ZHCST39A December   2022  – September 2023 AFE11612-SEP

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Characteristics
    7. 6.7  Timing Diagrams
    8. 6.8  Typical Characteristics: DAC
    9. 6.9  Typical Characteristics: ADC
    10. 6.10 Typical Characteristics: Internal Reference
    11. 6.11 Typical Characteristics: Temperature Sensor
    12. 6.12 Typical Characteristics: Digital Inputs
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Primary ADC Operation
        1. 7.3.1.1 Analog Inputs
          1. 7.3.1.1.1 Single-Ended Analog Input
          2. 7.3.1.1.2 Fully Differential Input
        2. 7.3.1.2 ADC Trigger Signals (See AFE configuration register 0 )
        3. 7.3.1.3 Double-Buffered ADC Data Registers
          1. 7.3.1.3.1 ADC Data Format
        4. 7.3.1.4 SCLK Clock Noise Reduction
        5. 7.3.1.5 Data Available Pin (DAV)
        6. 7.3.1.6 Convert Pin (CNVT)
        7. 7.3.1.7 Analog Input Out-of-Range Detection (See The Analog Input Out-of-Range Alarm Section)
        8. 7.3.1.8 Full-Scale Range of the Analog Input
      2. 7.3.2 Secondary ADC and Temperature Sensor Operation
        1. 7.3.2.1 Remote Sensing Diode
        2. 7.3.2.2 Ideality Factor
        3. 7.3.2.3 Filtering
        4. 7.3.2.4 Series Resistance Cancellation
        5. 7.3.2.5 Reading Temperature Data
        6. 7.3.2.6 Conversion Time
      3. 7.3.3 Reference Operation
        1. 7.3.3.1 Internal Reference
        2. 7.3.3.2 External Reference
      4. 7.3.4 DAC Operation
        1. 7.3.4.1 Resistor String
        2. 7.3.4.2 DAC Output
          1. 7.3.4.2.1 Full-Scale Output Range
          2. 7.3.4.2.2 DAC Output After Power-On Reset
        3. 7.3.4.3 Double-Buffered DAC Data Registers
        4. 7.3.4.4 Load DAC Latch
        5. 7.3.4.5 Synchronous Output Updating
        6. 7.3.4.6 Clear DACs
        7. 7.3.4.7 DAC Output Thermal Protection
      5. 7.3.5 Alarm Operation
        1. 7.3.5.1 Analog Input Out-of-Range Alarm
        2. 7.3.5.2 ALARM Pin
        3. 7.3.5.3 Hysteresis
        4. 7.3.5.4 False-Alarm Protection
      6. 7.3.6 General-Purpose Input and Output Pins (GPIO-0 To GPIO-7)
      7. 7.3.7 Device Reset Options
        1. 7.3.7.1 Hardware Reset
        2. 7.3.7.2 Software Reset
        3. 7.3.7.3 Power-On Reset (POR)
    4. 7.4 Device Functional Modes
      1. 7.4.1 DAC Output Mode
      2. 7.4.2 ADC Conversion Modes
        1. 7.4.2.1 Programmable Conversion Rate
        2. 7.4.2.2 Handshaking with the Host (See AFE configuration register 0 )
    5. 7.5 Programming
      1. 7.5.1 I2C-Compatible Interface
        1. 7.5.1.1 F/S-Mode Protocol
        2. 7.5.1.2 Hs-Mode Protocol
        3. 7.5.1.3 Address Pointer
        4. 7.5.1.4 Timeout Function
        5. 7.5.1.5 Device Communication Protocol For I2C
          1. 7.5.1.5.1 Writing A Single Register ( )
          2. 7.5.1.5.2 Writing Multiple Registers ( )
          3. 7.5.1.5.3 Reading a Single Register ( )
          4. 7.5.1.5.4 Reading Multiple Registers ( and )
      2. 7.5.2 Serial Peripheral Interface (SPI)
        1. 7.5.2.1 SPI Shift Register
        2. 7.5.2.2 SPI Communications Command
        3. 7.5.2.3 Standalone Operation
        4. 7.5.2.4 Daisy-Chain Operation
    6. 7.6 Register Maps
      1. 7.6.1  Temperature Data Registers (Read-Only)
        1. 7.6.1.1 LT-Temperature-Data (LT_TEMP) Register (address = 00h) [reset = 0000h, 0°C]
        2. 7.6.1.2 D1-Temperature-Data (D1_TEMP) Register (address = 01h) [reset = 0000h, 0°C]
        3. 7.6.1.3 D2-Temperature-Data (D2_TEMP) Register (address = 02h) [reset = 0000h, 0°C]
      2. 7.6.2  Temperature Configuration (TEMP_CONFIG) Register (address = 0Ah) [reset = 003Ch or 3CFFh]
      3. 7.6.3  Temperature Conversion Rate (TEMP_CONV_RATE) Register (address = 0Bh) [reset = 0007h or 07FFh]
      4. 7.6.4  η-Factor Correction Registers: D1_N_ADJUST and D2_N_ADJUST (address = 21h and 22h) [reset = 0000h or 00FFh]
      5. 7.6.5  ADC-n-Data (ADC_n) Registers (addresses = 23h to 32h) [reset = 0000h]
      6. 7.6.6  DAC-n-Data (DAC_n) Registers (addresses = 33h to 3Eh) [reset = 0000h)
      7. 7.6.7  DAC-n-CLR-Setting (DAC_n_CLR) Registers (addresses = 3Fh to 4Ah) [reset = 0000h]
      8. 7.6.8  GPIO Register (address = 4Bh) [reset = 00FFh]
      9. 7.6.9  AFE Configuration Register 0 (AFE_CONFIG_0) (address = 4Ch) [reset = 2000h]
      10. 7.6.10 AFE Configuration Register 1 (AFE_CONFIG_1) (Address = 4Dh) [reset = 0070h]
      11. 7.6.11 Alarm Control Register (ALR_CTRL) (address = 4Eh) [reset = 0000h]
      12. 7.6.12 STATUS Register (Address = 4Fh) [reset = 0000h]
      13. 7.6.13 ADC Channel Register 0 (ADC_CH0) (address = 50h) [reset = 0000h]
      14. 7.6.14 ADC Channel Register 1 (ADC_CH1) (address = 51h) [reset = 0000h]
      15. 7.6.15 ADC Gain Register (ADC_GAIN) (address = 52h) [reset = FFFFh]
      16. 7.6.16 AUTO_DAC_CLR_SOURCE Register (address = 53h) [reset = 0004h]
      17. 7.6.17 AUTO_DAC_CLR_EN Register (address = 54h) [reset = 0000h]
      18. 7.6.18 SW_DAC_CLR Register (address = 55h) [reset = 0000h]
      19. 7.6.19 HW_DAC_CLR_EN_0 Register (address = 56h) [reset = 0000h]
      20. 7.6.20 HW_DAC_CLR_EN_1 Register (address = 57h) [reset = 0000h]
      21. 7.6.21 DAC Configuration (DAC_CONFIG) Register (address = 58h) [reset = 0000h]
      22. 7.6.22 DAC Gain (DAC_GAIN) Register (address = 59h) [reset = 0000h]
      23. 7.6.23 Analog Input Channel Threshold Registers (addresses = 5Ah To 61h)
        1. 7.6.23.1 Input-n-High-Threshold Register (where n = 0, 1, 2, 3; addresses: 0 = 5Ah, 1 = 5Ch, 2 = 5Eh, 3 = 60h) [reset = 0FFFh]
        2. 7.6.23.2 Input-n-Low-Threshold Register (where n = 0, 1, 2, 3; addresses: 0 = 5Bh, 1 = 5Dh, 2 = 5Fh, 3 = 61h) (reset = 0000h)
      24. 7.6.24 Temperature Threshold Registers
        1. 7.6.24.1 LT_HIGH_THRESHOLD Register (address = 62h) [reset = 07FFh, +255.875°C]
        2. 7.6.24.2 LT_LOW_THRESHOLD Register (address = 63h) [reset = 0800h, –256°C]
        3. 7.6.24.3 D1_HIGH_THRESHOLD Register (address = 64h) [reset = 07FFh, +255.875°C]
        4. 7.6.24.4 D1_LOW_THRESHOLD Register (address = 65h) [reset = 0800h, –256°C]
        5. 7.6.24.5 D2_HIGH_THRESHOLD Register (address = 66h) [reset = 07FFh, +255.875°C]
        6. 7.6.24.6 D2_LOW_THRESHOLD Register (address = 67h) [reset = 0800h, –256°C]
      25. 7.6.25 Hysteresis Registers
        1. 7.6.25.1 Hysteresis Register 0 (HYST_0) (address = 68h) [reset = 0810h, 8 LSB]
        2. 7.6.25.2 Hysteresis Register 1 (HYST_1) (address = 69h) [reset = 0810h, 8 LSB]
        3. 7.6.25.3 Hysteresis Register 2 (HYST_2) (address = 6Ah) [reset = 2108h, 8°C]
      26. 7.6.26 Power-Down Register (PWR_DOWN) (address = 6Bh) [reset = 0000h)
      27. 7.6.27 Device ID Register (DEVICE_ID) (read only address = 6Ch) [reset = 1220h]
      28. 7.6.28 Software Reset (SW_RST) Register (read or write address = 7Ch) [reset = N/A)
        1. 7.6.28.1 SPI Mode
        2. 7.6.28.2 I2C Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Sequencing
        2. 8.2.2.2 Negative GaN Biasing
        3. 8.2.2.3 VDRAIN Monitoring
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power-Supply Sequence
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Diagram
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Mechanical, Packaging, and Orderable Information

