SLLSFZ8 November   2025 MCF8329HS-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings Auto
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Characteristics of the SDA and SCL bus for Standard and Fast mode
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Three Phase BLDC Gate Drivers
      2. 7.3.2  Gate Drive Architecture
        1. 7.3.2.1 Dead time and Cross Conduction Prevention
      3. 7.3.3  AVDD Linear Voltage Regulator
      4. 7.3.4  Low-Side Current Sense Amplifier
      5. 7.3.5  Device Interface Modes
        1. 7.3.5.1 Interface - Control and Monitoring
        2. 7.3.5.2 I2C Interface
      6. 7.3.6  Motor Control Input Options
        1. 7.3.6.1 Analog-Mode Motor Control
        2. 7.3.6.2 PWM-Mode Motor Control
        3. 7.3.6.3 Frequency-Mode Motor Control
        4. 7.3.6.4 I2C based Motor Control
        5. 7.3.6.5 Input Control Signal Profiles
          1. 7.3.6.5.1 Linear Control Profiles
          2. 7.3.6.5.2 Staircase Control Profiles
          3. 7.3.6.5.3 Forward-Reverse Profiles
          4. 7.3.6.5.4 Multi-Reference Mode Operation
          5. 7.3.6.5.5 Input Reference Transfer Function without Profiler
      7. 7.3.7  Bootstrap Capacitor Initial Charging
      8. 7.3.8  Starting the Motor Under Different Initial Conditions
        1. 7.3.8.1 Case 1 – Motor is Stationary
        2. 7.3.8.2 Case 2 – Motor is Spinning in the Forward Direction
        3. 7.3.8.3 Case 3 – Motor is Spinning in the Reverse Direction
      9. 7.3.9  Motor Start Sequence (MSS)
        1. 7.3.9.1 Initial Speed Detect (ISD)
        2. 7.3.9.2 Motor Resynchronization
        3. 7.3.9.3 Reverse Drive
          1. 7.3.9.3.1 Reverse Drive Tuning
        4. 7.3.9.4 Motor Start-up
          1. 7.3.9.4.1 Align
          2. 7.3.9.4.2 Double Align
          3. 7.3.9.4.3 Initial Position Detection (IPD)
            1. 7.3.9.4.3.1 IPD Operation
            2. 7.3.9.4.3.2 IPD Release
            3. 7.3.9.4.3.3 IPD Advance Angle
          4. 7.3.9.4.4 Slow First Cycle Startup
          5. 7.3.9.4.5 Open Loop
          6. 7.3.9.4.6 Transition from Open to Closed Loop
      10. 7.3.10 Closed Loop Operation
        1. 7.3.10.1 Closed loop accelerate
        2. 7.3.10.2 Speed PI Control
        3. 7.3.10.3 Current PI Control
        4. 7.3.10.4 Overmodulation
        5. 7.3.10.5 Power Loop
        6. 7.3.10.6 Modulation Index Control
        7. 7.3.10.7 Motor Speed Limit
        8. 7.3.10.8 Input DC Power Limit
      11. 7.3.11 Maximum Torque Per Ampere (MTPA) Control
      12. 7.3.12 Flux Weakening Control
      13. 7.3.13 Motor Parameters
        1. 7.3.13.1 Motor Resistance
        2. 7.3.13.2 Motor Inductance
        3. 7.3.13.3 Motor Back-EMF constant
      14. 7.3.14 Motor Parameter Extraction Tool (MPET)
      15. 7.3.15 Single Hall Sensor Operation
      16. 7.3.16 Anti-Voltage Surge (AVS)
      17. 7.3.17 Active Braking
      18. 7.3.18 Output PWM Switching Frequency
      19. 7.3.19 Dead Time Compensation
      20. 7.3.20 Voltage Sense Scaling
      21. 7.3.21 Motor Stop Options
        1. 7.3.21.1 Coast (Hi-Z) Mode
        2. 7.3.21.2 Recirculation Mode
        3. 7.3.21.3 Low-Side Braking
        4. 7.3.21.4 Active Spin-Down
      22. 7.3.22 FG Configuration
        1. 7.3.22.1 FG Output Frequency
        2. 7.3.22.2 FG in Open-Loop
        3. 7.3.22.3 FG During Motor Stop
        4. 7.3.22.4 FG Behavior During Fault
      23. 7.3.23 Protections
        1. 7.3.23.1  PVDD Supply Undervoltage Lockout (PVDD_UV)
        2. 7.3.23.2  AVDD Power on Reset (AVDD_POR)
        3. 7.3.23.3  GVDD Undervoltage Lockout (GVDD_UV)
        4. 7.3.23.4  BST Undervoltage Lockout (BST_UV)
