ZHCSNC8A February   2021  – March 2021 TPS541620

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Fixed-Frequency, Internally Compensated Advanced-Current-Mode Control
      2. 7.3.2  Enable and UVLO
      3. 7.3.3  Internal LDO
      4. 7.3.4  Pre-biased Output Start-up
      5. 7.3.5  Current Sharing
      6. 7.3.6  Frequency Selection and Minimum On-Time and Off-Time
      7. 7.3.7  Ramp Compensation Selection
      8. 7.3.8  Soft Start
      9. 7.3.9  Remote Sense Function
      10. 7.3.10 Adjustable Output Voltage
      11. 7.3.11 Power Good
      12. 7.3.12 Overcurrent Protection
      13. 7.3.13 Overvoltage and Undervoltage Protection
      14. 7.3.14 Overtemperature Protection
      15. 7.3.15 Frequency Synchronization
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation Mode
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application - Dual Independent Outputs
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Switching Frequency
        2. 8.2.2.2  Output Inductor Selection
        3. 8.2.2.3  Output Capacitor
        4. 8.2.2.4  Input Capacitor
        5. 8.2.2.5  Output Voltage Resistors Selection
        6. 8.2.2.6  Adjustable Undervoltage Lockout
        7. 8.2.2.7  Bootstrap Capacitor Selection
        8. 8.2.2.8  BP5 Capacitor Selection
        9. 8.2.2.9  PGOOD Pullup Resistor
        10. 8.2.2.10 Current Limit
        11. 8.2.2.11 Soft-Start Time Selection
        12. 8.2.2.12 MODE1 and MODE2 Pins
      3. 8.2.3 Application Curves
      4. 8.2.4 Typical Application - 2-Phase Operation
        1. 8.2.4.1 Design Requirements
        2. 8.2.4.2 Detailed Design Procedure
          1. 8.2.4.2.1  Switching Frequency
          2. 8.2.4.2.2  Output Inductor Selection
          3. 8.2.4.2.3  Output Capacitor
          4. 8.2.4.2.4  Input Capacitor
          5. 8.2.4.2.5  Output Voltage Resistors Selection
          6. 8.2.4.2.6  Adjustable Undervoltage Lockout
          7. 8.2.4.2.7  Bootstrap Capacitor Selection
          8. 8.2.4.2.8  BP5 Capacitor Selection
          9. 8.2.4.2.9  PGOOD Pullup Resistor
          10. 8.2.4.2.10 Current Limit
          11. 8.2.4.2.11 Soft-Start Time Selection
          12. 8.2.4.2.12 MODE1 Pin
        3. 8.2.4.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
      1. 10.2.1 Thermal Performance
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 第三方产品免责声明
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 静电放电警告
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Absolute Maximum Ratings

over operating junction temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Input Voltage PVIN –0.3 16 V
Input Voltage PVIN to SW1, PVIN to SW2 (10 ns) –0.3 18 V
Output Voltage SW1, SW2 –0.3 16 V

Output Voltage

SW1, SW2 transients (10 ns) –3 18 V

Output Voltage

BP5 –0.3 6 V
Input Voltage BOOT1 – SW1, BOOT2 – SW2 –0.3 6 V
Input Voltage FB1, FB2/ISHARE –0.3 6 V
Input Voltage PGOOD1, PGOOD2/CLKO –0.3 6 V
Output Voltage EN1, EN2/VSHARE –0.3 6 V
Input Voltage MODE1, MODE2, SS, SYNC –0.3 6 V
TJ Junction temperature –40 150 °C
Tstg Storage temperature –65 150 °C
Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.