arm A15 internal timers
      • Compliant to Armv7 MPCore Architecture for Generic Timers
  • C66x fixed- and floating-point VLIW DSP subsystem at up to 1000 MHz
    • Fully object-code compatible With C67x+ and C64x+ cores
    • 32KB of L1 program memory
    • 32KB of L1 data memory
    • 1024KB of L2 configurable as L2 RAM or cache
    • Error detection for L1 program memory
    • ECC for L1 data memory
    • ECC for L2 data memory
  • Industrial subsystem:
  • Up to Two Programmable Real-Time Unit and Industrial Communication Subsystems (PRU-ICSS), each supports:
    • Two Programmable Real-Time Units (PRUs) with enhanced multiplier and accumulator, each PRU supports:
      • 16KB of program memory With ECC
      • 8KB of data memory With ECC
      • CRC32 and CRC16 hardware accelerator
      • 20 × enhanced GPIO
      • Serial Capture Unit (SCU), supporting direct connection, 16-bit parallel capture, 28-bit shift, MII_RT, EnDat 2.2 protocol and Sigma-Delta demodulation
      • Scratch pad and XFR direct connect
    • 64KB of general-purpose memory With ECC
    • One Ethernet MII_RT module with two MII ports configurable for connection with each PRU; supports multiple industrial communication protocols
    • Industrial Ethernet Peripheral (IEP) to manage and generate industrial Ethernet functions
    • Built-In Universal Asynchronous Receiver and Transmitter (UART) 16550, with a dedicated 192-MHz clock to support 12-Mbps PROFIBUS®
    • Built-In industrial Ethernet 64-Bit timer
    • Built-In enhanced capture module (eCAP)
  • Memory subsystem:
  • Multicore Shared Memory Controller (MSMC) with 1024KB of shared L2 RAM
    • Provides high-performance interconnect to internal shared SRAM and DDR EMIF for both Arm A15 and C66x Access
    • Supports Arm I/O coherency where Arm A15 is cache coherent to other system masters accessing the MSMC-SRAM or DDR EMIF
    • Supports ECC on SRAM
  • Up to 36-Bit DDR External Memory Interface (EMIF)
    • Supports DDR3L at up to 1066 MT/s
    • Supports 4-GB memory address range
    • Supports 32-Bit SDRAM data bus with 4-bit ECC
    • Supports 16-Bit and 32-Bit SDRAM data bus without ECC
  • General-Purpose Memory Controller (GPMC)
    • Flexible 8- and 16-Bit asynchronous memory interface with up to four chip selects
    • Supports NOR, Muxed-NOR, SRAM
    • Supports general-purpose memory-port expansion with the following modes:
      • Asynchronous read and write access
      • Asynchronous read page access (4-, 8-, 16-Word16)
      • Synchronous read and write access
      • Synchronous read burst access without wrap capability (4-, 8-, 16-Word16)
  • Network Subsystem (NSS):
  • Ethernet MAC (EMAC) subsystem
    • One-port Gigabit Ethernet: RMII, MII, RGMII
    • Supports 10-, 100-, 1000-Mbps full duplex
    • Supports 10-, 100-Mbps half duplex
    • Supports Ethernet Audio Video Bridging (eAVB)
    • Maximum frame size 2016 Bytes (2020 Bytes with VLAN)
    • Eight priority level QOS support (802.1p)
    • IEEE 1588v2 (2008 Annex D, Annex E, and
      Annex F) to facilitate Audio Video Bridging 802.1AS Precision Time Protocol (PTP)
    • CPTS module with timestamping support for IEEE 1588v2
    • DSCP priority mapping (IPv4 and IPv6)
    • MDIO module for PHY management
    • Enhanced statistics collection
  • Navigator Subsystem (NAVSS)
    • Built-In packet DMA controller for optimized network processing
    • Built-In Queue Manager (QM) for optimized network processing
      • Supports up to 128 queues
      • 2048 buffers supported in internal queue RAM
  • Crypto Engine (SA) supports:
    • Crypto Function Library for AES, DES, 3DES, SHA1, MD5, SHA2-224 and SHA2-256 Operations
    • Block data encryption supported through hardware cores
      • AES with 128-, 192-, and 256-Bit Key supports
      • DES and 3DES with 1, 2, or 3 Different Key support
    • Programmable Mode Control Engine (MCE)
    • Public Key Accelerator (PKA) with elliptic curve cryptography
    • Elliptic Curve Diffie–Hellman (ECDH) based key exchange and digital signature (ECDSA) applications
    • Authentication for SHA1, MD5, SHA2-224 and SHA2-256
    • Keyed HMAC operation through hardware core
    • True Random Number Generator (TRNG)
  • Display Subsystem:
  • Supports one video pipe with in-loop scaling, color space
  • Conversion and background color overlay
  • Input data format: BITMAP, RGB16, RGB24, RGB32, ARGB16, ARGB32, YUV420, YUV422, and RGB565-A8
  • Supported display interfaces:
    • MIPI® DPI 2.0 parallel interface
    • RFBI (MIPI-DBI 2.0) up to QVGA at 30fps
    • BT.656 4:2:2
    • BT.1120 4:2:2 up to 1920 × 1080 at 30fps
  • In-loop scaling capability
  • LCD interface supports:
    • Active Matrix (TFT)
    • Passive Matrix (STN)
    • Grayscale
    • TDM
    • AC Bias Control
    • Dither
    • CPR
  • Asynchronous Audio Sample Rate Converter (ASRC)
  • High performance asynchronous sample rate converter with 140 dB Signal-to-Noise (SNR)
  • Up to 8 stereo streams (16 audio channels)
  • Automatically sensing / detection of input sample frequencies
  • Attenuation of sampling clock jitter
  • 16-, 18-, 20-, 24-Bit data input/output
  • Audio sample rates from 8 kHz to 216 kHz
  • Input/output sampling ratios from 16:1 to 1:16
  • Group mode, where multiple ASRC blocks use the same timing loop for input or output
  • Linear phase FIR filter
  • Controllable soft mute
  • Independent clock generator, and rate and stamp generator, for each input and output clock zone
  • Separate DMA events for input and output, for each channel and group
  • High-speed serial interfaces:
  • PCI Express® 2.0 port with integrated PHY:
    • Single lane Gen2-compliant port
    • Root Complex (RC) and End Point (EP) modes
  • Up to two USB 2.0 High-Speed dual-role ports with Integrated PHYs, support:
