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DSP 1 C64x DSP MHz (Max) 300 CPU 32-/64-bit Operating system DSP/BIOS, VLX Ethernet MAC 10/100 Rating Catalog Operating temperature range (C) 0 to 90
DSP 1 C64x DSP MHz (Max) 300 CPU 32-/64-bit Operating system DSP/BIOS, VLX Ethernet MAC 10/100 Rating Catalog Operating temperature range (C) 0 to 90
BGA (ZDU) 376 529 mm² 23 x 23 NFBGA (ZWT) 361 256 mm² 16 x 16
  • Get started today with production-ready, easy-to-use audio and video codecs for digital media processors based on DaVinci™ technology. Also available are various O/S Board Support Packages and software updates. All codecs are available for FREE evaluation. REQUEST FREE SOFTWARE!
  • High-Performance Digital Media Processor (DM6431)
    • 3.33-ns Instruction Cycle Time
    • 300-MHz C64x+™ Clock Rate
    • Eight 32-Bit C64x+ Instructions/Cycle
    • 2400 MIPS
    • Fully Software-Compatible With C64x
    • Commercial and Automotive (Q or S suffix) Grades
  • VelociTI.2™ Extensions to VelociTI™ Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+™ DSP Core
    • Eight Highly Independent Functional Units With VelociTI.2 Extensions:
      • Six ALUs (32-/40-Bit), Each Supports Single 32-Bit, Dual 16-Bit, or Quad 8-Bit Arithmetic per Clock Cycle
      • Two Multipliers Support Four 16 × 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 × 8-Bit Multiplies (16-Bit Results) per Clock Cycle
    • Load-Store Architecture With Non-Aligned Support
    • 64 32-Bit General-Purpose Registers
    • Instruction Packing Reduces Code Size
    • All Instructions Conditional
    • Additional C64x+™ Enhancements
      • Protected Mode Operation
      • Exceptions Support for Error Detection and Program Redirection
      • Hardware Support for Modulo Loop Auto-Focus Module Operation
      • C64x+ Instruction Set Features
        • Byte-Addressable (8-/16-/32-/64-Bit Data)
        • 8-Bit Overflow Protection
        • Bit-Field Extract, Set, Clear
        • Normalization, Saturation, Bit-Counting
        • VelociTI.2 Increased Orthogonality
        • C64x+ Extensions
          • Compact 16-bit Instructions
          • Additional Instructions to Support Complex Multiplies
  • C64x+ L1/L2 Memory Architecture
    • 256K-Bit (32K-Byte) L1P Program RAM/Cache [Flexible Allocation]
    • 512K-Bit (64K-Byte) L1D Data RAM/Cache [Flexible Allocation]
    • 512K-Bit (64K-Byte) L2 Unified Mapped RAM/Cache [Flexible Allocation]
  • Supports Little Endian Mode Only
  • Video Processing Subsystem (VPSS), VPFE Only
    • Front End Provides:
      • CCD and CMOS Imager Interface
      • BT.601/BT.656 Digital YCbCr 4:2:2 (10-Bit) Interface
      • Glueless Interface to Common Video Decoders
  • External Memory Interfaces (EMIFs)
    • 16-Bit DDR2 SDRAM Memory Controller With 128M-Byte Address Space (1.8-V I/O)
      • Supports up to 266-MHz (data rate) bus and interfaces to DDR2-400 SDRAM
    • Asynchronous 8-Bit Wide EMIF (EMIFA) With up to 64M-Byte Address Reach
      • Flash Memory Interfaces
        • NOR (8-Bit-Wide Data)
        • NAND (8-Bit-Wide Data)
  • Enhanced Direct-Memory-Access (EDMA) Controller (64 Independent Channels)
  • Two 64-Bit General-Purpose Timers (Each Configurable as Two 32-Bit Timers)
  • One 64-Bit Watch Dog Timer
  • One UART With RTS and CTS Flow Control
  • Master/Slave Inter-Integrated Circuit (I2C Bus™)
  • One Multichannel Buffered Serial Port (McBSP0)
    • I2S and TDM
    • AC97 Audio Codec Interface
    • SPI
    • Standard Voice Codec Interface (AIC12)
    • Telecom Interfaces - ST-Bus, H-100
    • 128 Channel Mode
  • Multichannel Audio Serial Port (McASP0)
    • Four Serializers and SPDIF (DIT) Mode
  • High-End CAN Controller (HECC)
  • 10/100 Mb/s Ethernet MAC (EMAC)
    • IEEE 802.3 Compliant
    • Supports Media Independent Interface (MII)
    • Management Data I/O (MDIO) Module
  • Three Pulse Width Modulator (PWM) Outputs
  • On-Chip ROM Bootloader
  • Individual Power-Savings Modes
  • Flexible PLL Clock Generators
  • IEEE-1149.1 (JTAG™) Boundary-Scan-Compatible
  • Up to 111 General-Purpose I/O (GPIO) Pins (Multiplexed With Other Device Functions)
  • Packages:
    • 361-Pin Pb-Free PBGA Package (ZWT Suffix), 0.8-mm Ball Pitch
    • 376-Pin Plastic BGA Package (ZDU Suffix), 1.0-mm Ball Pitch
  • 0.09-µm/6-Level Cu Metal Process (CMOS)
  • 3.3-V and 1.8-V I/O, 1.2-V Internal (-3/-3Q/-3S)
  • Applications:
    • Digital Media
    • Networked Media Encode
    • Video Imaging