        5. 7.3.23.5  MOSFET VDS Overcurrent Protection (VDS_OCP)
        6. 7.3.23.6  VSENSE Overcurrent Protection (SEN_OCP)
        7. 7.3.23.7  Thermal Shutdown (OTSD)
        8. 7.3.23.8  Hardware Lock Detection Current Limit (HW_LOCK_ILIMIT)
          1. 7.3.23.8.1 HW_LOCK_ILIMIT Latched Shutdown (HW_LOCK_ILIMIT_MODE = 00xb or 010b)
          2. 7.3.23.8.2 HW_LOCK_ILIMIT Automatic recovery (HW_LOCK_ILIMIT_MODE = 011b or 10xb)
          3. 7.3.23.8.3 HW_LOCK_ILIMIT Report Only (HW_LOCK_ILIMIT_MODE = 110b)
          4. 7.3.23.8.4 HW_LOCK_ILIMIT Disabled (HW_LOCK_ILIMIT_MODE = 111b)
        9. 7.3.23.9  Lock Detection Current Limit (LOCK_ILIMIT)
          1. 7.3.23.9.1 LOCK_ILIMIT Latched Shutdown (LOCK_ILIMIT_MODE = 00xb or 010b)
          2. 7.3.23.9.2 LOCK_ILIMIT Automatic Recovery (LOCK_ILIMIT_MODE = 011b or 10xb)
          3. 7.3.23.9.3 LOCK_ILIMIT Report Only (LOCK_ILIMIT_MODE = 110b)
          4. 7.3.23.9.4 LOCK_ILIMIT Disabled (LOCK_ILIMIT_MODE = 111b)
        10. 7.3.23.10 Motor Lock (MTR_LCK)
          1. 7.3.23.10.1 MTR_LCK Latched Shutdown (MTR_LCK_MODE = 00xb or 010b)
          2. 7.3.23.10.2 MTR_LCK Automatic Recovery (MTR_LCK_MODE = 011b or 10xb)
          3. 7.3.23.10.3 MTR_LCK Report Only (MTR_LCK_MODE = 110b)
          4. 7.3.23.10.4 MTR_LCK Disabled (MTR_LCK_MODE = 111b)
        11. 7.3.23.11 Motor Lock Detection
          1. 7.3.23.11.1 Lock 1: Abnormal Speed (ABN_SPEED)
          2. 7.3.23.11.2 Lock 2: Abnormal BEMF (ABN_BEMF)
          3. 7.3.23.11.3 Lock3: No-Motor Fault (NO_MTR)
        12. 7.3.23.12 MPET Faults
        13. 7.3.23.13 IPD Faults
        14. 7.3.23.14 Dry Run Detection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Functional Modes
        1. 7.4.1.1 Sleep Mode
        2. 7.4.1.2 Standby Mode
        3. 7.4.1.3 Fault Reset (CLR_FLT)
    5. 7.5 External Interface
      1. 7.5.1 DRVOFF - Gate Driver Shutdown Functionality
      2. 7.5.2 Oscillator Source
      3. 7.5.3 External Watchdog with MCU Reset
    6. 7.6 EEPROM access and I2C interface
      1. 7.6.1 EEPROM Access
        1. 7.6.1.1 EEPROM Write
        2. 7.6.1.2 EEPROM Read
        3. 7.6.1.3 EEPROM Security
      2. 7.6.2 I2C Serial Interface
        1. 7.6.2.1 I2C Data Word
        2. 7.6.2.2 I2C Write Operation
        3. 7.6.2.3 I2C Read Operation
        4. 7.6.2.4 Examples of I2C Communication Protocol Packets
        5. 7.6.2.5 Internal Buffers
        6. 7.6.2.6 CRC Byte Calculation
  9. 8 EEPROM (Non-Volatile) Register Map
    1. 8.1 Algorithm_Configuration Registers
    2. 8.2 Fault_Configuration Registers
    3. 8.3 Hardware_Configuration Registers
    4. 8.4 Internal_Algorithm_Configuration Registers
  10. 9 RAM (Volatile) Register Map
    1. 9.1 Fault_Status Registers
    2. 9.2 System_Status Registers
    3. 9.3 Algorithm_Control Registers
    4. 9.4 Device_Control Registers
    5. 9.5 Algorithm_Variables Registers
  11. 10Typical Applications
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1.      Detailed Design Procedure
      2.      Bootstrap Capacitor and GVDD Capacitor Selection
      3.      Gate Drive Current
      4.      Gate Resistor Selection
      5.      System Considerations in High Power Designs
      6.      Capacitor Voltage Ratings
      7.      External Power Stage Components
    3. 10.3 Power Supply Recommendations
      1. 10.3.1 Bulk Capacitance
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
      3. 10.4.3 Thermal Considerations
        1. 10.4.3.1 Power Dissipation
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  13. 12Mechanical, Packaging, and Orderable Information