    • Dual-role-device (DRD) Capability with:
      • USB 2.0 peripheral (or device) at
        HS (480Mbps) and FS (12Mbps) speeds
      • USB 2.0 host at HS (480Mbps),
        FS (12Mbps), and LS (1.5Mbps) speeds
      • USB 2.0 static peripheral and static host operations
    • xHCI controller with the following features:
      • Compatible to the xHCI specification (revision 1.1) in host mode
      • All modes of transfer (control, bulk, interrupt, and isochronous)
      • 15 transmit (TX), 15 receive (RX) endpoints (EPs), and one bidirectional endpoint (EP0)
  • Flash media interfaces:
  • QSPI™ with XIP and up to four chip selects, supports:
    • Memory-mapped direct mode of operation for performing FLASH data transfers and executing code from FLASH memory (XIP)
    • Supports up to 96 MHz
    • Internal SRAM buffer with ECC
    • High speed read data capture mechanism
  • Two Multimedia Card (MMC) and Secure Digital (SD) ports
    • Supports JEDEC JESD84 v4.5-A441 and SD3.0 physical layer with SDA3.00 standards
    • MMC0 supports 3.3-V I/O for:
      • SD DS and HS mode
      • eMMC mode HS-SDR
        up to 48 MHz
    • MMC1 supports 1.8-V I/O modes for eMMC, including HS-SDR and DDR at up to 48 MHz with 4- and 8-Bit bus width
  • Audio peripherals:
  • Three Multichannel Audio Serial Port (McASP) peripherals
    • Transmit and receive clocks up to 50 MHz
    • Two independent clock zones and independent transmit and receive clocks per McASP
    • Up to 16-, 10-, 6-serial data pins for McASP0, McASP1, and McASP2, respectively
    • Supports TDM, I2S, and similar formats
    • Supports DIT mode
    • Built-In FIFO buffers for optimized system traffic
  • Multichannel Buffered Serial Port (McBSP)
    • Transmit and receive clocks up to 50 MHz
    • Two clock zones and two serial-data pins
    • Supports TDM, I2S, and similar formats
  • Real-time control interfaces:
  • Six Enhanced High Resolution Pulse Width Modulation (eHRPWM) Modules, Each Counter supports:
    • Dedicated 16-Bit Time-Base with Period and Frequency Control
    • Two independent PWM outputs with single edge operation
    • Two independent PWM outputs with dual-edge symmetric operation
    • One independent PWM output with dual-edge asymmetric operation
  • Two 32-Bit Enhanced Capture Modules (eCAP):
    • Supports one capture input or one auxiliary PWM output configuration options
    • 4-Event time-stamp registers (Each 32-Bits)
    • Interrupt on either of the four events
  • Three 32-Bit Enhanced Quadrature Pulse Encoder Modules (eQEP), each supports:
    • Quadrature decoding
    • Position counter and control unit for position measurement
    • Unit time base for speed and frequency measurement
  • General connectivity:
  • Two Controller Area Network (CAN) Ports
    • Supports CAN v2.0 Part A, B (ISO 11898-1) protocol
    • Bit rates up to 1 Mbps
    • Dual clock source
    • ECC protection for message RAM
  • One Media Local Bus (MLB)
    • Supports both 3-pin (up to MOST50, 1024 × Fs) and 6-pin (up to MOST150, 2048 × Fs) versions of MediaLB® Physical layer specification v4.2
    • Supports all types of data transfer over 64 logical channels (synchronous stream, isochronous, asynchronous packet, control message)
    • Supports 3-wire MOST 150 protocol
  • Three Inter-Integrated Circuit (I2C) interfaces, each supports:
    • Standard (up to 100 kHz) and
      Fast (up to 400 kHz) modes
    • 7-Bit addressing mode
    • Supports EEPROM size up to 4Mbit
  • Four Serial Peripheral Interfaces (SPI), each supports:
    • Operates at up to 50 MHz in master mode and 25 MHz in slave mode
    • Two chip selects
  • Three UART interfaces
    • All UARTs are 16C750-compatible and operate at up to 3M baud
    • UART0 supports 8 pins with full modem control, with DSR, DTR, DCD, and RI signals
    • UART1 and UART2 are 4-pin interfaces
  • General-Purpose I/O (GPIO)
    • Up to 212 GPIOs muxed with other interfaces
    • Can be configured as interrupt pins
  • Timers and miscellaneous modules:
  • Seven 64-Bit timers:
    • Two 64-Bit timers dedicated to Arm A15 and DSP cores (one timer per core)
      • Watchdog and General-Purpose (GP)
    • Four 64-Bit timers are shared for general purposes
    • Each 64-Bit timer can be configured as two individual 32-Bit timers
    • One 64-Bit timer dedicated for PMMC
    • Two timers input/output pin pairs
  • Interprocessor communication with:
    • Message manager to facilitate multiprocessor access to the PMMC:
      • Provides hardware acceleration for pushing and popping messages to/from logical queues
      • Supports up to 64 queues and 128 messages
    • Semaphore module with up to 64 independent semaphores and 16 masters (device cores)
  • EDMA with 128 (2 × 64) channels and
    1024 (2 × 512) PaRAM entries
  • Keystone II System on Chip (SoC) architecture:
  • Security
    • Supports General-Purpose (GP) and High-Secure (HS) devices
    • Supports secure boot
    • Supports customer secondary keys
    • 4KB of One-Time Programmable (OTP) ROM for customer keys
  • Power management
    • Integrated Power Management Microcontroller (PMMC) technology
  • Supports primary boot from UART, I2C, SPI, GPMC, SD or eMMC, USB device firmware upgrade v1.1, PCIe®, and Ethernet interfaces
  • Keystone II debug architecture with integrated Arm CoreSight™ support and trace capability
  • Operating Temperature (TJ):
  • –40°C to 125°C (Industrial Extended)
  • –40°C to 105°C (Extended)
  • 0°C to 90°C (Commercial)
  • Processor cores:
  • Arm® Cortex®-A15 microprocessor unit (Arm A15) subsystem at up to 1000 MHz
    • Supports full Implementation of Armv7-A architecture instruction set
    • Integrated SIMDv2 (Arm® Neon™ Technology) and VFPv4 (Vector Floating Point)
    • 32KB of L1 program memory
