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|*||用户指南||CC2650 Module BoosterPack™ Getting Started Guide (Rev. A)||2016年 6月 29日|
|证书||BOOSTXL-CC2650MA EU Declaration of Conformity (DoC)||2019年 1月 2日|
|电子书||TI-RSLK modules 1 - 20 (Rev. A)||2018年 5月 30日|
|更多文献资料||简介：传感器集成||2017年 11月 17日|
|更多文献资料||实验室：传感器集成||2017年 11月 17日|
|更多文献资料||Jacki Project Lecture||2017年 11月 17日|
|应用手册||Running Standalone Bluetooth® low energy Applications on CC2650 Module (Rev. A)||PDF | HTML||2017年 6月 7日|
|应用手册||Running Standalone Bluetooth® low energy Applications on CC2650 Module||2017年 1月 18日|
所有内容均由 TI 和社区网友按“原样”提供，并不构成 TI 规范。参阅使用条款。
The SimpleLink™ SDK BLE Plugin is a companion software package that enables the use of a Bluetooth radio on any standard MSP432P4 platform, MSP432E4 or CC32XX platform, and enables this two-chip solution to act as either a GAP Peripheral role or a GAP Central role. By having the ability to seamlessly and modularly add Bluetooth functionality (more specifically Bluetooth Low Energy/BLE) to an embedded system, a programmer can enable their embedded device to become a gateway to various IOT infrastructures.
For examples demonstrating the two-chip solution in a peripheral role, the plugin leverages the use of the TI Simple Application Processor (SAP) driver connected to a CC26xx Simple Network Processor (SNP) to provide a highly customizable hardware configuration. For software connectivity between the SAP and the SNP, an architecture agnostic HAL/Drivers layer is used to promote software portability and maximize collateral reuse.
For examples demonstrating the two-chip solution in a central role, communication between the NWP and the Host occurs through a UART serial interface using the Host Controller Interface (HCI) protocol. TI Vendor Specific HCI commands and a limited subset of Bluetooth LE HCI commands/events to implement a Bluetooth application. By using TI Vendor Specific commands and events, the application can communicate with and access the BLE stack.
This is version 2.2.7 of the TI Bluetooth® low energy protocol stack Software Development Kit (SDK). The BLE-Stack SDK allows for the development of single-mode Bluetooth low energy (BLE) applications on TI's first generation SimpleLink Bluetooth low energy CC2640 and Multi-Standard CC2650 wireless microcontroller units (MCUs) supporting version 5.1 of the Bluetooth specification with features defined by version 4.2 of the Bluetooth specification. The CC26x0 family of wireless MCUs includes a 32-bit Arm® Cortex™-M3 as the main application CPU running at 48 MHz, a dedicated Cortex-M0 processor for the radio / Physical Layer (PHY), and an autonomous Sensor Controller Engine for low-power sensing applications. The BLE protocol stack is built on top of the TI Real-time Operating System (TI-RTOS) which provides advanced power management and flexible peripheral driver capabilities allowing the development of highly optimized and power efficient standalone or network processor applications. The TI-RTOS SDK is installed during the BLE-Stack SDK installation.
Version 2.2.7 of the BLE-Stack is a maintenance update to TI's existing royalty-free Bluetooth low energy software protocol stack which is certified for Bluetooth specification version 5.1. This release includes support for all core specification version 4.2 Low Energy (LE) features as well as several development kits. This protocol stack update is in addition to support of all major Bluetooth LE core specification version 4.1 features, including support for up to 8 master or slave BLE connections. Please note that no Bluetooth 5 or Bluetooth 5.1 features are supported. A few examples of what can be created using the sample applications in this SDK and/or the additional resources found in the Examples section below include Bluetooth beacons incorporating the popular Apple iBeacon® and Eddystone™ formats, glucose, heart rate and fitness monitors, dongles for cable replacement via a BLE Serial Port Bridge and industrial motor monitors.
See What's New section for an overview of the changes included in this release. The Bluetooth core specification version 4.2 features supported in this release allow development of the most secure and power efficient products incorporating the Bluetooth low energy specification.
This page provides access to the CC26XX certification reports. Here you will find certification reports for both modules and EVMs. Note that module certification reports can be reused by the customer for regulatory compliance. However the customer should consult with their regulatory house to ensure they meet the requirements for certification at their product level. EVM certification reports are provided for reference only. When using a chip down version, the customer is responsible for their own certification.