10 Revision History
Changes from January 8, 2024 to March 15, 2024 (from Revision A (January 2024) to Revision B (March 2024))
-
通篇:添加了 ZCZ_F 封装的引脚和信号信息Go
- (特性):添加了有关采用 SIP 封装的 OSPI 闪存器件的信息Go
- (应用):重新排列了链接并删除了“通用控制器”Go
- (Device Comparison): Corrected footnote for EHRPWM AM263P4 device from note "2" to note "3"Go
- (Device Comparison): Added JTAG Device ID'sGo
- (Related Products): Added reference to AM263P SDKGo
- (Related Products): Conditioned out AM263P Launchpad reference until the LP is availableGo
- Pin Attributes: Changed crystal power reference from "VDDS_OSC" to "VDDA18_OSC_PLL"Go
- (OSPI Connections for Flash in Package (ZCZ_F)): Added applications chapter covering ZCZ_F OSPI connectionsGo
Changes from October 1, 2023 to January 8, 2024 (from Revision * (October 2023) to Revision A (January 2024))
- (特性):更新了 OptiFlash 存储器技术品牌Go
- (特性):添加了有关推荐的 PMIC 解决方案的详细信息Go
- (特性):添加了有关 SIP 器件的详细信息Go
- (特性):将“高达 140 个 GPIO”更改为“高达 139 个 GPIO”Go
- (特性):添加了对 MII 的支持Go
- (Device Comparison): Added details on SIP packageGo
- (Device Comparison): Changed "Up to 140" in GPIO row to "Up to 139"Go
- (ADC-CMPSS Signal Connections): Added image and paragraph to explain ADC-CMPSS Signal ConnectionsGo
- (ADC-CMPSS Signal Connections): Fixed note for clarity purposes.Go
- (Recommended Operating Conditions): Added SIP package T_J
details.Go
- (SAFETY_ERRORn Switching Characteristics): Updated table note reference from "RST22" to "SFTY3"Go
- (CPSW RGMII[x]_TXC, RGMII[x]_TD[3:0], and RGMII[x]_TX_CTL Switching Characteristics - RGMII Mode): Updated table note on internal delay from "always enabled" to "by default enabled after POR."Go
- (CPSW RGMII[x]_TXC, RGMII[x]_TD[3:0], and RGMII[x]_TX_CTL Switching Characteristics - RGMII Mode): Fixed typoGo