    • 32KB of L1 data memory
    • 512KB of L2 memory
    • Error Correction Code (ECC) protection for L1 data memory ECC for L2 memory
    • Parity protection for L1 program memory
    • Global Timebase Counter (GTC)
      • 64-Bit free-running counter that provides timebase for Arm A15 internal timers
      • Compliant to Armv7 MPCore Architecture for Generic Timers
  • C66x fixed- and floating-point VLIW DSP subsystem at up to 1000 MHz
    • Fully object-code compatible With C67x+ and C64x+ cores
    • 32KB of L1 program memory
    • 32KB of L1 data memory
    • 1024KB of L2 configurable as L2 RAM or cache
    • Error detection for L1 program memory
    • ECC for L1 data memory
    • ECC for L2 data memory
  • Industrial subsystem:
  • Up to Two Programmable Real-Time Unit and Industrial Communication Subsystems (PRU-ICSS), each supports:
    • Two Programmable Real-Time Units (PRUs) with enhanced multiplier and accumulator, each PRU supports:
      • 16KB of program memory With ECC
      • 8KB of data memory With ECC
      • CRC32 and CRC16 hardware accelerator
      • 20 × enhanced GPIO
      • Serial Capture Unit (SCU), supporting direct connection, 16-bit parallel capture, 28-bit shift, MII_RT, EnDat 2.2 protocol and Sigma-Delta demodulation
      • Scratch pad and XFR direct connect
    • 64KB of general-purpose memory With ECC
    • One Ethernet MII_RT module with two MII ports configurable for connection with each PRU; supports multiple industrial communication protocols
    • Industrial Ethernet Peripheral (IEP) to manage and generate industrial Ethernet functions
    • Built-In Universal Asynchronous Receiver and Transmitter (UART) 16550, with a dedicated 192-MHz clock to support 12-Mbps PROFIBUS®
    • Built-In industrial Ethernet 64-Bit timer
    • Built-In enhanced capture module (eCAP)
  • Memory subsystem:
  • Multicore Shared Memory Controller (MSMC) with 1024KB of shared L2 RAM
    • Provides high-performance interconnect to internal shared SRAM and DDR EMIF for both Arm A15 and C66x Access
    • Supports Arm I/O coherency where Arm A15 is cache coherent to other system masters accessing the MSMC-SRAM or DDR EMIF
    • Supports ECC on SRAM
  • Up to 36-Bit DDR External Memory Interface (EMIF)
    • Supports DDR3L at up to 1066 MT/s
    • Supports 4-GB memory address range
    • Supports 32-Bit SDRAM data bus with 4-bit ECC
    • Supports 16-Bit and 32-Bit SDRAM data bus without ECC
  • General-Purpose Memory Controller (GPMC)
    • Flexible 8- and 16-Bit asynchronous memory interface with up to four chip selects
    • Supports NOR, Muxed-NOR, SRAM
    • Supports general-purpose memory-port expansion with the following modes:
      • Asynchronous read and write access
      • Asynchronous read page access (4-, 8-, 16-Word16)
      • Synchronous read and write access
      • Synchronous read burst access without wrap capability (4-, 8-, 16-Word16)
  • Network Subsystem (NSS):
  • Ethernet MAC (EMAC) subsystem
    • One-port Gigabit Ethernet: RMII, MII, RGMII
    • Supports 10-, 100-, 1000-Mbps full duplex
    • Supports 10-, 100-Mbps half duplex
    • Supports Ethernet Audio Video Bridging (eAVB)
    • Maximum frame size 2016 Bytes (2020 Bytes with VLAN)
    • Eight priority level QOS support (802.1p)
    • IEEE 1588v2 (2008 Annex D, Annex E, and
      Annex F) to facilitate Audio Video Bridging 802.1AS Precision Time Protocol (PTP)
    • CPTS module with timestamping support for IEEE 1588v2
    • DSCP priority mapping (IPv4 and IPv6)
    • MDIO module for PHY management
    • Enhanced statistics collection
  • Navigator Subsystem (NAVSS)
    • Built-In packet DMA controller for optimized network processing
    • Built-In Queue Manager (QM) for optimized network processing
      • Supports up to 128 queues
      • 2048 buffers supported in internal queue RAM
  • Crypto Engine (SA) supports:
    • Crypto Function Library for AES, DES, 3DES, SHA1, MD5, SHA2-224 and SHA2-256 Operations
    • Block data encryption supported through hardware cores
      • AES with 128-, 192-, and 256-Bit Key supports
      • DES and 3DES with 1, 2, or 3 Different Key support
    • Programmable Mode Control Engine (MCE)
    • Public Key Accelerator (PKA) with elliptic curve cryptography
    • Elliptic Curve Diffie–Hellman (ECDH) based key exchange and digital signature (ECDSA) applications
    • Authentication for SHA1, MD5, SHA2-224 and SHA2-256
    • Keyed HMAC operation through hardware core
    • True Random Number Generator (TRNG)
  • Display Subsystem:
  • Supports one video pipe with in-loop scaling, color space
  • Conversion and background color overlay
  • Input data format: BITMAP, RGB16, RGB24, RGB32, ARGB16, ARGB32, YUV420, YUV422, and RGB565-A8
  • Supported display interfaces:
    • MIPI® DPI 2.0 parallel interface
    • RFBI (MIPI-DBI 2.0) up to QVGA at 30fps
    • BT.656 4:2:2
    • BT.1120 4:2:2 up to 1920 × 1080 at 30fps
  • In-loop scaling capability
  • LCD interface supports:
    • Active Matrix (TFT)
    • Passive Matrix (STN)
    • Grayscale
    • TDM
    • AC Bias Control
    • Dither
    • CPR
  • Asynchronous Audio Sample Rate Converter (ASRC)
  • High performance asynchronous sample rate converter with 140 dB Signal-to-Noise (SNR)
  • Up to 8 stereo streams (16 audio channels)
  • Automatically sensing / detection of input sample frequencies
  • Attenuation of sampling clock jitter
  • 16-, 18-, 20-, 24-Bit data input/output
  • Audio sample rates from 8 kHz to 216 kHz
  • Input/output sampling ratios from 16:1 to 1:16
  • Group mode, where multiple ASRC blocks use the same timing loop for input or output
  • Linear phase FIR filter
  • Controllable soft mute
  • Independent clock generator, and rate and stamp generator, for each input and output clock zone
