SLVAG11 March   2026 TPS1200-Q1 , TPS1210-Q1 , TPS1211-Q1 , TPS1212-Q1 , TPS1213-Q1 , TPS1214-Q1 , TPS1H000-Q1 , TPS1H100-Q1 , TPS1H200A-Q1 , TPS1HA08-Q1 , TPS1HB08-Q1 , TPS1HB16-Q1 , TPS1HB35-Q1 , TPS1HB50-Q1 , TPS1HC04-Q1 , TPS1HC08-Q1 , TPS1HC100-Q1 , TPS1HC120-Q1 , TPS1HC30-Q1 , TPS1HTC100-Q1 , TPS1HTC30-Q1 , TPS272C45 , TPS274160 , TPS274C65 , TPS274C65CP , TPS27S100 , TPS27SA08 , TPS27SA08-Q1 , TPS281C100 , TPS281C30 , TPS2H000-Q1 , TPS2H160-Q1 , TPS2HB16-Q1 , TPS2HB35-Q1 , TPS2HB50-Q1 , TPS2HC08-Q1 , TPS2HC120-Q1 , TPS2HC16-Q1 , TPS2HCS05-Q1 , TPS2HCS08-Q1 , TPS2HCS10-Q1 , TPS4800-Q1 , TPS4810-Q1 , TPS4811-Q1 , TPS4812-Q1 , TPS4813-Q1 , TPS4816-Q1 , TPS482H85-Q1 , TPS4H000-Q1 , TPS4H160-Q1 , TPS4HC120-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
    1. 1.1 High-Side Switches Compared to Other Power Switch ICs
      1. 1.1.1 Discrete High-Side Implementations
        1. 1.1.1.1 Level One: NFET-Controlled PFET
        2. 1.1.1.2 Level Two: NFET with a Step-Up Converter
        3. 1.1.1.3 Level Three: NFET, Step-Up Converter and Discretely Implemented Protections and Diagnostics
      2. 1.1.2 Comparison to Load Switches
      3. 1.1.3 Comparison to Hot-Swap Controllers and eFuses (Integrated Hot Swaps)
      4. 1.1.4 Comparison to Motor Drivers and Gate Drivers
      5. 1.1.5 Summary
    2. 1.2 Common Automotive and Industrial Standards
      1. 1.2.1 Typical Automotive Voltage Ranges
      2. 1.2.2 Typical Industrial Voltage Ranges
      3. 1.2.3 Automotive Qualifications and Standards
      4. 1.2.4 Industrial Qualifications and Standards
  5. 2Architectural and Application Differences of High-Side Switches and Controllers
    1. 2.1 Architecture Differences
    2. 2.2 Application Differences
      1. 2.2.1 Load Driving
      2. 2.2.2 Input Protection and Circuit Breaking
    3. 2.3 Summary and Product Family Selection Matrix
  6. 3Core Features of High-Side Switches and Controllers
    1. 3.1 Protection Features
      1. 3.1.1 Overcurrent Protection
      2. 3.1.2 Thermal Shutdown
        1. 3.1.2.1 Absolute Thermal Shutdown
        2. 3.1.2.2 Relative Thermal Shutdown
        3. 3.1.2.3 Undervoltage Lockout and Overvoltage Lockout (UVLO and OVLO)
        4. 3.1.2.4 Inductive Clamping
      3. 3.1.3 Reverse Polarity Protection
        1. 3.1.3.1 Ground Networks
        2. 3.1.3.2 Reverse Polarity and Reverse Current Protection in High-Side Switch Controllers
    2. 3.2 Diagnostic Features
      1. 3.2.1 Analog Current Sense
      2. 3.2.2 Open Load and Short-to-Battery Detection
      3. 3.2.3 Junction Temperature Sensing
      4. 3.2.4 Input and Output Voltage Sensing
  7. 4Specialized Features
    1. 4.1 Capacitive Charging Features
    2. 4.2 Serial Communication and Corresponding Features
    3. 4.3 Features for Industrial Systems: Enhanced EFT, Reverse Current Blocking, LED Driving
    4. 4.4 Additional Specialized Features
      1. 4.4.1 Integrated Watchdog Timer
      2. 4.4.2 Cyclic Redundancy Check (CRC)
      3. 4.4.3 Steady-State Programmable PWM Switching
    5. 4.5 Smart eFuse High-Side Switch Protection Features
      1. 4.5.1 Energy Management with Programmable Time-Current Characteristics (I2T)
      2. 4.5.2 Power Optimization Through Low-Power Mode
      3. 4.5.3 Memory Retention After Power Cycling (NVM or EEPROM)
  8. 5Summary
  9. 6References

1.1.1 Discrete High-Side Implementations

High-side switching can be implemented with a MOSFET and discrete control circuitry. To compare the solution complexity of discrete and integrated circuits, Section 1 reviews three levels of discrete implementation of a high-side switch, from simplest to most complex.

Table 1-1 Comparison of Discrete High-Side Implementations
Level One: NFET-Controlled PFET Level Two: NFET with a Step-Up Converter Level Three: NFET, Step-Up Converter, Discrete Protections High-Side Switch
Implementation Discrete Discrete Discrete Integrated
Summary Poor thermal performance
Large FET size
High power dissipation		 Average thermal performance
High power dissipation		 Large design size
Complex design		 Compact design size
Thermally efficient packaging
Integrated protections with minimal external components