ZHCSKK3B December   2019  – February 2022 TPS6594-Q1

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
    1.     4
  4. Revision History
  5. 说明(续)
  6. Pin Configuration and Functions
    1. 6.1 Digital Signal Descriptions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  General Purpose Low Drop-Out Regulators (LDO1, LDO2, LDO3)
    6. 7.6  Low Noise Low Drop-Out Regulator (LDO4)
    7. 7.7  Internal Low Drop-Out Regulators (LDOVRTC, LDOVINT)
    8. 7.8  BUCK1, BUCK2, BUCK3, BUCK4 and BUCK5 Regulators
    9. 7.9  Reference Generator (BandGap)
    10. 7.10 Monitoring Functions
    11. 7.11 Clocks, Oscillators, and PLL
    12. 7.12 Thermal Monitoring and Shutdown
    13. 7.13 System Control Thresholds
    14. 7.14 Current Consumption
    15. 7.15 Backup Battery Charger
    16. 7.16 Digital Input Signal Parameters
    17. 7.17 Digital Output Signal Parameters
    18. 7.18 I/O Pullup and Pulldown Resistance
    19. 7.19 I2C Interface
    20. 7.20 Serial Peripheral Interface (SPI)
    21. 7.21 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  System Supply Voltage Monitor and Over-Voltage Protection
      2. 8.3.2  Power Resources (Bucks and LDOs)
        1. 8.3.2.1 Buck Regulators
          1. 8.3.2.1.1  BUCK Regulator Overview
          2. 8.3.2.1.2  Multi-Phase Operation and Phase-Adding or Shedding
          3. 8.3.2.1.3  Transition Between PWM and PFM Modes
          4. 8.3.2.1.4  Multi-Phase BUCK Regulator Configurations
          5. 8.3.2.1.5  Spread-Spectrum Mode
          6. 8.3.2.1.6  Adaptive Voltage Scaling (AVS) and Dynamic Voltage Scaling (DVS) Support
          7. 8.3.2.1.7  BUCK Output Voltage Setting
          8. 8.3.2.1.8  BUCK Regulator Current Limit
          9. 8.3.2.1.9  SW_Bx Short-to-Ground Detection
          10. 8.3.2.1.10 Sync Clock Functionality
          11.        48
        2. 8.3.2.2 Low Dropout Regulators (LDOs)
          1. 8.3.2.2.1 LDOVINT
          2. 8.3.2.2.2 LDOVRTC
          3. 8.3.2.2.3 LDO1, LDO2, and LDO3
          4. 8.3.2.2.4 Low-Noise LDO (LDO4)
      3. 8.3.3  Residual Voltage Checking
      4. 8.3.4  Output Voltage Monitor and PGOOD Generation
      5. 8.3.5  Thermal Monitoring
        1. 8.3.5.1 Thermal Warning Function
        2. 8.3.5.2 Thermal Shutdown
      6. 8.3.6  Backup Supply Power-Path
      7. 8.3.7  General-Purpose I/Os (GPIO Pins)
      8. 8.3.8  nINT, EN_DRV, and nRSTOUT Pins
      9. 8.3.9  Interrupts
      10. 8.3.10 RTC
        1. 8.3.10.1 General Description
        2. 8.3.10.2 Time Calendar Registers
          1. 8.3.10.2.1 TC Registers Read Access
          2. 8.3.10.2.2 TC Registers Write Access
        3. 8.3.10.3 RTC Alarm
        4. 8.3.10.4 RTC Interrupts
        5. 8.3.10.5 RTC 32-kHz Oscillator Drift Compensation
      11. 8.3.11 Watchdog (WDOG)
        1. 8.3.11.1 Watchdog Fail Counter and Status
        2. 8.3.11.2 Watchdog Start-Up and Configuration
        3. 8.3.11.3 MCU to Watchdog Synchronization
        4. 8.3.11.4 Watchdog Disable Function
        5. 8.3.11.5 Watchdog Sequence
        6. 8.3.11.6 Watchdog Trigger Mode
        7. 8.3.11.7 WatchDog Flow Chart and Timing Diagrams in Trigger Mode
        8.       79
        9. 8.3.11.8 Watchdog Question-Answer Mode
          1. 8.3.11.8.1 Watchdog Q&A Related Definitions
          2. 8.3.11.8.2 Question Generation
          3. 8.3.11.8.3 Answer Comparison
            1. 8.3.11.8.3.1 Sequence of the 2-bit Watchdog Answer Counter
            2. 8.3.11.8.3.2 Watchdog Sequence Events and Status Updates
            3. 8.3.11.8.3.3 Watchdog Q&A Sequence Scenarios
      12. 8.3.12 Error Signal Monitor (ESM)
        1. 8.3.12.1 ESM Error-Handling Procedure
          1. 8.3.12.1.1 Level Mode
          2.        90
          3. 8.3.12.1.2 PWM Mode
            1. 8.3.12.1.2.1 Good-Events and Bad-Events
            2. 8.3.12.1.2.2 ESM Error-Counter
            3. 8.3.12.1.2.3 ESM Start-Up in PWM Mode
            4. 8.3.12.1.2.4 ESM Flow Chart and Timing Diagrams in PWM Mode
            5.         96
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device State Machine
        1. 8.4.1.1 Fixed Device Power FSM
