ZHCST39A December   2022  – September 2023 AFE11612-SEP

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Characteristics
    7. 6.7  Timing Diagrams
    8. 6.8  Typical Characteristics: DAC
    9. 6.9  Typical Characteristics: ADC
    10. 6.10 Typical Characteristics: Internal Reference
    11. 6.11 Typical Characteristics: Temperature Sensor
    12. 6.12 Typical Characteristics: Digital Inputs
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Primary ADC Operation
        1. 7.3.1.1 Analog Inputs
          1. 7.3.1.1.1 Single-Ended Analog Input
          2. 7.3.1.1.2 Fully Differential Input
        2. 7.3.1.2 ADC Trigger Signals (See AFE configuration register 0 )
        3. 7.3.1.3 Double-Buffered ADC Data Registers
          1. 7.3.1.3.1 ADC Data Format
        4. 7.3.1.4 SCLK Clock Noise Reduction
        5. 7.3.1.5 Data Available Pin (DAV)
        6. 7.3.1.6 Convert Pin (CNVT)
        7. 7.3.1.7 Analog Input Out-of-Range Detection (See The Analog Input Out-of-Range Alarm Section)
        8. 7.3.1.8 Full-Scale Range of the Analog Input
      2. 7.3.2 Secondary ADC and Temperature Sensor Operation
        1. 7.3.2.1 Remote Sensing Diode
        2. 7.3.2.2 Ideality Factor
        3. 7.3.2.3 Filtering
        4. 7.3.2.4 Series Resistance Cancellation
        5. 7.3.2.5 Reading Temperature Data
        6. 7.3.2.6 Conversion Time
      3. 7.3.3 Reference Operation
        1. 7.3.3.1 Internal Reference
        2. 7.3.3.2 External Reference
      4. 7.3.4 DAC Operation
        1. 7.3.4.1 Resistor String
        2. 7.3.4.2 DAC Output
          1. 7.3.4.2.1 Full-Scale Output Range
          2. 7.3.4.2.2 DAC Output After Power-On Reset
        3. 7.3.4.3 Double-Buffered DAC Data Registers
        4. 7.3.4.4 Load DAC Latch
        5. 7.3.4.5 Synchronous Output Updating
        6. 7.3.4.6 Clear DACs
        7. 7.3.4.7 DAC Output Thermal Protection
      5. 7.3.5 Alarm Operation
        1. 7.3.5.1 Analog Input Out-of-Range Alarm
        2. 7.3.5.2 ALARM Pin
        3. 7.3.5.3 Hysteresis
        4. 7.3.5.4 False-Alarm Protection
      6. 7.3.6 General-Purpose Input and Output Pins (GPIO-0 To GPIO-7)
      7. 7.3.7 Device Reset Options
        1. 7.3.7.1 Hardware Reset
        2. 7.3.7.2 Software Reset
        3. 7.3.7.3 Power-On Reset (POR)
    4. 7.4 Device Functional Modes
      1. 7.4.1 DAC Output Mode
      2. 7.4.2 ADC Conversion Modes
        1. 7.4.2.1 Programmable Conversion Rate
        2. 7.4.2.2 Handshaking with the Host (See AFE configuration register 0 )
    5. 7.5 Programming
      1. 7.5.1 I2C-Compatible Interface
        1. 7.5.1.1 F/S-Mode Protocol
        2. 7.5.1.2 Hs-Mode Protocol
        3. 7.5.1.3 Address Pointer
        4. 7.5.1.4 Timeout Function
        5. 7.5.1.5 Device Communication Protocol For I2C
          1. 7.5.1.5.1 Writing A Single Register ( )
          2. 7.5.1.5.2 Writing Multiple Registers ( )
          3. 7.5.1.5.3 Reading a Single Register ( )
          4. 7.5.1.5.4 Reading Multiple Registers ( and )
      2. 7.5.2 Serial Peripheral Interface (SPI)
        1. 7.5.2.1 SPI Shift Register
        2. 7.5.2.2 SPI Communications Command
        3. 7.5.2.3 Standalone Operation
        4. 7.5.2.4 Daisy-Chain Operation
    6. 7.6 Register Maps
      1. 7.6.1  Temperature Data Registers (Read-Only)
        1. 7.6.1.1 LT-Temperature-Data (LT_TEMP) Register (address = 00h) [reset = 0000h, 0°C]
        2. 7.6.1.2 D1-Temperature-Data (D1_TEMP) Register (address = 01h) [reset = 0000h, 0°C]
        3. 7.6.1.3 D2-Temperature-Data (D2_TEMP) Register (address = 02h) [reset = 0000h, 0°C]
      2. 7.6.2  Temperature Configuration (TEMP_CONFIG) Register (address = 0Ah) [reset = 003Ch or 3CFFh]
      3. 7.6.3  Temperature Conversion Rate (TEMP_CONV_RATE) Register (address = 0Bh) [reset = 0007h or 07FFh]