All trademarks are the property of their respective owners.

  • Get started today with production-ready, easy-to-use audio and video codecs for digital media processors based on DaVinci™ technology. Also available are various O/S Board Support Packages and software updates. All codecs are available for FREE evaluation. REQUEST FREE SOFTWARE!
  • High-Performance Digital Media Processor (DM6431)
    • 3.33-ns Instruction Cycle Time
    • 300-MHz C64x+™ Clock Rate
    • Eight 32-Bit C64x+ Instructions/Cycle
    • 2400 MIPS
    • Fully Software-Compatible With C64x
    • Commercial and Automotive (Q or S suffix) Grades
  • VelociTI.2™ Extensions to VelociTI™ Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+™ DSP Core
    • Eight Highly Independent Functional Units With VelociTI.2 Extensions:
      • Six ALUs (32-/40-Bit), Each Supports Single 32-Bit, Dual 16-Bit, or Quad 8-Bit Arithmetic per Clock Cycle
      • Two Multipliers Support Four 16 × 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 × 8-Bit Multiplies (16-Bit Results) per Clock Cycle
    • Load-Store Architecture With Non-Aligned Support
    • 64 32-Bit General-Purpose Registers
    • Instruction Packing Reduces Code Size
    • All Instructions Conditional
    • Additional C64x+™ Enhancements
      • Protected Mode Operation
      • Exceptions Support for Error Detection and Program Redirection
      • Hardware Support for Modulo Loop Auto-Focus Module Operation
      • C64x+ Instruction Set Features
        • Byte-Addressable (8-/16-/32-/64-Bit Data)
        • 8-Bit Overflow Protection
        • Bit-Field Extract, Set, Clear
        • Normalization, Saturation, Bit-Counting
        • VelociTI.2 Increased Orthogonality
        • C64x+ Extensions
          • Compact 16-bit Instructions
          • Additional Instructions to Support Complex Multiplies
  • C64x+ L1/L2 Memory Architecture
    • 256K-Bit (32K-Byte) L1P Program RAM/Cache [Flexible Allocation]
    • 512K-Bit (64K-Byte) L1D Data RAM/Cache [Flexible Allocation]
    • 512K-Bit (64K-Byte) L2 Unified Mapped RAM/Cache [Flexible Allocation]
  • Supports Little Endian Mode Only
  • Video Processing Subsystem (VPSS), VPFE Only
    • Front End Provides:
      • CCD and CMOS Imager Interface
      • BT.601/BT.656 Digital YCbCr 4:2:2 (10-Bit) Interface
      • Glueless Interface to Common Video Decoders
  • External Memory Interfaces (EMIFs)
    • 16-Bit DDR2 SDRAM Memory Controller With 128M-Byte Address Space (1.8-V I/O)
      • Supports up to 266-MHz (data rate) bus and interfaces to DDR2-400 SDRAM
    • Asynchronous 8-Bit Wide EMIF (EMIFA) With up to 64M-Byte Address Reach
      • Flash Memory Interfaces
        • NOR (8-Bit-Wide Data)
        • NAND (8-Bit-Wide Data)
  • Enhanced Direct-Memory-Access (EDMA) Controller (64 Independent Channels)
  • Two 64-Bit General-Purpose Timers (Each Configurable as Two 32-Bit Timers)
  • One 64-Bit Watch Dog Timer
  • One UART With RTS and CTS Flow Control
  • Master/Slave Inter-Integrated Circuit (I2C Bus™)
  • One Multichannel Buffered Serial Port (McBSP0)
    • I2S and TDM
    • AC97 Audio Codec Interface
    • SPI
    • Standard Voice Codec Interface (AIC12)
    • Telecom Interfaces - ST-Bus, H-100
    • 128 Channel Mode
  • Multichannel Audio Serial Port (McASP0)
    • Four Serializers and SPDIF (DIT) Mode
  • High-End CAN Controller (HECC)
  • 10/100 Mb/s Ethernet MAC (EMAC)
    • IEEE 802.3 Compliant
    • Supports Media Independent Interface (MII)
    • Management Data I/O (MDIO) Module
  • Three Pulse Width Modulator (PWM) Outputs
  • On-Chip ROM Bootloader
  • Individual Power-Savings Modes
  • Flexible PLL Clock Generators
  • IEEE-1149.1 (JTAG™) Boundary-Scan-Compatible
  • Up to 111 General-Purpose I/O (GPIO) Pins (Multiplexed With Other Device Functions)
  • Packages:
    • 361-Pin Pb-Free PBGA Package (ZWT Suffix), 0.8-mm Ball Pitch
    • 376-Pin Plastic BGA Package (ZDU Suffix), 1.0-mm Ball Pitch
  • 0.09-µm/6-Level Cu Metal Process (CMOS)
  • 3.3-V and 1.8-V I/O, 1.2-V Internal (-3/-3Q/-3S)
  • Applications:
    • Digital Media
    • Networked Media Encode
    • Video Imaging

