LMG2100R026

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100V 2.6mΩ 半桥氮化镓 (GaN) 功率级

产品详情

VDS (max) (V) 100 RDS(on) (mΩ) 2.6 ID (max) (A) 55 Features Built-in bootstrap diode, Half-bridge, Top-side cooled Rating Catalog Operating temperature range (°C) -40 to 125
VDS (max) (V) 100 RDS(on) (mΩ) 2.6 ID (max) (A) 55 Features Built-in bootstrap diode, Half-bridge, Top-side cooled Rating Catalog Operating temperature range (°C) -40 to 125
UNKNOWN (VBN) 16 See data sheet VQFN-FCRLF (VBN) 18 31.5 mm² 7 x 4.5
  • Integrated half-bridge GaN FETs and driver
  • 93V continuous, 100V pulsed voltage rating
  • Package optimized for easy PCB layout
  • High slew rate switching with low ringing
  • 5V external bias power supply
  • Supports 3.3V and 5V input logic levels
  • Gate driver capable of up to 10MHz switching
  • Excellent propagation delay (33ns typical) and matching (2ns typical)
  • Internal bootstrap supply voltage clamping to prevent GaN FET overdrive
  • Supply rail undervoltage for lockout protection
  • Low power consumption
  • Exposed top QFN package for top-side cooling
  • Large GND pad for bottom-side cooling
  • Integrated half-bridge GaN FETs and driver
  • 93V continuous, 100V pulsed voltage rating
  • Package optimized for easy PCB layout
  • High slew rate switching with low ringing
  • 5V external bias power supply
  • Supports 3.3V and 5V input logic levels
  • Gate driver capable of up to 10MHz switching
  • Excellent propagation delay (33ns typical) and matching (2ns typical)
  • Internal bootstrap supply voltage clamping to prevent GaN FET overdrive
  • Supply rail undervoltage for lockout protection
  • Low power consumption
  • Exposed top QFN package for top-side cooling
  • Large GND pad for bottom-side cooling

The LMG2100R026 device is a 93V continuous, 100V pulsed, 53A half-bridge power stage, with integrated gate-driver and enhancement-mode Gallium Nitride (GaN) FETs. The device consists of two GaN FETs driven by one high-frequency GaN FET driver in a half-bridge configuration.

GaN FETs provide significant advantages for power conversion as they have zero reverse recovery and very small input capacitance CISS and output capacitance COSS. The driver and the two GaN FETs are mounted on a completely bond-wire free package platform with minimized package parasitic elements. The LMG2100R026 device is available in a 7.0mm × 4.5mm × 0.89mm lead-free package and can be easily mounted on PCBs.

The TTL logic compatible inputs can support 3.3V and 5V logic levels regardless of the VCC voltage. The proprietary bootstrap voltage clamping technique ensures the gate voltages of the enhancement mode GaN FETs are within a safe operating range.

The device extends advantages of discrete GaN FETs by offering a more user-friendly interface. It is an ideal solution for applications requiring high-frequency, high-efficiency operation in a small form factor.

The LMG2100R026 device is a 93V continuous, 100V pulsed, 53A half-bridge power stage, with integrated gate-driver and enhancement-mode Gallium Nitride (GaN) FETs. The device consists of two GaN FETs driven by one high-frequency GaN FET driver in a half-bridge configuration.

GaN FETs provide significant advantages for power conversion as they have zero reverse recovery and very small input capacitance CISS and output capacitance COSS. The driver and the two GaN FETs are mounted on a completely bond-wire free package platform with minimized package parasitic elements. The LMG2100R026 device is available in a 7.0mm × 4.5mm × 0.89mm lead-free package and can be easily mounted on PCBs.

The TTL logic compatible inputs can support 3.3V and 5V logic levels regardless of the VCC voltage. The proprietary bootstrap voltage clamping technique ensures the gate voltages of the enhancement mode GaN FETs are within a safe operating range.

The device extends advantages of discrete GaN FETs by offering a more user-friendly interface. It is an ideal solution for applications requiring high-frequency, high-efficiency operation in a small form factor.

