ZHCSA85F August   2012  – February 2019 DLPC410

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化应用
  4. 4 修订历史记录
  5. 5 说明 （续）
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Electrical Characteristics
    5. 7.5 Timing Requirements
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 DLPC410 Binary Pattern Data Path
        1. 8.3.1.1  DIN_A, DIN_B, DIN_C, DIN_D Input Data Buses
        2. 8.3.1.2  DCLKIN Input Clocks
        3. 8.3.1.3  DVALID Input Signals
        4. 8.3.1.4  DOUT_A, DOUT_B, DOUT_C, DOUT_D Output Data Buses
        5. 8.3.1.5  DCLKOUT Output Clocks
        6. 8.3.1.6  SCTRL Output Signals
        7. 8.3.1.7  Supported DMD Bus Sizes
        8. 8.3.1.8  Row Cycle definition
        9. 8.3.1.9  DLP9500 and DLP9500UV Input Data Formatting
        10. 8.3.1.10 DLP7000 and DLP7000UV Input Data Bus
        11. 8.3.1.11 DLP650LNIR Input Data Bus
      2. 8.3.2 Data Bus Operations
        1. 8.3.2.1 Row Addressing
        2. 8.3.2.2 Single Row Write Operation
        3. 8.3.2.3 No-Op Row Cycle Description
      3. 8.3.3 DMD Block Operations
        1. 8.3.3.1 Mirror Clocking Pulse (MCP)
        2. 8.3.3.2 Reset Active (RST_ACTIVE)
        3. 8.3.3.3 DMD Block Control Signals
          1. 8.3.3.3.1 Block Mode - BLK_MD1:0)
          2. 8.3.3.3.2 Block Address - BLK_AD(3:0)
          3. 8.3.3.3.3 Reset 2 Blocks - RST2BLK
        4. 8.3.3.4 DMD Block Operations
          1. 8.3.3.4.1 Global Reset (MCP) Consideration
      4. 8.3.4 Other Data Control Inputs
        1. 8.3.4.1 Complement Data
        2. 8.3.4.2 North/South Flip
      5. 8.3.5 Miscellaneous Control Inputs
        1. 8.3.5.1 ARST
        2. 8.3.5.2 CLKIN_R
        3. 8.3.5.3 DMD_A_RESET
        4. 8.3.5.4 Watchdog Timer Enable (WDT_ENABLE)
      6. 8.3.6 Miscellaneous Status Outputs
        1. 8.3.6.1 INIT_ACTIVE
        2. 8.3.6.2 DMD_Type(3:0)
        3. 8.3.6.3 DDC_VERSION(3:0)
        4. 8.3.6.4 LED0
        5. 8.3.6.5 LED1
        6. 8.3.6.6 DLPA200 Control Signals
        7. 8.3.6.7 ECM2M_TP_ (31:0)
    4. 8.4 Device Functional Modes
      1. 8.4.1 DLPC410 Initialization and Training
        1. 8.4.1.1 Initialization
        2. 8.4.1.2 input Data Interface (DIN) Training Pattern
      2. 8.4.2 DLPC410 Operational Modes
        1. 8.4.2.1 Single Block Mode
        2. 8.4.2.2 Single Block Phased Mode
        3. 8.4.2.3 Dual Block Mode
        4. 8.4.2.4 Quad Block Mode
        5. 8.4.2.5 Global Mode
        6. 8.4.2.6 DMD Park Mode
        7. 8.4.2.7 DMD Idle Mode
      3. 8.4.3 LOAD4 Functionality (enabled with DLPR410A)
        1. 8.4.3.1 Enabling LOAD4
        2. 8.4.3.2 Loading Data with LOAD4
        3. 8.4.3.3 Row Mapping with LOAD4
        4. 8.4.3.4 Using Block Clear with LOAD4
        5. 8.4.3.5 Timing Requirements for LOAD4
        6. 8.4.3.6 Global Binary Pattern Rate increases using LOAD4
        7. 8.4.3.7 Special LOAD4 considerations
    5. 8.5 Programming
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Device Description
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Initialization Setup
      1. 9.3.1 Debugging Guidelines
      2. 9.3.2 Initialization
        1. 9.3.2.1 Calibration
        2. 9.3.2.2 DLPA200 Number 1 Initialization
        3. 9.3.2.3 DMD Initialization
          1. 9.3.2.3.1 DMD Device ID Check
          2. 9.3.2.3.2 DMD Device OK
        4. 9.3.2.4 DLPA200 Number 2 Initialization
        5. 9.3.2.5 Command Sequence Initialization
      3. 9.3.3 Image Display Issues
        1. 9.3.3.1 Present Data to DLPC410
        2. 9.3.3.2 Load Data to DMD
        3. 9.3.3.3 Mirror Clocking Pulse
  10. 10Power Supply Recommendations
    1. 10.1 Power Down Operation
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Impedance Requirements
      2. 11.1.2 PCB Signal Routing
      3. 11.1.3 Fiducials
      4. 11.1.4 PCB Layout Guidelines
        1. 11.1.4.1 DMD Interface
          1. 11.1.4.1.1 Trace Length Matching
        2. 11.1.4.2 DLPC410 DMD Decoupling
          1. 11.1.4.2.1 Decoupling Capacitors
        3. 11.1.4.3 VCC and VCC2
        4. 11.1.4.4 DMD Layout
        5. 11.1.4.5 DLPA200
    2. 11.2 Layout Example
    3. 11.3 DLPC410 Chipset Connections
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 器件标记
      2. 12.1.2 器件命名规则
    2. 12.2 文档支持
      1. 12.2.1 相关文档
    3. 12.3 社区资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 术语表
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
  • DLP|676
散热焊盘机械数据 (封装 | 引脚)
订购信息

11.1.2 PCB Signal Routing

When designing a PCB board for the DLP650LNIR, DLPC7000 / DLP7000UV or DLP9500 / DLP9500UV controlled by the DLPC410 in conjunction with the DLPA200(s), the following are recommended:

Signal trace corners should be no sharper than 45°. Adjacent signal layers should have the predominate traces routed orthogonal to each other. TI recommends that critical signals be hand routed in the following order: DDR2 Memory, DMD (LVDS signals), then DLPA200 signals.

TI does not recommend signal routing on power or ground planes.

TI does not recommend ground plane slots.

High speed signal traces should not cross over slots in adjacent power and/or ground planes.

Table 21. Important Signal Trace Constraints

SIGNAL CONSTRAINTS
LVDS (DMD_DAT_xnn,
DMD_DCKL_xn, and DMD_SCTRL_xn) 		P-to-N data, clock, and SCTRL: <10 mils (0.25 mm); Pair-to-pair <10 mils (0.25 mm); Bundle-to-bundle <2000 mils (50 mm, for example DMD_DAT_Ann to DMD_DAT_Bnn)
Trace width: 4 mil (0.1 mm)
Trace spacing: In ball field – 4 mil (0.11 mm); PCB etch – 14 mil (0.36 mm)
Maximum recommended trace length <6 inches (150 mm)

Table 22. Power Trace Widths and Spacing

SIGNAL NAME MINIMUM TRACE WIDTH MINIMUM TRACE SPACING LAYOUT REQUIREMENTS
GND Maximize 5 mil (0.13 mm) Maximize trace width to connecting pin as a minimum
P2P5V, P1P0V 50 mil (1.3 mm) 10 mil (0.25 mm) Create mini planes and connect to devices as necessary with multiple vias
P2P5V, P1P0V 30 mil (0.76 mm) - stub width 10 mil (0.25 mm) Stub width to connecting IC pins; maximize width when possible