          1. 8.4.1.1.1 Register Resets and NVM Read at INIT State
        2. 8.4.1.2 Pre-Configurable Mission States
          1. 8.4.1.2.1 PFSM Commands
            1. 8.4.1.2.1.1  REG_WRITE_IMM Command
            2. 8.4.1.2.1.2  REG_WRITE_MASK_IMM Command
            3. 8.4.1.2.1.3  REG_WRITE_MASK_PAGE0_IMM Command
            4. 8.4.1.2.1.4  REG_WRITE_BIT_PAGE0_IMM Command
            5. 8.4.1.2.1.5  REG_WRITE_WIN_PAGE0_IMM Command
            6. 8.4.1.2.1.6  REG_WRITE_VOUT_IMM Command
            7. 8.4.1.2.1.7  REG_WRITE_VCTRL_IMM Command
            8. 8.4.1.2.1.8  REG_WRITE_MASK_SREG Command
            9. 8.4.1.2.1.9  SREG_READ_REG Command
            10. 8.4.1.2.1.10 SREG_WRITE_IMM Command
            11. 8.4.1.2.1.11 WAIT Command
            12. 8.4.1.2.1.12 DELAY_IMM Command
            13. 8.4.1.2.1.13 DELAY_SREG Command
            14. 8.4.1.2.1.14 TRIG_SET Command
            15. 8.4.1.2.1.15 TRIG_MASK Command
            16. 8.4.1.2.1.16 END Command
          2. 8.4.1.2.2 Configuration Memory Organization and Sequence Execution
          3. 8.4.1.2.3 Mission State Configuration
          4. 8.4.1.2.4 Pre-Configured Hardware Transitions
            1. 8.4.1.2.4.1 ON Requests
            2. 8.4.1.2.4.2 OFF Requests
            3. 8.4.1.2.4.3 NSLEEP1 and NSLEEP2 Functions
            4. 8.4.1.2.4.4 WKUP1 and WKUP2 Functions
            5. 8.4.1.2.4.5 LP_WKUP Pins for Waking Up from LP STANDBY
        3. 8.4.1.3 Error Handling Operations
          1. 8.4.1.3.1 Power Rail Output Error
          2. 8.4.1.3.2 Boot BIST Error
          3. 8.4.1.3.3 Runtime BIST Error
          4. 8.4.1.3.4 Catastrophic Error
          5. 8.4.1.3.5 Watchdog (WDOG) Error
          6. 8.4.1.3.6 Error Signal Monitor (ESM) Error
          7. 8.4.1.3.7 Warnings
        4. 8.4.1.4 Device Start-up Timing
        5. 8.4.1.5 Power Sequences
        6. 8.4.1.6 First Supply Detection
        7. 8.4.1.7 Register Power Domains and Reset Levels
      2. 8.4.2 Multi-PMIC Synchronization
        1. 8.4.2.1 SPMI Interface System Setup
        2. 8.4.2.2 Transmission Protocol and CRC
          1. 8.4.2.2.1 Operation with Transmission Errors
          2. 8.4.2.2.2 Transmitted Information
        3. 8.4.2.3 SPMI Target Device Communication to SPMI Controller Device
          1. 8.4.2.3.1 Incomplete Communication from SPMI Target Device to SPMI Controller Device
        4. 8.4.2.4 SPMI-BIST Overview
          1. 8.4.2.4.1 SPMI Bus during Boot BIST and RUNTIME BIST
          2. 8.4.2.4.2 Periodic Checking of the SPMI
          3. 8.4.2.4.3 SPMI Message Priorities
    5. 8.5 Control Interfaces
      1. 8.5.1 CRC Calculation for I2C and SPI Interface Protocols
      2. 8.5.2 I2C-Compatible Interface
        1. 8.5.2.1 Data Validity
        2. 8.5.2.2 Start and Stop Conditions
        3. 8.5.2.3 Transferring Data
        4. 8.5.2.4 Auto-Increment Feature
      3. 8.5.3 Serial Peripheral Interface (SPI)
    6. 8.6 Configurable Registers
      1. 8.6.1 Register Page Partitioning
      2. 8.6.2 CRC Protection for Configuration, Control, and Test Registers
      3. 8.6.3 CRC Protection for User Registers
      4. 8.6.4 Register Write Protection
        1. 8.6.4.1 ESM and WDOG Configuration Registers
        2. 8.6.4.2 User Registers
    7. 8.7 Register Maps
      1. 8.7.1 TPS6594-Q1 Registers
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Powering a Processor
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 VCCA, VSYS_SENSE, and OVPGDRV
          2. 9.2.1.2.2 Internal LDOs
          3. 9.2.1.2.3 Crystal Oscillator
          4. 9.2.1.2.4 Buck Input Capacitors
          5. 9.2.1.2.5 Buck Output Capacitors
          6. 9.2.1.2.6 Buck Inductors
          7. 9.2.1.2.7 LDO Input Capacitors
          8. 9.2.1.2.8 LDO Output Capacitors
          9. 9.2.1.2.9 Digital Signal Connections
      2. 9.2.2 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 第三方产品免责声明
    2. 12.2 Device Nomenclature
    3. 12.3 Documentation Support
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 支持资源
    6. 12.6 Trademarks
    7. 12.7 Electrostatic Discharge Caution
    8. 12.8 术语表
  13. 13Mechanical, Packaging, and Orderable Information