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类型 标题 下载最新的英语版本 日期
* 数据表 LMG2100R026 100V, 53A GaN Half-Bridge Power Stage 数据表 (Rev. A) PDF | HTML 2024年 10月 11日
EVM 用户指南 LMG2100R026 评估模块 PDF | HTML 英语版 PDF | HTML 2024年 8月 12日

设计和开发

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评估板

LMG2100EVM-097 — LMG2100R026 评估模块

LMG2100EVM-097 是一款具有外部 PWM 信号且易于使用的紧凑型功率级。该电路板可配置为降压转换器、升压转换器或其他使用半桥的转换器拓扑。该评估模块具有一个 LMG2100R026 半桥电源模块,该模块具有两个由 90V GaN FET 半桥栅极驱动器驱动的 100V、2.6mΩ GaN FET。
用户指南: PDF | HTML
英语版: PDF | HTML
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计算工具

LMGXX-GAN-LLC-CALC GaN LLC resonant converter device loss calculator

Device Loss Calculator can be used to evaluate different devices for different topologies of the LLC Resonant Converter
支持的产品和硬件

支持的产品和硬件

产品
氮化镓 (GaN) 功率级
LMG2100R026 100V 2.6mΩ 半桥氮化镓 (GaN) 功率级 LMG2100R044 具有集成驱动器和保护功能的 100V 4.4mΩ 半桥 GaN FET LMG2610 具有集成驱动器、保护和电流检测功能且适用于 ACF 的 650V 170/248mΩ GaN 半桥 LMG2650 具有集成驱动器、保护和电流检测功能的 650V、95mΩ GaN 半桥 LMG3410R050 具有集成驱动器和保护功能的 600V 50mΩ GaN LMG3410R070 具有集成驱动器和保护功能的 600V 70mΩ GaN LMG3410R150 具有集成驱动器和过流保护功能的 600V 150mΩ GaN LMG3411R050 具有集成驱动器和逐周期过流保护功能的 600V 50mΩ GaN LMG3411R070 具有集成驱动器和逐周期过流保护功能的 600V 70mΩ GaN LMG3411R150 具有集成驱动器和逐周期过流保护功能的 600V 150mΩ GaN LMG3422R030 具有集成驱动器、保护和温度报告功能的 600V 30mΩ GaN FET LMG3422R050 具有集成驱动器、保护和温度报告功能的 600V 50mΩ GaN FET LMG3425R030 具有集成驱动器、保护和温度报告功能以及理想二极管模式的 600V 30mΩ GaN FET LMG3425R050 具有集成驱动器、保护和温度报告功能以及理想二极管模式的 600V 50mΩ GaN FET LMG3426R030 具有集成驱动器、保护和零电压检测功能的 600V 30mΩ GaN FET LMG3426R050 具有集成驱动器、保护和零电压检测功能的 600V 50mΩ GaN FET LMG3427R030 具有集成驱动器、保护和零电压检测功能的 600V 30mΩ GaN FET LMG3522R030 具有集成驱动器、保护和温度报告功能的 650V 30mΩ GaN FET LMG3522R030-Q1 具有集成驱动器、保护和温度报告功能的汽车类 650V 30mΩ GaN FET LMG3522R050 具有集成驱动器、保护和温度报告功能的 650V 50mΩ GaN FET LMG3526R030 具有集成驱动器、保护和零电压检测功能的 650V 30mΩ GaN FET LMG3526R050 具有集成驱动器、保护和零电压检测报告功能的 650V 50mΩ GaN FET LMG5200 80V GaN 半桥功率级
参考设计

TIDA-010949 — 基于 GaN 且具有有线和无线通信功能的 600W 太阳能电源优化器参考设计

此参考设计是一款太阳能电源优化器,可支持高达 80V 的输入电压和 80V 的输出电压,提供高达 18A 的输出和输入电流。该设计使用可配置的四开关降压/升压转换器将电池板电流升压或降压至串电流。旁路电路使用基于智能二极管控制器的设计。

此参考设计包含电力线通信 (PLC),还提供无线通信功能。数字控制和通信均在单个 C2000™ 微控制器 (MCU) 中实现。

设计指南: PDF
封装 引脚 CAD 符号、封装和 3D 模型
UNKNOWN (VBN) 16 Ultra Librarian
VQFN-FCRLF (VBN) 18 Ultra Librarian

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

支持和培训

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