All trademarks are the property of their respective owners.

The TMS320C64x+™ DSPs (including the TMS320DM6431 device) are the highest-performance fixed-point DSP generation in the TMS320C6000™ DSP platform. The DM6431 device is based on the third-generation high-performance, advanced VelociTI™ very-long-instruction-word (VLIW) architecture developed by Texas Instruments (TI), making these DSPs an excellent choice for digital media applications. The C64x+™ devices are upward code-compatible from previous devices that are part of the C6000™ DSP platform. The C64x™ DSPs support added functionality and have an expanded instruction set from previous devices.

Any reference to the C64x DSP or C64x CPU also applies, unless otherwise noted, to the C64x+ DSP and C64x+ CPU, respectively.

With performance of up to 2400 million instructions per second (MIPS) at a clock rate of 300 MHz, the C64x+ core offers solutions to high-performance DSP programming challenges. The DSP core possesses the operational flexibility of high-speed controllers and the numerical capability of array processors. The C64x+ DSP core processor has 64 general-purpose registers of 32-bit word length and eight highly independent functional units–two multipliers for a 32-bit result and six arithmetic logic units (ALUs). The eight functional units include instructions to accelerate the performance in video and imaging applications. The DSP core can produce four 16-bit multiply-accumulates (MACs) per cycle for a total of 1200 million MACs per second (MMACS), or eight 8-bit MACs per cycle for a total of 2400 MMACS. For more details on the C64x+ DSP, see the TMS320C64x/C64x+ DSP CPU and Instruction Set Reference Guide (literature number SPRU732).

