ZHCSNF1 February 2021 BQ25960
PRODUCTION DATA
THERMAL METRIC(1) | BQ25960 | UNIT | |
---|---|---|---|
YBG (DSBGA) | |||
36 PINS | |||
RθJA | Junction-to-ambient thermal resistance (JEDEC(1)) | 54.8 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 0.2 | °C/W |
RθJB | Junction-to-board thermal resistance | 12 | °C/W |
ΨJT | Junction-to-top characterization parameter | 0.1 | °C/W |
ΨJB | Junction-to-board characterization parameter | 11.9 | °C/W |