      4. 7.6.4  η-Factor Correction Registers: D1_N_ADJUST and D2_N_ADJUST (address = 21h and 22h) [reset = 0000h or 00FFh]
      5. 7.6.5  ADC-n-Data (ADC_n) Registers (addresses = 23h to 32h) [reset = 0000h]
      6. 7.6.6  DAC-n-Data (DAC_n) Registers (addresses = 33h to 3Eh) [reset = 0000h)
      7. 7.6.7  DAC-n-CLR-Setting (DAC_n_CLR) Registers (addresses = 3Fh to 4Ah) [reset = 0000h]
      8. 7.6.8  GPIO Register (address = 4Bh) [reset = 00FFh]
      9. 7.6.9  AFE Configuration Register 0 (AFE_CONFIG_0) (address = 4Ch) [reset = 2000h]
      10. 7.6.10 AFE Configuration Register 1 (AFE_CONFIG_1) (Address = 4Dh) [reset = 0070h]
      11. 7.6.11 Alarm Control Register (ALR_CTRL) (address = 4Eh) [reset = 0000h]
      12. 7.6.12 STATUS Register (Address = 4Fh) [reset = 0000h]
      13. 7.6.13 ADC Channel Register 0 (ADC_CH0) (address = 50h) [reset = 0000h]
      14. 7.6.14 ADC Channel Register 1 (ADC_CH1) (address = 51h) [reset = 0000h]
      15. 7.6.15 ADC Gain Register (ADC_GAIN) (address = 52h) [reset = FFFFh]
      16. 7.6.16 AUTO_DAC_CLR_SOURCE Register (address = 53h) [reset = 0004h]
      17. 7.6.17 AUTO_DAC_CLR_EN Register (address = 54h) [reset = 0000h]
      18. 7.6.18 SW_DAC_CLR Register (address = 55h) [reset = 0000h]
      19. 7.6.19 HW_DAC_CLR_EN_0 Register (address = 56h) [reset = 0000h]
      20. 7.6.20 HW_DAC_CLR_EN_1 Register (address = 57h) [reset = 0000h]
      21. 7.6.21 DAC Configuration (DAC_CONFIG) Register (address = 58h) [reset = 0000h]
      22. 7.6.22 DAC Gain (DAC_GAIN) Register (address = 59h) [reset = 0000h]
      23. 7.6.23 Analog Input Channel Threshold Registers (addresses = 5Ah To 61h)
        1. 7.6.23.1 Input-n-High-Threshold Register (where n = 0, 1, 2, 3; addresses: 0 = 5Ah, 1 = 5Ch, 2 = 5Eh, 3 = 60h) [reset = 0FFFh]
        2. 7.6.23.2 Input-n-Low-Threshold Register (where n = 0, 1, 2, 3; addresses: 0 = 5Bh, 1 = 5Dh, 2 = 5Fh, 3 = 61h) (reset = 0000h)
      24. 7.6.24 Temperature Threshold Registers
        1. 7.6.24.1 LT_HIGH_THRESHOLD Register (address = 62h) [reset = 07FFh, +255.875°C]
        2. 7.6.24.2 LT_LOW_THRESHOLD Register (address = 63h) [reset = 0800h, –256°C]
        3. 7.6.24.3 D1_HIGH_THRESHOLD Register (address = 64h) [reset = 07FFh, +255.875°C]
        4. 7.6.24.4 D1_LOW_THRESHOLD Register (address = 65h) [reset = 0800h, –256°C]
        5. 7.6.24.5 D2_HIGH_THRESHOLD Register (address = 66h) [reset = 07FFh, +255.875°C]
        6. 7.6.24.6 D2_LOW_THRESHOLD Register (address = 67h) [reset = 0800h, –256°C]
      25. 7.6.25 Hysteresis Registers
        1. 7.6.25.1 Hysteresis Register 0 (HYST_0) (address = 68h) [reset = 0810h, 8 LSB]
        2. 7.6.25.2 Hysteresis Register 1 (HYST_1) (address = 69h) [reset = 0810h, 8 LSB]
        3. 7.6.25.3 Hysteresis Register 2 (HYST_2) (address = 6Ah) [reset = 2108h, 8°C]
      26. 7.6.26 Power-Down Register (PWR_DOWN) (address = 6Bh) [reset = 0000h)
      27. 7.6.27 Device ID Register (DEVICE_ID) (read only address = 6Ch) [reset = 1220h]
      28. 7.6.28 Software Reset (SW_RST) Register (read or write address = 7Ch) [reset = N/A)
        1. 7.6.28.1 SPI Mode
        2. 7.6.28.2 I2C Mode
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Sequencing
        2. 8.2.2.2 Negative GaN Biasing
        3. 8.2.2.3 VDRAIN Monitoring
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power-Supply Sequence
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Diagram
  10. Device and Documentation Support
    1. 9.1 Documentation Support
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Mechanical, Packaging, and Orderable Information

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Pin Configuration and Functions

GUID-20221222-SS0I-FK4C-RMBX-C4ZXWVJ3X660-low.svg Figure 5-1 PAP Package, 64-Pin HTQFP (Top View)
Table 5-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
A2 11 I Target address selection A2 for I2C when the SPI/I2C pin is low.