The DM6431 also has application-specific hardware logic, on-chip memory, and additional on-chip peripherals similar to the other C6000 DSP platform devices. The DM6431 core uses a two-level cache-based architecture. The Level 1 program memory/cache (L1P) consists of 32K-byte (KB) memory space that can be configured as mapped memory or direct mapped cache. The Level 1 data/memory memory/cache (L1D) consists of a 64KB memory space that can be configured as mapped memory or 2-way set-associative cache. The Level 2 memory/cache (L2) consists of a 64KB memory space that is shared between program and data space. L2 memory can be configured as mapped memory, cache, or a combination of both.

The peripheral set includes: 1 configurable video port; a 10/100 Mb/s Ethernet MAC (EMAC) with a management data input/output (MDIO) module; an inter-integrated circuit (I2C) Bus interface; a multichannel buffered serial port (McBSP0); a multichannel audio serial port (McASP0) with 4 serializers; 2 64-bit general-purpose timers each configurable as 2 independent 32-bit timers; 1 64-bit watchdog timer; up to 111-pins of general-purpose input/output (GPIO) with programmable interrupt/event generation modes, multiplexed with other peripherals; 1 UART with hardware handshaking support; 3 pulse width modulator (PWM) peripherals; 1 high-end controller area network (CAN) controller [HECC]; and 2 glueless external memory interfaces: an asynchronous external memory interface (EMIFA) for slower memories/peripherals, and a higher speed synchronous memory interface for DDR2.

The DM6431 device includes a Video Processing Subsystem (VPSS) with a Video Processing Front-End (VPFE) input used for video capture.

The Video Processing Front-End (VPFE) is comprised of a CCD Controller (CCDC). The CCDC is capable of interfacing to common video decoders, CMOS sensors, and Charge Coupled Devices (CCDs).

The Ethernet Media Access Controller (EMAC) provides an efficient interface between the DM6431 and the network. The DM6431 EMAC support both 10Base-T and 100Base-TX, or 10 Mbits/second (Mbps) and 100 Mbps in either half- or full-duplex mode, with hardware flow control and quality of service (QOS) support.

The Management Data Input/Output (MDIO) module continuously polls all 32 MDIO addresses in order to enumerate all PHY devices in the system.

The I2C port allows DM6431 to easily control peripheral devices and/or communicate with host processors.

The high-end controller area network (CAN) controller [HECC] module provides a network protocol in a harsh environment to communicate serially with other controllers, typically in automotive applications.

The rich peripheral set provides the ability to control external peripheral devices and communicate with external processors. For details on each of the peripherals, see the related sections later in this document and the associated peripheral reference guides.

The DM6431 has a complete set of development tools. These include C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a Windows™ debugger interface for visibility into source code execution.

The TMS320C64x+™ DSPs (including the TMS320DM6431 device) are the highest-performance fixed-point DSP generation in the TMS320C6000™ DSP platform. The DM6431 device is based on the third-generation high-performance, advanced VelociTI™ very-long-instruction-word (VLIW) architecture developed by Texas Instruments (TI), making these DSPs an excellent choice for digital media applications. The C64x+™ devices are upward code-compatible from previous devices that are part of the C6000™ DSP platform. The C64x™ DSPs support added functionality and have an expanded instruction set from previous devices.

Any reference to the C64x DSP or C64x CPU also applies, unless otherwise noted, to the C64x+ DSP and C64x+ CPU, respectively.

With performance of up to 2400 million instructions per second (MIPS) at a clock rate of 300 MHz, the C64x+ core offers solutions to high-performance DSP programming challenges. The DSP core possesses the operational flexibility of high-speed controllers and the numerical capability of array processors. The C64x+ DSP core processor has 64 general-purpose registers of 32-bit word length and eight highly independent functional units–two multipliers for a 32-bit result and six arithmetic logic units (ALUs). The eight functional units include instructions to accelerate the performance in video and imaging applications. The DSP core can produce four 16-bit multiply-accumulates (MACs) per cycle for a total of 1200 million MACs per second (MMACS), or eight 8-bit MACs per cycle for a total of 2400 MMACS. For more details on the C64x+ DSP, see the TMS320C64x/C64x+ DSP CPU and Instruction Set Reference Guide (literature number SPRU732).

