ZHCSI27C April   2018  – October 2021 LM5036

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  High-Voltage Start-Up Regulator
      2. 7.3.2  Undervoltage Lockout (UVLO)
      3. 7.3.3  Reference Regulator
      4. 7.3.4  Oscillator, Synchronized Input
      5. 7.3.5  Voltage-Mode Control
      6. 7.3.6  Primary-Side Gate Driver Outputs (LSG and HSG)
      7. 7.3.7  Half-Bridge PWM Scheme
      8. 7.3.8  Maximum Duty Cycle Operation
      9. 7.3.9  Pre-Biased Start-Up Process
        1. 7.3.9.1 Primary FETs Soft-Start Process
        2. 7.3.9.2 Synchronous Rectifier (SR) Soft-Start Process
      10. 7.3.10 Zero Duty Cycle Operation
      11. 7.3.11 Enhanced Cycle-by-Cycle Current Limiting with Pulse Matching
      12. 7.3.12 Reverse Current Protection
      13. 7.3.13 CBC Threshold Accuracy
      14. 7.3.14 Hiccup Mode Protection
      15. 7.3.15 Hiccup Mode Blanking
      16. 7.3.16 Over-Temperature Protection (OTP)
      17. 7.3.17 Over-Voltage / Latch (ON_OFF Pin)
      18. 7.3.18 Auxiliary Constant On-Time Control
      19. 7.3.19 Auxiliary On-Time Generator
      20. 7.3.20 Auxiliary Supply Current Limiting
      21. 7.3.21 Auxiliary Primary Output Capacitor Ripple
      22. 7.3.22 Auxiliary Ripple Configuration and Control
      23. 7.3.23 Asynchronous Mode Operation of Auxiliary Supply
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Custom Design With WEBENCH® Tools
        2. 8.2.2.2  Input Transient Protection
        3. 8.2.2.3  Level-Shift Detection Circuit
        4. 8.2.2.4  Applications with VIN > 100-V
        5. 8.2.2.5  Applications without Pre-Biased Start-Up Requirement
        6. 8.2.2.6  UVLO Voltage Divider Selection
        7. 8.2.2.7  Over Voltage, Latch (ON_OFF Pin) Voltage Divider Selection
        8. 8.2.2.8  SS Capacitor
        9. 8.2.2.9  SSSR Capacitor
        10. 8.2.2.10 Half-Bridge Power Stage Design
        11. 8.2.2.11 Current Limit
        12. 8.2.2.12 Auxiliary Transformer
        13. 8.2.2.13 Auxiliary Feedback Resistors
        14. 8.2.2.14 RON Resistor
        15. 8.2.2.15 VIN Pin Capacitor
        16. 8.2.2.16 Auxiliary Primary Output Capacitor
        17. 8.2.2.17 Auxiliary Secondary Output Capacitor
        18. 8.2.2.18 Auxiliary Feedback Ripple Circuit
        19. 8.2.2.19 Auxiliary Secondary Diode
        20. 8.2.2.20 VCC Diode
        21. 8.2.2.21 Opto-Coupler Interface
        22. 8.2.2.22 Full-Bridge Converter Applications
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Custom Design With WEBENCH® Tools
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
        1. 11.2.1.1 Receiving Notification of Documentation Updates
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information

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7.3.6 Primary-Side Gate Driver Outputs (LSG and HSG)

The LM5036 device provides two gate driver outputs for the primary FETs of the main half-bridge converter: one floating high-side gate driver output HSG and one ground referenced low-side gate driver output LSG. Each internal gate driver is capable of sourcing 1-A peak and sinking 2-A peak (typical). Initially, the LSG output is turned on during the power transfer phase, followed by a freewheeling period during which both LSG and HSG outputs are turned off. In the subsequent power transfer phase, the HSG output is turned on followed by another freewheeling period.

The low-side LSG gate driver is powered directly by the VCC bias supply. The HSG gate driver is powered from a bootstrap capacitor connected between BST and SW. An external diode connected between VCC and BST provides the high-side gate driver power by charging the bootstrap capacitor from VCC when the switching node SW is low. When the high side FET is turned on, BST rises to a peak voltage equal to VCC + VIN.

The BST and VCC capacitors should be placed close to the pins of the LM5036 device to minimize voltage transients due to parasitic inductance because the peak current source to the MOSFET gates can exceed 1 A (typical). The recommended value of the BST capacitor is 0.1-µF or greater. A low ESR/ESL capacitor, such as a surface mount ceramic, should be used to prevent voltage drop during the HSG transitions.