ZHCSPK7F November   2004  – January 2022 TPS2384

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 PMM Faults
      2. 8.3.2 Watchdog Timer
    4. 8.4 Device Functional Modes
      1. 8.4.1  Auto Mode
      2. 8.4.2  Auto Mode Functional Description
        1. 8.4.2.1 AM Discovery
        2. 8.4.2.2 AM Classification
        3. 8.4.2.3 AM Power Delivery
      3. 8.4.3  AM Faults and INTB Output
      4. 8.4.4  Over and Undervoltage Fault
      5. 8.4.5  Over Current or Current Limit Faults
      6. 8.4.6  Undercurrent Fault (DC Modulated Disconnect)
      7. 8.4.7  Power Management Mode (PMM)
        1. 8.4.7.1 13 PMM Functions
      8. 8.4.8  PMM Discovery 1
      9. 8.4.9  PMM Discovery 2
      10. 8.4.10 PMM Classification
      11. 8.4.11 PMM Legacy
      12. 8.4.12 PMM Rup Pwr
      13. 8.4.13 PMM RDWN
    5. 8.5 Programming
      1. 8.5.1 I2C Interface Description
      2. 8.5.2 Start and Stop
      3. 8.5.3 Chip Address
      4. 8.5.4 Chip Addressing
      5. 8.5.5 Data Write Cycle
      6. 8.5.6 Port and Register Cycle
      7. 8.5.7 Data Read Cycle
    6. 8.6 Register Maps
      1. 8.6.1 Register/Port Addressing Map
      2. 8.6.2 Common Read, Register Select
      3. 8.6.3 Common Write, Register Select = 1111 (Test Register)
      4. 8.6.4 Common Control Write, Register Select = 0001
      5. 8.6.5 Port Control Write 1, Register Select = 0010 (One Per Port)
      6. 8.6.6 Port Control Write 2, Register Select = 0011 (One Per Port)
      7. 8.6.7 Port Status Read 1, Register Select = 0100 (One Per Port)
      8. 8.6.8 Port Status Read 2, Register Select = 0101 (One Per Port)
      9. 8.6.9 A/D Results Registers (Discovery Current, Voltage, Current and Temperature)
        1. 8.6.9.1 Discovery Current — Lower Bits, Register Select = 0110 (One Per Port)
        2. 8.6.9.2 Discovery Current — Upper Bits, Register Select = 0111 (One Per Port)
        3. 8.6.9.3 Voltage — Lower Bits, Register Select = 1000 (One Per Port)
        4. 8.6.9.4 Voltage — Upper Bits, Register Select = 1001 (One Per Port)
        5. 8.6.9.5 Current — Lower Bits, Register Select = 1010 (One Per Port)
        6. 8.6.9.6 Current — Upper Bits, Register Select = 1011 (One Per Port)
        7. 8.6.9.7 Temperature — Lower Bits, Register Select = 1100 (One Per Port)
        8. 8.6.9.8 Temperature — Upper Bits, Register Select = 1101 (One Per Port)
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 AC Disconnect Drive Circuit Detail
      2. 9.1.2 Connection of Unused Ports and Pins
      3. 9.1.3 Opto-isolator Interface
      4. 9.1.4 Port Protection from Electrical Transients
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Power Pin Bypass Capacitors
        2. 9.2.2.2 Per Port Components
        3. 9.2.2.3 Bias and Timing
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Local Circuits
      2. 11.1.2 System Protection Circuits
    2. 11.2 Layout Example
    3. 11.3 Thermal Consideration
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

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Pin Configuration and Functions