The DM6431 also has application-specific hardware logic, on-chip memory, and additional on-chip peripherals similar to the other C6000 DSP platform devices. The DM6431 core uses a two-level cache-based architecture. The Level 1 program memory/cache (L1P) consists of 32K-byte (KB) memory space that can be configured as mapped memory or direct mapped cache. The Level 1 data/memory memory/cache (L1D) consists of a 64KB memory space that can be configured as mapped memory or 2-way set-associative cache. The Level 2 memory/cache (L2) consists of a 64KB memory space that is shared between program and data space. L2 memory can be configured as mapped memory, cache, or a combination of both.

The peripheral set includes: 1 configurable video port; a 10/100 Mb/s Ethernet MAC (EMAC) with a management data input/output (MDIO) module; an inter-integrated circuit (I2C) Bus interface; a multichannel buffered serial port (McBSP0); a multichannel audio serial port (McASP0) with 4 serializers; 2 64-bit general-purpose timers each configurable as 2 independent 32-bit timers; 1 64-bit watchdog timer; up to 111-pins of general-purpose input/output (GPIO) with programmable interrupt/event generation modes, multiplexed with other peripherals; 1 UART with hardware handshaking support; 3 pulse width modulator (PWM) peripherals; 1 high-end controller area network (CAN) controller [HECC]; and 2 glueless external memory interfaces: an asynchronous external memory interface (EMIFA) for slower memories/peripherals, and a higher speed synchronous memory interface for DDR2.

The DM6431 device includes a Video Processing Subsystem (VPSS) with a Video Processing Front-End (VPFE) input used for video capture.

The Video Processing Front-End (VPFE) is comprised of a CCD Controller (CCDC). The CCDC is capable of interfacing to common video decoders, CMOS sensors, and Charge Coupled Devices (CCDs).

The Ethernet Media Access Controller (EMAC) provides an efficient interface between the DM6431 and the network. The DM6431 EMAC support both 10Base-T and 100Base-TX, or 10 Mbits/second (Mbps) and 100 Mbps in either half- or full-duplex mode, with hardware flow control and quality of service (QOS) support.

The Management Data Input/Output (MDIO) module continuously polls all 32 MDIO addresses in order to enumerate all PHY devices in the system.

The I2C port allows DM6431 to easily control peripheral devices and/or communicate with host processors.

The high-end controller area network (CAN) controller [HECC] module provides a network protocol in a harsh environment to communicate serially with other controllers, typically in automotive applications.

The rich peripheral set provides the ability to control external peripheral devices and communicate with external processors. For details on each of the peripherals, see the related sections later in this document and the associated peripheral reference guides.

The DM6431 has a complete set of development tools. These include C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a Windows™ debugger interface for visibility into source code execution.

下载

No design support from TI available

This product does not have ongoing design support from TI for new projects, such as new content or software updates. If available, you will find relevant collateral, software and tools in the product folder. You can also search for archived information in the TI E2ETM support forums.