  • Separate DMA events for input and output, for each channel and group
  • High-speed serial interfaces:
  • PCI Express® 2.0 port with integrated PHY:
    • Single lane Gen2-compliant port
    • Root Complex (RC) and End Point (EP) modes
  • Up to two USB 2.0 High-Speed dual-role ports with Integrated PHYs, support:
    • Dual-role-device (DRD) Capability with:
      • USB 2.0 peripheral (or device) at
        HS (480Mbps) and FS (12Mbps) speeds
      • USB 2.0 host at HS (480Mbps),
        FS (12Mbps), and LS (1.5Mbps) speeds
      • USB 2.0 static peripheral and static host operations
    • xHCI controller with the following features:
      • Compatible to the xHCI specification (revision 1.1) in host mode
      • All modes of transfer (control, bulk, interrupt, and isochronous)
      • 15 transmit (TX), 15 receive (RX) endpoints (EPs), and one bidirectional endpoint (EP0)
  • Flash media interfaces:
  • QSPI™ with XIP and up to four chip selects, supports:
    • Memory-mapped direct mode of operation for performing FLASH data transfers and executing code from FLASH memory (XIP)
    • Supports up to 96 MHz
    • Internal SRAM buffer with ECC
    • High speed read data capture mechanism
  • Two Multimedia Card (MMC) and Secure Digital (SD) ports
    • Supports JEDEC JESD84 v4.5-A441 and SD3.0 physical layer with SDA3.00 standards
    • MMC0 supports 3.3-V I/O for:
      • SD DS and HS mode
      • eMMC mode HS-SDR
        up to 48 MHz
    • MMC1 supports 1.8-V I/O modes for eMMC, including HS-SDR and DDR at up to 48 MHz with 4- and 8-Bit bus width
  • Audio peripherals:
  • Three Multichannel Audio Serial Port (McASP) peripherals
    • Transmit and receive clocks up to 50 MHz
    • Two independent clock zones and independent transmit and receive clocks per McASP
    • Up to 16-, 10-, 6-serial data pins for McASP0, McASP1, and McASP2, respectively
    • Supports TDM, I2S, and similar formats
    • Supports DIT mode
    • Built-In FIFO buffers for optimized system traffic
  • Multichannel Buffered Serial Port (McBSP)
    • Transmit and receive clocks up to 50 MHz
    • Two clock zones and two serial-data pins
    • Supports TDM, I2S, and similar formats
  • Real-time control interfaces:
  • Six Enhanced High Resolution Pulse Width Modulation (eHRPWM) Modules, Each Counter supports:
    • Dedicated 16-Bit Time-Base with Period and Frequency Control
    • Two independent PWM outputs with single edge operation
    • Two independent PWM outputs with dual-edge symmetric operation
    • One independent PWM output with dual-edge asymmetric operation
  • Two 32-Bit Enhanced Capture Modules (eCAP):
    • Supports one capture input or one auxiliary PWM output configuration options
    • 4-Event time-stamp registers (Each 32-Bits)
    • Interrupt on either of the four events
  • Three 32-Bit Enhanced Quadrature Pulse Encoder Modules (eQEP), each supports:
    • Quadrature decoding
    • Position counter and control unit for position measurement
    • Unit time base for speed and frequency measurement
  • General connectivity:
  • Two Controller Area Network (CAN) Ports
    • Supports CAN v2.0 Part A, B (ISO 11898-1) protocol
    • Bit rates up to 1 Mbps
    • Dual clock source
    • ECC protection for message RAM
  • One Media Local Bus (MLB)
    • Supports both 3-pin (up to MOST50, 1024 × Fs) and 6-pin (up to MOST150, 2048 × Fs) versions of MediaLB® Physical layer specification v4.2
    • Supports all types of data transfer over 64 logical channels (synchronous stream, isochronous, asynchronous packet, control message)
    • Supports 3-wire MOST 150 protocol
  • Three Inter-Integrated Circuit (I2C) interfaces, each supports:
    • Standard (up to 100 kHz) and
      Fast (up to 400 kHz) modes
    • 7-Bit addressing mode
    • Supports EEPROM size up to 4Mbit
  • Four Serial Peripheral Interfaces (SPI), each supports:
    • Operates at up to 50 MHz in master mode and 25 MHz in slave mode
    • Two chip selects
  • Three UART interfaces
    • All UARTs are 16C750-compatible and operate at up to 3M baud
    • UART0 supports 8 pins with full modem control, with DSR, DTR, DCD, and RI signals
    • UART1 and UART2 are 4-pin interfaces
  • General-Purpose I/O (GPIO)
    • Up to 212 GPIOs muxed with other interfaces
    • Can be configured as interrupt pins
  • Timers and miscellaneous modules:
  • Seven 64-Bit timers:
    • Two 64-Bit timers dedicated to Arm A15 and DSP cores (one timer per core)
      • Watchdog and General-Purpose (GP)
    • Four 64-Bit timers are shared for general purposes
    • Each 64-Bit timer can be configured as two individual 32-Bit timers
    • One 64-Bit timer dedicated for PMMC
    • Two timers input/output pin pairs
  • Interprocessor communication with:
    • Message manager to facilitate multiprocessor access to the PMMC:
      • Provides hardware acceleration for pushing and popping messages to/from logical queues
      • Supports up to 64 queues and 128 messages
    • Semaphore module with up to 64 independent semaphores and 16 masters (device cores)
  • EDMA with 128 (2 × 64) channels and
    1024 (2 × 512) PaRAM entries
  • Keystone II System on Chip (SoC) architecture:
  • Security
    • Supports General-Purpose (GP) and High-Secure (HS) devices
    • Supports secure boot
    • Supports customer secondary keys
    • 4KB of One-Time Programmable (OTP) ROM for customer keys
  • Power management
    • Integrated Power Management Microcontroller (PMMC) technology
  • Supports primary boot from UART, I2C, SPI, GPMC, SD or eMMC, USB device firmware upgrade v1.1, PCIe®, and Ethernet interfaces
  • Keystone II debug architecture with integrated Arm CoreSight™ support and trace capability
  • Operating Temperature (TJ):
  • –40°C to 125°C (Industrial Extended)
  • –40°C to 105°C (Extended)
  • 0°C to 90°C (Commercial)