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订购信息

ESM Error-Handling Procedure

Each ESM has two of its own configurable delay-timers, which are reset when the device clears the respective ESM_x_START bit. Below steps describe the procedure through which the ESM goes in case it detects an ESM-error:

  1. If the respective mask bit ESM_x_PIN_MASK=0, the device sets interrupt bit ESM_MCU_PIN_INT or ESM_SOC_PIN_INT, and pulls the nINT pin low.
  2. The ESM starts the delay-1 timer (configurable through related ESM_MCU_DELAY1[7:0] or ESM_SOC_DELAY1[7:0] bits).
  3. If the ESM-error is no longer present and MCU has cleared the related interrupt bit ESM_MCU_PIN_INT or ESM_SOC_PIN_INT before the delay-1 timer elapses, the device releases the nINTpin, the ESM resets the delay-1 and delay-2 timers and continues to monitor its input pin.
  4. If the ESM-error is still present, or if MCU has not cleared the related interrupt bit ESM_MCU_PIN_INT or ESM_SOC_PIN_INT, and the delay-1 timer elapses, then the ESM clears the ENABLE_DRV bit if bit ESM_MCU_ENDRV=1 or if bit ESM_SOC_ENDRV=1.
  5. If the delay-2 timer (configurable through related ESM_MCU_DELAY2[7:0] or ESM_SOC_DELAY2[7:0] bits) is set to 0, then the ESM skips steps 6 of this list, and performs step 7.
  6. If the delay-2 timer is not set to 0, then:
    1. ESM starts the delay-2 timer,
    2. If ESM_MCU_FAIL_MASK = 0, the device sets interrupt bit ESM_MCU_FAIL_INT and pulls the nINT pin low and starts the delay-2 timer.
    3. If ESM_SOC_FAIL_MASK = 0, the device sets interrupt bit ESM_SOC_FAIL_INT, pulls the nINT pin low and starts the delay-2 timer.
  7. If the ESM-error is no longer present and the MCU has cleared the related interrupt bits listed below before the delay-2 timer elapses, the device releases the nINTpin, the ESM resets the delay-1 and delay-2 timers and continues to monitor its input pin:
    • ESM_MCU_PIN_INT (and ESM_MCU_FAIL_INT if set in step 6), or
    • ESM_SOC_PIN_INT (and ESM_SOC_FAIL_INT if set in step 6)
  8. If the ESM-error is still present, or if MCU has not cleared the related interrupt bits ESM_MCU_PIN_INT and ESM_MCU_FAIL_INT, or ESM_SOC_PIN_INT amd ESM_SOC_FAIL_INT, and the delay-2 timer elapses, then :
    1. For ESM_MCU, the device:
      1. clears the ESM_MCU_START BIT
      2. sets interrupt bits ESM_MCU_FAIL_INT and ESM_MCU_RST_INT, which the device handles as an ESM_MCU_RST trigger for FSM, described in Table 8-1
      3. After this trigger handling completes, the device re-initializes the ESM_MCU
    2. For ESM_SoC, the device:
      1. clears the ESM_SOC_START bit
      2. sets interrupt bits ESM_SOC_FAIL_INT and ESM_SOC_RST_INT, which the device handles as an ESM_SOC_RST trigger for FSM, described in Table 8-1
      3. After this trigger handling completes, the device re-initializes the ESM_SoC

ESM_MCU_DELAY1[7:0] and ESM_SOC_DELAY1[7:0] set the delay-1 time-interval (tDELAY-1) for the related ESM_MCU or ESM_SoC. Use Equation 10 and Equation 11 to calculate the worst-case values for the tDELAY-1:

Equation 10. Min. tDELAY-1 = (ESM_x_DELAY1[7:0] × 2.048 ms) × 0.95
Equation 11. Max. tDELAY-1 = (ESM _x_DELAY1[7:0] × 2.048 ms) × 1.05

, in which x stands for either MCU or SoC.

ESM_MCU_DELAY2[7:0] or ESM_SOC_DELAY2[7:0] bits set the delay-2 time-interval (tDELAY-2) for the related ESM_MCU or ESM_SoC. Use Equation 12 and Equation 13 to calculate the worst-case values for the tDELAY-2:

Equation 12. Min. tDELAY-2 = (ESM_x_DELAY2[7:0] × 2.048 ms) × 0.95
Equation 13. Max. tDELAY-2 = (ESM_x_DELAY2[7:0] × 2.048 ms) × 1.05

, in which x stands for either MCU or SoC.