技术文档

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类型 标题 下载最新的英文版本 日期
* 数据表 TMS320DM6431 Digital Media Processor 数据表 (Rev. C) 2008年 6月 6日
* 勘误表 TMS320DM6437/35/33/31 DMP Silicon Errata (Revs. 1.3 1.2 1.1 & 1.0) (Rev. E) 2011年 8月 12日
技术文章 Bringing the next evolution of machine learning to the edge 2018年 11月 27日
技术文章 How quality assurance on the Processor SDK can improve software scalability 2018年 8月 22日
技术文章 Clove: Low-Power video solutions based on Sitara™ AM57x processors 2016年 7月 21日
技术文章 TI's new DSP Benchmark Site 2016年 2月 8日
应用手册 Plastic Ball Grid Array [PBGA] Application Note (Rev. B) 2015年 8月 13日
用户指南 TMS320C6000 Assembly Language Tools v 7.3 User's Guide (Rev. W) 2012年 8月 21日
用户指南 TMS320C6000 Optimizing Compiler v 7.3 User's Guide (Rev. U) 2012年 8月 21日
应用手册 Using the TMS320DM643x Bootloader (Rev. E) 2012年 3月 23日
应用手册 Power Consumption Guide for the C66x 2011年 10月 6日
用户指南 TMS320C6000 Programmer's Guide (Rev. K) 2011年 7月 11日
用户指南 TMS320DM643x DMP Inter-Integrated Circuit (I2C) Module User's Guide (Rev. E) 2011年 3月 25日
用户指南 TMS320DM643x DMP DDR2 Memory Controller User's Guide (Rev. C) 2011年 1月 12日
用户指南 TMS320DM643x DMP EMAC/MDIO User's Guide (Rev. C) 2010年 12月 23日
用户指南 TMS320DM643x DMP Video Processing Front End (VPFE) User's Guide (Rev. D) 2010年 8月 25日
用户指南 TMS320DM643x DMP Pulse-Width Modulator (PWM) User's Guide (Rev. B) 2010年 8月 5日
用户指南 TMS320C64x+ DSP Megamodule Reference Guide (Rev. K) 2010年 8月 3日
用户指南 TMS320C64x/C64x+ DSP CPU and Instruction Set Reference Guide (Rev. J) 2010年 7月 30日
应用手册 TMS320DM643x Power Consumption Summary (Rev. C) 2010年 5月 10日
用户指南 TMS320C6000 Assembly Language Tools v 7.0 User's Guide (Rev. S) 2010年 3月 18日
用户指南 TMS320C6000 Optimizing Compiler v 7.0 User's Guide (Rev. Q) 2010年 3月 18日
用户指南 TMS320DM643x DMP Universal Asynchronous Receiver/Transmitter (UART) UG (Rev. C) 2009年 12月 16日
应用手册 常用对象文件格式 (COFF) 2009年 4月 15日
用户指南 TMS320DM643x DMP Asynchronous External Memory Interface User's Guide (Rev. B) 2009年 2月 24日
用户指南 TMS320C64x+ DSP Cache User's Guide (Rev. B) 2009年 2月 11日
应用手册 12Vin DM643x Power using Integrated-FET DCDC Converters and LDO 2008年 10月 9日
应用手册 5Vin DM643x Power using DCDC Controllers and LDO 2008年 10月 9日
应用手册 5Vin DM643x Power using Integrated-FET DCDC Converters and LDO 2008年 10月 9日
应用手册 5Vin DM643x Power using a PMIC (Multi-output DCDC Converter) 2008年 10月 9日
应用手册 EDMA v2.0 to EDMA v3.0 (EDMA3) Migration Guide (Rev. A) 2008年 8月 21日
应用手册 Understanding the Davinci Preview Engine (Rev. A) 2008年 7月 23日
应用手册 Understanding TI’s PCB Routing Rule-Based DDR Timing Specification (Rev. A) 2008年 7月 17日
应用手册 Implementing DDR2 PCB Layout on the TMS320DM643x DMSoC (Rev. A) 2008年 6月 26日
应用手册 How to Use the EDMA3 Driver on a TMS320DM643x Device (Rev. A) 2008年 6月 16日
用户指南 TMS320C6000 Assembly Language Tools v 6.1 User's Guide (Rev. Q) 2008年 5月 15日
用户指南 TMS320C6000 Optimizing Compiler v 6.1 User's Guide (Rev. O) 2008年 5月 15日
用户指南 TMS320C64x+ DSP Image/Video Processing Library (v2.0) Programmer's Reference (Rev. A) 2008年 5月 5日
用户指南 TMS320DM643x DMP General-Purpose Input/Output (GPIO) User's Guide (Rev. B) 2008年 3月 18日
用户指南 TMS320DM643x DMP Multichannel Audio Serial Port (McASP) User's Guide (Rev. D) 2008年 3月 13日
用户指南 TMS320C64x+ DSP Little-Endian Library Programmer's Reference (Rev. B) 2008年 3月 6日
用户指南 TMS320DM643x DMP Enhanced DMA (EDMA) Controller User's Guide (Rev. A) 2008年 3月 3日
用户指南 TMS320DM643x DMP DSP Subsystem Reference Guide (Rev. E) 2008年 2月 5日
应用手册 How to Use the VPBE and VPFE Driver on the TMS320DM643x Devices (Rev. A) 2007年 11月 14日
用户指南 TMS320DM643x DMP Multichannel Buffered Serial Port (McBSP) User's Guide (Rev. C) 2007年 9月 17日
应用手册 TMS320DM643x Pin Multiplexing Utility 2007年 7月 6日
用户指南 TMS320DM643x DMP Peripherals Overview Reference Guide (Rev. A) 2007年 6月 25日
应用手册 Thermal Considerations Application Report 2007年 5月 20日
用户指南 TMS320DM643x DMP High-End CAN Controller (HECC) User's Guide (Rev. A) 2007年 5月 15日
更多文献资料 TMS320C6000 DSP TCP/IP Stack Software (Rev. C) 2007年 4月 4日
更多文献资料 DaVinci Technology - Digital Video Innovation Product Bulletin (Rev. D) 2007年 2月 13日
更多文献资料 Overview of DaVinci™ TMS320DM643x Digital Media Portfolio (Rev. B) 2007年 2月 13日
应用手册 DaVinci Technology Background and Specifications (Rev. A) 2007年 1月 4日
用户指南 TMS320DM425 DMSoC 64-bit Timer Reference Guide 2006年 12月 18日
用户指南 TMS320C64x+ DSP Big-Endian Library Programmer's Reference 2006年 3月 10日
用户指南 TMS320C64x+ Image/Video Processing Library Programmer's Reference 2006年 3月 10日
应用手册 TMS320C64x to TMS320C64x+ CPU Migration Guide (Rev. A) 2005年 10月 20日