ADC-GND 32 I ADC ground. Must be connected to AGND.
ADC-REF-IN/CMP 31 I/O External ADC reference input when external VREF is used to drive the ADC. A compensation capacitor connection (connect a 4.7-µF capacitor between this pin and AGND) when internal VREF is used to drive the ADC.
AGND1 54 I Analog ground
AGND2 55 I Analog ground
AGND3 22 I Analog ground
AGND4 21 I Analog ground
ALARM 62 O Global alarm. Open-drain output. An external 10-kΩ pullup resistor is required. This pin goes low (active) when one (or more) analog channels are out of range.
AVCC1 56 I Positive analog power for DAC6-OUT, DAC7-OUT, DAC8-OUT, DAC9-OUT, DAC10-OUT, and DAC11-OUT; must be tied to AVCC2
AVCC2 23 I Positive analog power for DAC0-OUT, DAC1-OUT, DAC2-OUT, DAC3-OUT, DAC4-OUT, and DAC5-OUT; must be tied to AVCC1
AVDD1 49 I Positive analog power supply
AVDD2 50 I Positive analog power supply
CH0 33 I Analog input of channel 0. CH0, CH1, CH2, and CH3 can be programmed as differential or single-ended.
CH1 34 I Analog input of channel 1. CH0, CH1, CH2, and CH3 can be programmed as differential or single-ended.
CH2 35 I Analog input of channel 2. CH0, CH1, CH2, and CH3 can be programmed as differential or single-ended.
CH3 36 I Analog input of channel 3. CH0, CH1, CH2, and CH3 can be programmed as differential or single-ended.
CH4 37 I Analog input of channel 4. CH4 to CH15 are single-ended.
CH5 38 I Analog input of channel 5. CH4 to CH15 are single-ended.
CH6 39 I Analog input of channel 6. CH4 to CH15 are single-ended.
CH7 40 I Analog input of channel 7. CH4 to CH15 are single-ended.
CH8 41 I Analog input of channel 8. CH4 to CH15 are single-ended.
CH9 42 I Analog input of channel 9. CH4 to CH15 are single-ended.
CH10 43 I Analog input of channel 10. CH4 to CH15 are single-ended.
CH11 44 I Analog input of channel 11. CH4 to CH15 are single-ended.
CH12 45 I Analog input of channel 12. CH4 to CH15 are single-ended.
CH13 46 I Analog input of channel 13. CH4 to CH15 are single-ended.
CH14 47 I Analog input of channel 14. CH4 to CH15 are single-ended.
CH15 48 I Analog input of channel 15. CH4 to CH15 are single-ended.
CNVT 3 I External conversion trigger, active low. The falling edge initiates the sampling and conversion of the ADC.
CS/A0 9 I Chip-select signal for SPI when the SPI/I2C pin high. Target address selection A0 for I2C when SPI/I2C low.
D1–/GPIO4 29 I/O Remote sensor D1 negative input when D1 enabled; GPIO-6 when D1 disabled. Pullup resistor required for output.
D1+/GPIO-5 30 I/O Remote sensor D1 positive input when D1 enabled; GPIO-7 when D1 disabled. Pullup resistor required for output.