66AK2G1x is a family of heterogeneous multicore System-on-Chip (SoC) devices based on TI’s field-proven Keystone II (KS2) architecture. These devices address applications that require both DSP and Arm performance, with integration of high-speed peripheral and memory interfaces, hardware acceleration for network and cryptography functions, and high-level operating systems (HLOS) support.

Similar to existing KS2-based SoC devices, the 66AK2G1x enables both the DSP and Arm cores to master all memory and peripherals in the system. This architecture facilitates maximum software flexibility where either DSP- or Arm-centric system designs can be achieved.

The 66AK2G1x significantly improves device reliability by extensively implementing error correction code (ECC) in processor cores, shared memory, embedded memory in modules, and external memory interfaces. Full analysis of soft error rate (SER) and power-on-hours (POH) shows that the designated 66AK2G1x parts satisfy a wide range of industrial requirements.

Accompanied by the new Processor SDK, the 66AK2G1x development platform enables unprecedented ease-of-use with main line open source Linux, Code Composer Studio™ (CCS) - Integrated Development Environment (IDE), a wide range of OS-independent device drivers, as well as TI-RTOS that enables seamless task management across processor cores. The device also features advanced debug and trace technology with the latest innovations from TI and Arm, such as system trace and seamless integration of the Arm CoreSight components.

Secure boot can also be made available for anticloning and illegal software update protection. For more information about secure boot, contact your TI sales representative.

66AK2G1x is a family of heterogeneous multicore System-on-Chip (SoC) devices based on TI’s field-proven Keystone II (KS2) architecture. These devices address applications that require both DSP and Arm performance, with integration of high-speed peripheral and memory interfaces, hardware acceleration for network and cryptography functions, and high-level operating systems (HLOS) support.

Similar to existing KS2-based SoC devices, the 66AK2G1x enables both the DSP and Arm cores to master all memory and peripherals in the system. This architecture facilitates maximum software flexibility where either DSP- or Arm-centric system designs can be achieved.

The 66AK2G1x significantly improves device reliability by extensively implementing error correction code (ECC) in processor cores, shared memory, embedded memory in modules, and external memory interfaces. Full analysis of soft error rate (SER) and power-on-hours (POH) shows that the designated 66AK2G1x parts satisfy a wide range of industrial requirements.