设计与开发

有关其他条款或所需资源,请点击下面的任何链接来查看详情页面。

调试探针

TMDSEMU200-U — Spectrum Digital XDS200 USB 仿真器

Spectrum Digital XDS200 是最新 XDS200 系列 TI 处理器调试探针(仿真器)的首个模型。XDS200 系列拥有超低成本 XDS100 与高性能 XDS560v2 之间的低成本与高性能的完美平衡。此外,对于带有嵌入式缓冲跟踪器 (ETB) 的所有 ARM 和 DSP 处理器,所有 XDS 调试探针均支持内核和系统跟踪。

Spectrum Digital XDS200 通过 TI 20 引脚连接器(带有适合 TI 14 引脚、TI 10 引脚和 ARM 20 引脚的多个适配器)连接到目标板,而通过 USB2.0 高速连接 (480Mbps) 连接到主机 PC。要在主机 PC 上运行,还需要 Code Composer Studio™ IDE 许可证。

(...)

现货
数量限制: 3
调试探针

TMDSEMU560V2STM-U — Blackhawk XDS560v2 系统跟踪 USB 仿真器

XDS560v2 System Trace 是 XDS560v2 系列高性能 TI 处理器调试探针(仿真器)的第一种型号。XDS560v2 是 XDS 系列调试探针中性能最高的一款,同时支持传统 JTAG 标准 (IEEE1149.1) 和 cJTAG (IEEE1149.7)。

XDS560v2 System Trace 在其巨大的外部存储器缓冲区中加入了系统引脚跟踪。这种外部存储器缓冲区适用于指定的 TI 器件,通过捕获相关器件级信息,获得准确的总线性能活动和吞吐量,并对内核和外设进行电源管理。此外,对于带有嵌入式缓冲跟踪器 (ETB) 的所有 ARM 和 DSP 处理器,所有 XDS 调试探针均支持内核和系统跟踪。

Blackhawk XDS560v2 System Trace 通过 MIPI HSPT 60 引脚连接器(带有适合 TI 14 引脚、TI 20 引脚和 ARM 20 (...)