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4 Revision History

Changes from Revision * (December 2022) to Revision A (September 2023)

  • 删除了与延长产品变更通知相关的特性要点Go
  • Changed external reference input voltage minimum value from 2.4 V to 1.4 V in Electrical Characteristics Go
  • Changed plots to move test conditions from figures to text and improve color contrast in figures containing multiple plots in all Typical Characteristics sectionsGo
  • Changed Overview section to provide required informationGo
  • Added DAC Output Mode subsectionGo
  • Added ADC Conversion Modes subsection to Device Functional Modes; moved from Feature Description Go
  • Changed Table 7-10, Register Maps,to provide more informationGo
  • Changed all register subsections to show register name to match global register mapGo
  • Changed all register subsection Field Descriptions tables to remove unnecessary contentGo
  • Added Field Description tables to subsections that were missing this tableGo
  • Changed some registers to be grouped togetherGo
  • Corrected typo in table column descriptor (changed 'FIeld' to 'Field')Go
  • Changed R0, R1, R2 to RATE in Temperature Conversion Rate registerGo
  • Changed Table 7-12, Temperature Conversion Time to Table 7-15, Temperature Conversion Rate Field Descriptions.Go
  • Changed Table 7-14, NADJUST and ηEFF Values to Table 7-17, η-Factor Correction Register Field Descriptions Go
  • Changed bit naming in figure to match global register map.Go
  • Deleted unnecessary STATUS Register text Go
  • Changed ADC Channel Register 1 section text for accuracyGo
  • Updated register name in figure (single THRH register instead of separate bits for each order of magnitude) to match global register map.Go
  • Added Application and Implementation section and Application Information and Typical Application subsectionsGo
  • Added Layout section and Layout Guidelines and Layout Example subsectionsGo