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7.6.2.1 I2C Data Word

The I2C data word format is shown in Table 7-9.

Table 7-9 I2C Data Word Format
TARGET_IDR/WCONTROL WORDDATACRC-8
A6 - A0W0CW23 - CW0D15 / D31/ D63 - D0C7 - C0

Target ID and R/W Bit: The first byte includes the 7-bit I2C target ID (0x01), followed by the read/write command bit. Every packet in MCF8329HS-Q1 the communication protocol starts with writing a 24-bit control word and hence the R/W bit is always 0.

24-bit Control Word: The Target Address is followed by a 24-bit control bit. The control word format is shown in Table 7-10.

Table 7-10 24-bit Control Word Format
OP_R/WCRC_ENDLENMEM_SECMEM_PAGEMEM_ADDR
CW23CW22CW21- CW20CW19 - CW16CW15 - CW12CW11 - CW0

Each field in the control word is explained in detail below.

OP_R/W – Read/Write: R/W bit gives information on whether this is a read operation or write operation. Bit value 0 indicates it is a write operation. Bit value 1 indicates it is a read operation. For write operation, MCF8329HS-Q1 will expect data bytes to be sent after the 24-bit control word. For read operation, MCF8329HS-Q1 will expect an I2C read request with repeated start or normal start after the 24-bit control word.

CRC_EN – Cyclic Redundancy Check(CRC) Enable: MCF8329HS-Q1 supports CRC to verify the data integrity. This bit controls whether the CRC feature is enabled or not.

DLEN – Data Length: DLEN field determines the length of the data that will be sent by external MCU to MCF8329HS-Q1. MCF8329HS-Q1 protocol supports three data lengths: 16-bit, 32-bit and 64-bit.

Table 7-11 Data Length Configuration
DLEN ValueData Length
00b16-bit
01b32-bit
10b64-bit
11bReserved

MEM_SEC – Memory Section: Each memory location in MCF8329HS-Q1 is addressed using three separate entities in the control word – Memory Section, Memory Page, Memory Address. Memory Section is a 4-bit field which denotes the memory section to which the memory location belongs like RAM, ROM etc.

MEM_PAGE – Memory Page: Memory page is a 4-bit field which denotes the memory page to which the memory location belongs.

MEM_ADDR – Memory Address: Memory address is the last 12-bits of the address. The complete 22-bit address is constructed internally by MCF8329HS-Q1 using all three fields – Memory Section, Memory Page, Memory Address. For memory locations 0x000000-0x000800, memory section is 0x0, memory page is 0x0 and memory address is the lowest 12 bits(0x000 for 0x000000, 0x080 for 0x000080 and 0x800 for 0x000800)

Data Bytes: For a write operation to MCF8329HS-Q1, the 24-bit control word is followed by data bytes. The DLEN field in the control word should correspond with the number of bytes sent in this section.

CRC Byte: If the CRC feature is enabled in the control word, CRC byte has to be sent at the end of a write transaction. Procedure to calculate CRC is explained in CRC Byte Calculation below.