现货
数量限制: 1
调试探针

TMDSEMU560V2STM-UE — Spectrum Digital XDS560v2 系统跟踪 USB 和以太网

XDS560v2 System Trace 是 XDS560v2 系列高性能 TI 处理器调试探针(仿真器)的第一种型号。XDS560v2 是 XDS 系列调试探针中性能最高的一款,同时支持传统 JTAG 标准 (IEEE1149.1) 和 cJTAG (IEEE1149.7)。

XDS560v2 System Trace 在其巨大的外部存储器缓冲区中加入了系统引脚跟踪。这种外部存储器缓冲区适用于指定的 TI 器件,通过捕获相关器件级信息,获得准确的总线性能活动和吞吐量,并对内核和外设进行电源管理。此外,对于带有嵌入式缓冲跟踪器 (ETB) 的所有 ARM 和 DSP 处理器,所有 XDS 调试探针均支持内核和系统跟踪。

Spectrum Digital XDS560v2 System Trace 通过 MIPI HSPT 60 引脚连接器(适合 TI 14 引脚、TI 20 引脚、ARM 20 引脚和 TI 60 (...)

现货
数量限制: 1
应用软件和框架

TMDMFP — 多媒体框架产品 (MFP) - 编解码器引擎,框架组件和 xDAIS

Multimedia Framework Products (MFP)

A major advantage of programmable DSPs over fixed-function devices is their ability to accelerate multiple multimedia functions in a single device. TI multimedia framework products are designed to enable users to easily share a DSP between algorithms by handling (...)

驱动程序或库

SPRC122 — C62x/C64x 快速运行时支持 (RTS) 库

C62x/64x FastRTS Library 是优化型浮点函数库,适用于使用 TMS320C62x 或 TMS320C64x 器件的 C 语言编程器。这些例程通常用于计算密集型实时应用,在这些应用中,提高执行速度至关重要。通过将当前的浮点库 (RTS) 函数替换为 FastRTS Library,可以在不重写现有代码的情况下大大加快执行速度。

该版本还包括 FastRTS Library 中可用函数子集的 C 语言实施。C 代码可让用户内联这些函数并获得更高性能。

特性

单精度和双精度数学函数 单精度和双精度转换函数
浮点加法 将浮点值转换为 32 位带符号整数值
将 32 位带符号整数值转换为浮点值
浮点减法 将浮点值转换为 40 位带符号长整数值
将 40 位带符号长整数值转换为浮点值
浮点乘法 将浮点值转换为 32 位无符号整数值
将 32 位无符号整数值转换为浮点值
浮点倒数 将浮点值转换为 40 位无符号长整数值
将 40 位无符号长整数值转换为浮点值
浮点减法 将双精度浮点值转换为单精度浮点值
将单精度浮点值转换为双精度浮点值
驱动程序或库

TELECOMLIB — 用于 TMS320C64x+ 和 TMS320C55x 处理器的电信和媒体库 - FAXLIB、VoLIB 和 AEC/AER

软件编解码器

TMDXDAISXDM — eXpressDSP 算法标准 – xDAIS 开发者套件和 xDM

xDAIS and xDM

The eXpressDSP™ Algorithm Interoperability Standard (xDAIS) and the eXpressDSP Digital Media (xDM) standard fully leverage the ability of DSPs to perform a wide range of multimedia functions on a single device. eXpressDSP compliance is achieved by adhering to these standards. To (...)

仿真模型

DM6431 ZWT BSDL Model

SPRM224.ZIP (9 KB) - BSDL Model
仿真模型

DM6431 ZDU BSDL Model

SPRM225.ZIP (10 KB) - BSDL Model
仿真模型

DM6431 ZWT IBIS Model (Rev. B)

SPRM236B.ZIP (267 KB) - IBIS Model
仿真模型

DM6431 ZDU IBIS Model (Rev. B)

SPRM237B.ZIP (267 KB) - IBIS Model
设计工具

PROCESSORS-3P-SEARCH — Arm-based MPU, arm-based MCU and DSP third-party search tool

TI has partnered with companies to offer a wide range of software, tools, and SOMs using TI processors to accelerate your path to production. Download this search tool to quickly browse our third-party solutions and find the right third-party to meet your needs. The software, tools and modules (...)
封装 引脚 下载
BGA (ZDU) 376 了解详情
NFBGA (ZWT) 361 了解详情

订购与质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/FIT 估算
  • 材料成分
  • 认证摘要
  • 持续可靠性监测

支持与培训

视频