Accompanied by the new Processor SDK, the 66AK2G1x development platform enables unprecedented ease-of-use with main line open source Linux, Code Composer Studio™ (CCS) - Integrated Development Environment (IDE), a wide range of OS-independent device drivers, as well as TI-RTOS that enables seamless task management across processor cores. The device also features advanced debug and trace technology with the latest innovations from TI and Arm, such as system trace and seamless integration of the Arm CoreSight components.

Secure boot can also be made available for anticloning and illegal software update protection. For more information about secure boot, contact your TI sales representative.

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TI 仅为使用此产品的现有工程提供有限的设计支持。如可用,您将在此页面找到相关的配套资料、工具和软件。TI 仅为使用此产品的现有设计提供有限的设计支持。在 TI E2E™ 支持论坛申请有限的设计支持。

技术文档

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顶层文档 类型 标题 格式选项 下载最新的英语版本 日期
* 数据表 66AK2G1x Multicore DSP+Arm KeyStone II System-on-Chip (SoC) 数据表 (Rev. F) PDF | HTML 2019-12-10
* 用户指南 66AK2Gx Multicore DSP + ARM Keystone II System-on-Chip (SOC) TRM (Rev. I) 2019-2-25
* 用户指南 K2G General Purpose Evaluation Module (EVMK2G) TRM (Rev. A) 2017-9-20
* 勘误表 66AK2G1x Errata (Rev. B) 2018-6-20
应用手册 TI 处理器和 MCU 上支持的工业通信协议 (Rev. F) PDF | HTML 英语版 (Rev.F) PDF | HTML 2025-9-22
应用手册 高速接口布局指南 (Rev. J) PDF | HTML 英语版 (Rev.J) PDF | HTML 2023-3-23
应用手册 PRU-ICSS Feature Comparison. (Rev. G) PDF | HTML 英语版 (Rev.G) PDF | HTML 2022-10-12
应用手册 DDR3 Design Requirements for KeyStone Devices (Rev. D) PDF | HTML 2022-7-7
应用手册 KeyStone 错误检测和校正 (Rev. A) PDF | HTML 英语版 (Rev.A) 2021-8-4
应用手册 如何将 CCS 3.x 工程迁移至最新的 Code Composer Studio™ (CCS) (Rev. A) 英语版 (Rev.A) PDF | HTML 2021-5-19
应用手册 Using DSPLIB FFT Implementation for Real Input and Without Data Scaling PDF | HTML 2019-6-11
应用手册 KeyStone II DDR3 interface bring-up PDF | HTML 2019-3-7
设计指南 用于在基于 66AK2Gx 的系统中提高存储器可靠性的 DDR ECC 参考设计 (Rev. B) 英语版 (Rev.B) 2018-7-5
白皮书 Designing professional audio mixers for every scenario 2018-6-28
应用手册 66AK2G1x: EVMK2GX General-Purpose EVM Power Distribution Network Analysis 2018-3-14
用户指南 PRU Assembly Instruction User Guide 2018-2-16
应用手册 66AK2G12 Power Consumption Summary 2018-2-9
应用手册 66AK2G12 Power Estimation Tool 2018-1-19
用户指南 TPS65911A User’s Guide for 66AK2G12 Processor (Rev. A) 2017-12-18
用户指南 66AK2Gx BGA Escape Routing Stackup (Rev. A) 2017-11-14
用户指南 66AK2Gx Hardware Design Guide (Rev. A) 2017-11-14
应用手册 66AK2Gx Schematic Checklist (Rev. A) 2017-11-14
白皮书 Designing Embedded Systems for High Reliability With 66AK2Gx (Rev. A) 2017-8-28
白皮书 Getting personal with the 66AK2Gx SoC (Rev. A) 2017-8-2
更多文献资料 K2G General-Purpose (GP) EVM Quick Start Guide (Rev. A) 2017-7-27
白皮书 Voice as the user interface – a new era in speech processing white Paper 2017-5-9
应用手册 Processor SDK RTOS Audio Benchmark Starter Kit 2017-4-12
用户指南 K2G Industrial Communications Engine (K2G ICE) 2017-2-28
更多文献资料 K2G Industrial Communications Engine (ICE) Quick Start Guide 2017-2-2
用户指南 TPS659118 User’s Guide for 66AK2G02 Processor 2016-5-2
应用手册 SERDES Link Commissioning on KeyStone I and II Devices 2016-4-13
更多文献资料 K2G Audio Daughter Card Quick Start Guide 2016-3-14
白皮书 Multicore SoCs stay a step ahead of SoC FPGAs 2016-2-23
应用手册 TI DSP Benchmarking PDF | HTML 2016-1-13
应用手册 Keystone II DDR3 Debug Guide 2015-10-16
应用手册 Keystone II DDR3 Initialization 2015-1-26
应用手册 Hardware Design Guide for KeyStone II Devices 2014-3-24
用户指南 C66x CorePac User's Guide (Rev. C) 2013-6-28
应用手册 Introduction to TMS320C6000 DSP Optimization 2011-10-6
白皮书 Software and Hardware Design Challenges Due to Dynamic Raw NAND Market 2011-5-19
用户指南 C66x CPU and Instruction Set Reference Guide 2010-11-9
用户指南 C66x DSP Cache User's Guide 2010-11-9

设计与开发

如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。

开发套件

EVMK2GX — 66AK2Gx 1GHz 评估模块

EVMK2GX(也称为“K2G”)1GHz 评估模块 (EVM) 支持开发人员立即开始评估 66AK2Gx 处理器系列,并且加速开发音频、工业电机控制、智能电网保护和其他高可靠性实时计算密集型应用。66AK2Gx 与基于 KeyStone 的现有 SoC 器件类似,支持 DSP 和 Arm® 内核控制系统中的所有内存和外设。此架构有助于更大限度地提高软件灵活性,并可以在其中实现以 DSP 或 Arm 为中心的系统设计。

该 EVM 由 Linux 和 TI-RTOS 操作系统的处理器 SDK 支持,且具有 USB、PCIe 和千兆位以太网等关键外设。它包含板管理控制器、SD 卡插槽和板载 (...)