D2–/GPIO-6 27 I/O Remote sensor D2 negative input when D2 enabled; GPIO-6 when D2 disabled. Pullup resistor required for output.
D2+/GPIO-7 28 I/O Remote sensor D2 positive input when D2 enabled; GPIO-7 when D2 disabled. Pullup resistor required for output.
DAC0-OUT 26 O DAC channel 0 output
DAC1-OUT 25 O DAC channel 1 output
DAC2-OUT 24 O DAC channel 2 output
DAC3-OUT 20 O DAC channel 3 output
DAC4-OUT 19 O DAC channel 4 output
DAC5-OUT 18 O DAC channel 5 output
DAC6-OUT 51 O DAC channel 6 output
DAC7-OUT 52 O DAC channel 7 output
DAC8-OUT 53 O DAC channel 8 output
DAC9-OUT 59 O DAC channel 9 output
DAC10-OUT 60 O DAC channel 10 output
DAC11-OUT 61 O DAC channel 11 output
DAC-CLR-0 17 I DAC clear control signal, digital input, active low. When low, all DACs associated with the DAC-CLR-0 pin enter a CLEAR state, the DAC latch is loaded with a predefined code, and the output is set to the corresponding level. However, the DAC-data register does not change. When the DAC goes back to normal operation, the DAC latch is loaded with the previous data from the DAC-data register and the output returns to the previous level, regardless of the status of the SLDAC-n bit. When this pin is high, the DACs are in normal operation.
DAC-CLR-1 63 I DAC clear control signal, digital input, active low. When low, all DACs associated with the DAC-CLR-1 pin enter a CLEAR state, the DAC latch is loaded with a predefined code, and the output is set to the corresponding level. However, the DAC-data register does not change. When the DAC goes back to normal operation, the DAC latch is loaded with the previous data from the DAC-data register and the output returns to the previous level, regardless of the status of the SLDAC-n bit. When this pin is high, the DACs are in normal operation.
DAV 2 O Data available indicator, active low output. In direct mode, the DAV pin goes low (active) when the conversion ends. In auto mode, a 1-µs pulse (active low) appears on this pin when a conversion cycle completes (for details, see the Primary ADC Operation and Register Maps sections). DAV stays high when deactivated.
DGND 6 I Digital ground
DGND2 64 I Digital ground
DVDD 8 I Digital power supply (3 V to 5 V). Must be the same value as AVDD.
GPIO-0 13 I/O General-purpose digital input and output. This bidirectional, open-drain, digital I/O pin requires an external pullup resistor. For more details, see the General-Purpose Input and Output Pins (GPIO-0 To GPIO-7) section.
GPIO-1 14 I/O General-purpose digital input and output. This bidirectional, open-drain, digital I/O pin requires an external pullup resistor. For more details, see the General-Purpose Input and Output Pins (GPIO-0 To GPIO-7) section.
GPIO-2 15 I/O General-purpose digital input and output. This bidirectional, open-drain, digital I/O pin requires an external pullup resistor. For more details, see the General-Purpose Input and Output Pins (GPIO-0 To GPIO-7) section.
GPIO-3 16 I/O General-purpose digital input and output. This bidirectional, open-drain, digital I/O pin requires an external pullup resistor. For more details, see the General-Purpose Input and Output Pins (GPIO-0 To GPIO-7) section.
IOVDD 7 I Interface power supply
REF-DAC 58 I DAC reference input
REF-OUT 57 O Internal reference output
RESET 1 I Reset input, active low. A logic low on this pin causes the device to perform a hardware reset.
SCLK/SCL 5 I Serial clock input of the main serial interface. This pin functions as the SPI clock when the SPI/I2C pin is high. This pin functions as the I2C clock when the SPI/I2C pin is low.
SDI/SDA 4 I/O Serial interface data. This pin functions as SDI for the serial peripheral interface (SPI) when the SPI/I2C pin (pin 12) is high. This pin functions as SDA for the I2C interface when the SPI/I2C pin is low.
SDO/A1 10 I/O SDO for SPI when the SPI/I2C pin is high. Target address selection A1 for I2C when the SPI/I2C pin is low.
SPI/I2C 12 I Interface selection pin; digital input. When this pin is tied to IOVDD, the SPI is enabled and the I2C interface is disabled. When this pin is tied to ground, the SPI is disabled and the I2C interface is enabled.
Signal Types: I = Input, O = Output, I/O = Input or Output.