MSP430FR2476 LaunchPad™ 开发套件




The LP-MSP430FR2476 LaunchPad™ development kit is an easy-to-use evaluation module (EVM) based on the MSP430FR2476 value line sensing microcontroller (MCU). It contains everything needed to start developing on the ultra-low-power MSP430FR2x value line sensing MCU platform, including on-board debug probe for programming, debugging and energy measurements. The board includes 2 buttons, 2 LEDs (one is an RGB LED) and an analog temperature sensor for creating a simple user interface. It also has a CR2032 battery holder (battery purchased separately) enabling standalone applications without an external power supply.

The 16-MHz MSP430FR2476 device features 64-KB of embedded ferroelectric random access memory (FRAM), a non-volatile memory known for its ultra-low power, high endurance, and high speed write access. Combined with the 8-KB of on-chip SRAM, users have access to 64-KB of memory to split between their program and data as required.  For example, a data logging application may require a large data memory with a relatively small program memory, so the memory may be allocated as required between program and data memory.

  • ULP FRAM technology based MSP430FR2476 16-bit MCU
  • On-board eZ-FET debug probe with EnergyTrace™ software technology available for ultra-low-power debugging
  • 40-pin LaunchPad development kit standard leveraging the BoosterPack™ plug-in module ecosystem
  • 2 buttons and 2 LEDs for user interaction
  • On-board TMP235 precision CMOS linear analog temperature sensor

  • LP-MSP430FR2476 Launchpad development kit
  • Micro-USB cable

MSP430 微控制器
MSP430FR2475 具有 32KB FRAM、4KB SRAM、比较器、12 位 ADC、UART/SPI/I2C 和计时器的 16MHz MCU MSP430FR2476 具有 64KB FRAM、8KB SRAM、比较器、12 位 ADC、UART/SPI/I2C 和计时器的 16MHz MCU


TMP235 ±1.2°C 2.3V to 5.5V analog output temperature sensor with 10 mV/C gain


INA214 26V、双向、高精度电流感应放大器


TPS22968 具有可调节上升时间和输出放电功能的 2 通道、5.5V、4A、25mΩ 负载开关



LP-MSP430FR2476 – MSP430FR2476 LaunchPad™ development kit


LP-MSP430FR2476-SW – LP-MSP430FR2476 software examples

应遵守 TI 的评估模块标准条款与条件.


LP-MSP430FR2476 hardware design files SLAC788.ZIP (4841 KB)


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类型 标题 下载最新的英文版本 日期
* 更多文献资料 LP-MSP430FR2476 software examples 2019年 5月 7日
* 用户指南 MSP430FR2476 LaunchPad development kit (LP-MSP430FR2476) user's guide 2019年 3月 13日
数据表 MSP430FR247x 混合信号微控制器 数据表 (Rev. B) 下载英文版本 (Rev.B) 2020年 5月 19日
更多文献资料 LP-MSP430FR2476 EU Declaration of Conformity (DoC) 2019年 3月 26日


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