支持的产品和硬件
有库存
限制:
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无货
子卡

AUDK2G — 66AK2Gx (K2G) 音频子卡

K2G 音频子卡专为与 K2G 通用 EVM (EVMK2G) 或 EVMK2GX 配合使用而设计,音频子卡的运行需要 EVMK2G 或 EVMK2GX。  该子卡允许用户开发多通道音频应用,如基于 66AKG2G02 DSP + Arm® 处理器 SoC 的 A/V 接收器、音箱、汽车功放系统和调音台。

支持的产品和硬件
有库存
限制:
??asset.out-of-stock-ti_zh_CN??
无货
软件开发套件 (SDK)

PROCESSOR-SDK-LINUX-K2G — 适用于 K2Gx 的 Linux 处理器 SDK

Processor SDK(软件开发套件)是统一的软件平台,适用于 TI 嵌入式处理器,设置简单,提供开箱即用的快速基准测试和演示。Processor SDK 的所有版本在 TI 的广泛产品系列中保持一致,让开发人员可以无缝地在多种器件之间重用和迁移软件。借助 Processor SDK 和 TI 的嵌入式处理器解决方案,开发可扩展平台解决方案从未如此简单。

处理器 SDK 包括对 Linux 和 TI-RTOS 操作系统的支持。

Linux 亮点:

  • 长期稳定 (LTS) 主线 Linux 内核支持
  • U-Boot 引导加载程序支持
  • Linaro GNU Compiler Collection (...)
支持的产品和硬件
软件开发套件 (SDK)

PROCESSOR-SDK-LINUX-RT-K2G — 适用于 K2G 的 Linux-RT 处理器 SDK

Processor SDK(软件开发套件)是统一的软件平台,适用于 TI 嵌入式处理器,设置简单,提供开箱即用的快速基准测试和演示。Processor SDK 的所有版本在 TI 的广泛产品系列中保持一致,让开发人员可以无缝地在多种器件之间重用和迁移软件。借助 Processor SDK 和 TI 的嵌入式处理器解决方案,开发可扩展平台解决方案从未如此简单。

处理器 SDK 包括对 Linux 和 TI-RTOS 操作系统的支持。

Linux 亮点:

  • 长期稳定 (LTS) 主线 Linux 内核支持
  • U-Boot 引导加载程序支持
  • Linaro GNU Compiler Collection (...)
支持的产品和硬件
软件开发套件 (SDK)

PROCESSOR-SDK-RTOS-K2G — 适用于 K2Gx 的 RTOS 处理器 SDK

Processor SDK(软件开发套件)是统一的软件平台,适用于 TI 嵌入式处理器,设置简单,提供开箱即用的快速基准测试和演示。Processor SDK 的所有版本在 TI 的广泛产品系列中保持一致,让开发人员可以无缝地在多种器件之间重用和迁移软件。借助 Processor SDK 和 TI 的嵌入式处理器解决方案,开发可扩展平台解决方案从未如此简单。

处理器 SDK 包括对 Linux 和 TI-RTOS 操作系统的支持。

Linux 亮点:

  • 长期稳定 (LTS) 主线 Linux 内核支持
  • U-Boot 引导加载程序支持
  • Linaro GNU Compiler Collection (...)
支持的产品和硬件
IDE、配置、编译器或调试器

CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)

CCStudio™ IDE is part of TI's extensive CCStudio™ development ecosystem and is an integrated development environment for TI's microcontrollers, processors, wireless connectivity devices, and radar sensors. CCStudio IDE is available as desktop or cloud-based applications. The cloud version (...)

支持的产品和硬件
驱动程序或库

AEC-AER — 用于 TI C64x+、C674x、C55x 和 Cortex(tm)A8 处理器的回声抵消/消除 - 即刻可得

Voice Library - VoLIB provides components that, together, facilitate the development of the signal processing chain for Voice over IP applications such as infrastructure, enterprise, residential gateways and IP phones. Together with optimized implementations of ITU-T voice codecs, that can be (...)

支持的产品和硬件
驱动程序或库

FAXLIB — 用于 C66x、C64x+ 和 C55x 处理器的传真库 (FAXLIB)

Voice Library - VoLIB provides components that, together, facilitate the development of the signal processing chain for Voice over IP applications such as infrastructure, enterprise, residential gateways and IP phones. Together with optimized implementations of ITU-T voice codecs, that can be (...)