GUID-543A5D83-DDB7-476F-810F-B077F1C87F16-low.gif
NIC = No internal connection. Pins are floating.
NIC pins can be tied to the ground plane for improved thermal characteristics and to prevent noise injection from unused pins.
NIC pins next to CINT pins must be tied to ground to prevent noise injection into A/D converter.
Figure 5-1 PAP Package64-Pin HTQFPTop View
GUID-44FDEB62-6207-4BEB-BC3F-59964E5DAE61-low.gif
NIC = No internal connection. Pins are floating.
NIC pins can be tied to the ground plane for improved thermal characteristics and to prevent noise injection from unused pins.
NIC pins next to CINT pins must be tied to ground to prevent noise injection into A/D converter.
Figure 5-2 PJD Package64-Pin HTQFPTop View
Table 5-1 Pin Functions
PINI/ODESCRIPTION
NAMENO.
PAPPDJ
Power and Ground
V48605I48-V input to the device. This supply can have a range of 44 to 57 V. This pin must be decoupled with a 0.1-μF capacitor from V48 to AG1 placed as close to the device as possible.
V10587O10-V analog supply. The 10-V reference is generated internally and connects to the main internal analog power bus. A 0.1-μF de-coupling capacitor must terminate as close to this node and the AG1 pin as possible. Do not use for an external supply.
V6.3596O6.3-V analog supply. A 0.1-μF de-coupling capacitor must terminate as close to this pin and the AG1 pin as possible. Do not use for an external supply.
V3.32441O3.3-V logic supply. The 3.3-V supply is generated internally and connects to the internal logic power bus. A 0.1-μF de-coupling capacitor must terminate as close to this node and the DG pin as possible. This output can be used as a low current supply to external logic.
V2.55411O2.5-V reference supply. The V2.5 is generated internally and connects to the internal reference power bus. This pin must not be tied to any external supplies. A 0.1-μF de-coupling capacitor must terminate as close to this node and the RG pin as possible. Do not use for an external supply.
AG1578GNDAnalog ground 1. This is the analog ground of the V6.3, V10 and V48 power systems. This pin must be externally tied to the common copper 48-V return plane. This pin must carry the low side of three de-coupling capacitors tied to V48, V10 and V6.3.
AG2614GNDAnalog ground 2. This pin is the analog ground which ties to the substrate and ESD structures of the device. this pin must be externally tied to the common copper 48-V return plane. AG1 and AG2 must be tied together directly for the best noise immunity.
DG2342GNDDigital ground. This pin connects to the internal logic ground bus. this pin must be externally tied to the common copper 48-V return plane.
RG569GNDReference ground. This pin is a precision sense of the external ground plane. The integration capacitor (CINT) and the biasing resistor (RBIAS pin) must be tied to this ground. This ground must also be used to form a printed wiring board ground guard ring around the active node of the integration capacitor (CINT). It must tie to common copper 48-V return plane.
Port Analog Signal
P1758IPort Positive. 48-V load sense pin. Terminal voltage is monitored and controlled differentially with respect to each Port N pin. Optionally, if the application warrants, this high-side path can be protected with the use of a self-resetting poly fuse.
P21055I
P33926I
P44223I
N1659IPort negative. 48-V load return pin. The low side of the load is switched and protected by internal circuitry that limits the current.
N21154I
N33827I
N44322I
RET1560I48-V return pin
RET21253I
RET33728I
RET44421I
CINT1461IIntegration capacitor This capacitor is used for the ramp A/D converter signal integration. Connect A 0.027- μF capacitor from this pin to RG. To minimize errors use a polycarbonate, poly-polypropylene, polystyrene or teflon capacitor type to prevent leakage. Other types of capacitors can be used with increased conversion error.
CINT21352I
CINT33629I
CINT44520I
Analog Signals
CT5312IThis is a dual-purpose pin. When tied to an external capacitor this pin sets the internal clock. When the CT pin is grounded the SYN pin turns from a output to an input (see SYN pin description).
The timing capacitor and the resistor on the RBIAS pin sets the internal clock frequency of the device. This internal clock is used for the internal state machine, integrating A/D counters, POR time out, faults and delay timers of each port. Using a 220-pF capacitor for CT and a 124-kΩ resistor for RBIAS sets the internal clock to 245 kHz and ensure IEEE 802.3af compliance along with maximizing the rejection of 60-Hz line frequency noise from A/D measurements.
RBIAS5510IBias set resistor. This resistor sets all precision bias currents within the chip. This pin regulates to 1.25 V (V2.5/2) when a resistor is connected between RBIAS and RG. This voltage and RBIAS generate a current which is replicated and used throughout the chip. This resistor also works in conjunction with the capacitors on CT and CINT to set internal timing values. The RBIAS resistor must be connected RG. RBIAS is a high impedance input and care must be taken to avoid signal injection from the SYN pin or I2C signals.
SYN5213I/OThis is a dual purpose pin. When the CT pin is connected to a timing capacitor this output pin is a 0-V to 3.3-V pulse of the internal clock which can be used to drive other TPS2384 SYN pins for elimination of a timing capacitor. When the CT pin is grounded this pin becomes an input pin that can be driven from a controller TPS2384 or any other clock generator signal.
AC_LO5114OTotem-pole output pin for AC Disconnect excitation.
AC_HI5015OTotem-pole output pin for AC Disconnect excitation.
Digital Signals
SCL2540ISerial clock input pin for the I2C interface.
SDA_I2639ISerial data input pin for the I2C interface. When tied to the SDA_O pin, this connection becomes the standard bi-directional serial data line (SDA)
SDA_O2738OSerial data open drain output for the I2C interface. When tied to the SDA_I pin, this connection becomes the standard bi-directional serial data line (SDA). This pin is an open drain output that can directly drive opto-coupler.
WD_DIS2243IThe WD_DIS pin disables the watchdog timer function when connected to 3.3 V. The pin has internal 50-kΩ resistor to digital ground. The watchdog timer monitors the I2C clock pin (SCL) and the internal oscillator activity in power management mode and only the internal oscillator activity in auto mode.
INTB2045OThis pin is an open-drain output that goes low if a fault condition occurs on any of the 4 ports.
ALTA/B2144IWhen this input is set to logic low there is no back-off time after a discovery failure. When this pin set to a logic high there is a back-off time (approximately 2 seconds) before initiating another discovery cycle. This pin has an internal 50-kΩ resistor pulldown to digital ground.
A12837IAddress 1 through 5. These pins are the I2C address select inputs. Select the appropriate binary address on these pins by connecting to digital ground for a logic low or tying to the V3.3 pin for a logic high. Each address line has an internal current source pulldown to digital ground.
A22936I
A33035I
A43134I
A53233I
MS632IThe MS pin selects either the auto mode (MS low) or the power management mode, PMM, (MS high). This pin can be held low for controller-less standalone applications. When MS is low and the POR timing cycle is complete the chip sequentially Discovers, Classifies and Powers on each port. When MS is set high the ports are controlled by register setting via the I2C bus. The MS pin has an internal 50-kΩ resistor pulldown to analog ground.
PORB623IThis pin can be used to override the internal POR. When held low, the I2C interface, all the state machines, and registers are held in reset. When all internal and external supplies are within specification, and this pin is set to a logic high level, the POR delay begins. The I2C interface and registers become active within 70 μs of this event and communications to read or preset registers can begin. The reset delay for the remainder of the chip then extinguishes in 1 second. This pin has an internal 50-kΩ resistor pulldown to analog ground.