ZHCSHX7B
November 2017 – May 2022
DLPC120-Q1
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
Pin Configuration and Functions
5.1
LED Driver Interface
5.2
DMD Temperature Interface
General Purpose I/O
5.3
Main Video and Data Control Interface
5.4
DMD Interface
5.5
Memory Interface
Board Level Test and Debug
Manufacturing Test Support
Test Point Interface
Power and Ground
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Electrical Characteristics for I/O
6.7
Power Supply and Reset Timing Requirements
6.8
Reference Clock PLL Timing Requirements
6.9
Parallel Interface General Timing Requirements
6.10
Parallel Interface Frame Timing Requirements
6.11
Flash Memory Interface Timing Requirements
6.12
DMD Interface Timing Requirements
6.13
JTAG Interface Timing Requirements
6.14
I2C Interface Timing Requirements
7
Parameter Measurement Information
7.1
Parallel Interface Input Source Timing
7.2
Design for Test Functions
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Serial Flash Interface
8.3.2
Serial Flash Programming
8.3.3
DDR2 Memory Interface
8.3.4
JTAG and DMD Interface Test
8.3.5
Temperature Monitor Function
8.3.6
Host Command Interface
8.4
Device Functional Modes
8.4.1
External Video Mode
8.4.2
Splash Screen Mode
8.4.3
Test Pattern Mode
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
10
Power Supply Recommendations
10.1
Power Supply Filtering
11
Layout
11.1
Layout Guidelines
11.1.1
PCB layout guidelines for internal ASIC PLL power
11.1.2
DLPC120-Q1 Reference Clock
11.1.2.1
Recommended Crystal Oscillator Configuration
11.1.3
General PCB Recommendations
11.1.4
PCB Routing Guidelines
11.1.5
Number of Layer Changes
11.1.6
Terminations
11.1.7
General Handling Guidelines for Unused CMOS-Type Pins
12
Device and Documentation Support
12.1
第三方产品免责声明
12.2
Device Support
12.2.1
Device Nomenclature
12.2.1.1
Device Markings
12.3
Documentation Support
12.3.1
Related Documentation
12.4
接收文档更新通知
12.5
支持资源
12.6
Trademarks
12.7
Electrostatic Discharge Caution
12.8
术语表
13
Mechanical, Packaging, and Orderable Information
封装选项
请参考 PDF 数据表获取器件具体的封装图。
机械数据 (封装 | 引脚)
ZXS|216
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcshx7b_oa