支持的产品和硬件
驱动程序或库

PRU-ICSS-INDUSTRIAL-SW — 适用于 Sitara™ 处理器的 PRU-ICSS 工业软件

PRU-ICSS 协议支持 TI Sitara 处理器进行实时工业通信。  PRU-ICSS 协议旨在用于 TI 的统一软件开发平台 Processor-SDK-RTOS,协议包含经优化的 PRU-ICSS 固件、适用于 ARM 处理器的相应 PRU-ICSS 驱动程序和示例应用。PRU-ICSS 固件在 PRU 内核上运行,从而减少了运行 TI-RTOS 的 ARM 主处理器上时间关键型链路层处理的负载。PRU-ICSS 驱动程序提供对 PRU-ICSS 资源的简单访问,可轻松与 ARM 内核上运行的协议栈和应用软件集成。  示例进一步演示了如何将低级固件与协议栈和应用软件集成。

(...)

支持的产品和硬件
驱动程序或库

VOLIB — 用于 C66x、C64x+ 和 C55x 处理器的音频库 (VoLIB)

Voice Library - VoLIB provides components that, together, facilitate the development of the signal processing chain for Voice over IP applications such as infrastructure, enterprise, residential gateways and IP phones. Together with optimized implementations of ITU-T voice codecs, that can be (...)

支持的产品和硬件
软件编解码器

AURO-3P-3DENGINE — Auro Technologies, Auro-3D Engine with Auro-Codec Decoder and Auro-Matic up-mixing

Auro Technologies’ Auro-Engine includes their Auro-Codec and Auro-Matic elements for real time audio stream encoding and up mixing affording 3D audio user experiences. The Auro-Codec and Auro-Matic algorithms have been ported to select TI C6x DSPs.
支持的产品和硬件
仿真模型

66AK2G12 BSDL Model

SPRM715.ZIP (24 KB) - BSDL 模型
支持的产品和硬件
仿真模型

66AK2G12 IBIS Model

SPRM705.ZIP (1918 KB) - IBIS 模型
支持的产品和硬件
仿真模型

66AK2G12 Thermal Model

SPRM716.ZIP (3 KB) - 热模型
支持的产品和硬件
仿真模型

KeyStone II IBIS AMI Models

SPRM743.ZIP (265889 KB) - IBIS-AMI 模型
lock = 需要出口许可(1 分钟)
支持的产品和硬件
计算工具

CLOCKTREETOOL — Clock Tree Tool for Sitara™ ARM® Processors

The Clock Tree Tool (CTT) for Sitara™ ARM®, Automotive, and Digital Signal Processors is an interactive clock tree configuration software that provides information about the clocks and modules in these TI devices. It allows the user to:

  • Visualize the device clock tree
  • Interact with clock tree (...)
支持的产品和硬件
参考设计

TIDEP-0088 — 适用于语音应用的音频预处理系统参考设计

此参考设计采用多个麦克风、一个波束形成算法和其他处理器,可在噪声和其他杂波中提取清晰的语音和音频。  对于语音激活数字助理,在易产生噪音的环境中使用的应用数量快速增长,由此产生了对可以从嘈杂环境中提取清晰语音的系统的需求。  参考设计采用麦克风阵列和精密的信号处理技术,可从嘈杂的环境中提取出清晰的音频。
支持的产品和硬件
参考设计

TIDEP0067 — 66AK2Gx DSP + ARM 处理器电源解决方案参考设计

此参考设计基于 66AK2Gx 多内核片上系统 (SoC) 处理器和配套 TPS65911 电源管理集成电路 (PMIC),该电路在单个器件中包含适用于 66AK2Gx 处理器的电源和电源定序。该电源解决方案的设计还包含支持 12V 输入的第一级降压转换器和 DDR3L 存储器的 DDR 终端稳压器。该参考设计经过了测试、包括硬件参考 (EVM)、软件(处理器 SDK)和测试数据。
支持的产品和硬件
参考设计

TIDEP0068 — 适用于 K2G 通用 EVM (GP EVM) 的 PCI Express PCB 设计注意事项参考设计

PCI-Express 提供低引脚数、高可靠性和高速特性,数据传输速率高达每通道、每方向 5.0Gbps,并且 TI 66AK2Gx DSP + ARM 处理器片上系统 (SoC) 包含 PCIe 模块。  此 PCIe PCB 设计注意事项参考设计可为 66AK2Gx 处理器 SoC 的 PCIe 部分提供最佳实践 PCB,从而帮助开发人员优化印刷电路板 (PCB) 设计。  这反过来又使开发人员能够在第一次 PCB 实现过程中实现所需的 PCIe 信号性能,从而快速专注于基于 K2G 处理器的应用开发和测试。  66AK2Gx 通用 EVM (EVMK2G) (...)

支持的产品和硬件
参考设计

TIDEP0069 — 66AK2Gx DSP + ARM 处理器音频处理参考设计

此参考设计是基于 66AK2Gx DSP + ARM 处理器片上系统 (SoC) 和配套 AIC3106 音频编解码器的参考平台,可实现音频处理算法设计和演示的捷径。该音频解决方案设计包括实时应用软件,使用在 DSP 上演示音频处理块的处理器 SDK TI RTOS 软件以添加音效。 
支持的产品和硬件
参考设计

TIDEP0070 — 用于提高 66AK2Gx 系统中存储器可靠性的 DDR ECC 参考设计

该参考设计基于 66AK2Gx 多核 DSP + ARM 处理器片上系统 (SoC),介绍了在高可靠性应用中有关支持错误校正码 (ECC) 的双通道数据速率 (DDR) 存储器接口的系统考虑事项。  它允许开发人员通过讨论系统接口、电路板硬件、软件、吞吐量性能和诊断程序,快速实施基于高可靠性解决方案。
支持的产品和硬件
封装 引脚 CAD 符号、封装和 3D 模型
FCCSP (ABY) 625 Ultra Librarian

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