ZHCSHX7B November   2017  – May 2022 DLPC120-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1. 5.1 LED Driver Interface
    2. 5.2 DMD Temperature Interface
    3.     General Purpose I/O
    4. 5.3 Main Video and Data Control Interface
    5. 5.4 DMD Interface
    6. 5.5 Memory Interface
    7.     Board Level Test and Debug
    8.     Manufacturing Test Support
    9.     Test Point Interface
    10.     Power and Ground
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Electrical Characteristics for I/O
    7. 6.7  Power Supply and Reset Timing Requirements
    8. 6.8  Reference Clock PLL Timing Requirements
    9. 6.9  Parallel Interface General Timing Requirements
    10. 6.10 Parallel Interface Frame Timing Requirements
    11. 6.11 Flash Memory Interface Timing Requirements
    12. 6.12 DMD Interface Timing Requirements
    13. 6.13 JTAG Interface Timing Requirements
    14. 6.14 I2C Interface Timing Requirements
  7. 7 Parameter Measurement Information
    1. 7.1 Parallel Interface Input Source Timing
    2. 7.2 Design for Test Functions
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Serial Flash Interface
      2. 8.3.2 Serial Flash Programming
      3. 8.3.3 DDR2 Memory Interface
      4. 8.3.4 JTAG and DMD Interface Test
      5. 8.3.5 Temperature Monitor Function
      6. 8.3.6 Host Command Interface
    4. 8.4 Device Functional Modes
      1. 8.4.1 External Video Mode
      2. 8.4.2 Splash Screen Mode
      3. 8.4.3 Test Pattern Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply Filtering
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB layout guidelines for internal ASIC PLL power
      2. 11.1.2 DLPC120-Q1 Reference Clock
        1. 11.1.2.1 Recommended Crystal Oscillator Configuration
      3. 11.1.3 General PCB Recommendations
      4. 11.1.4 PCB Routing Guidelines
      5. 11.1.5 Number of Layer Changes
      6. 11.1.6 Terminations
      7. 11.1.7 General Handling Guidelines for Unused CMOS-Type Pins
  12. 12Device and Documentation Support
    1. 12.1 第三方产品免责声明
    2. 12.2 Device Support
      1. 12.2.1 Device Nomenclature
        1. 12.2.1.1 Device Markings
    3. 12.3 Documentation Support
      1. 12.3.1 Related Documentation
    4. 12.4 接收文档更新通知
    5. 12.5 支持资源
    6. 12.6 Trademarks
    7. 12.7 Electrostatic Discharge Caution
    8. 12.8 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • ZXS|216
散热焊盘机械数据 (封装 | 引脚)
订购信息

11.1.7 General Handling Guidelines for Unused CMOS-Type Pins

To avoid potentially damaging current caused by floating CMOS input-only pins, it is recommended that unused ASIC input pins be tied through a pull-up resistor to its associated power supply or a pull-down to ground. For ASIC inputs with an internal pull-up or pull-down resistors, it is unnecessary to add an external pullup or pulldown unless specifically recommended.  Note that internal pull-up and pull-down resistors are weak and should not be expected to drive the external line.  The DLPC120-Q1 implements very few internal resistors and these are noted in the pin list.

Unused output-only pins can be left open. When possible, it is recommended that unused Bi-directional I/O pins be configured to their output state such that the pin can be left open.  If this control is not available and the pins may become an input, then they should be pulled-up (or down) using an appropriate resistor.