SBASB61 August   2026 ADS124S18

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Timing Diagrams
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1 Noise Performance
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Analog Inputs and Multiplexer
      2. 7.3.2  Programmable Gain Amplifier (PGA)
      3. 7.3.3  Voltage Reference
        1. 7.3.3.1 Internal Reference
        2. 7.3.3.2 External Reference
        3. 7.3.3.3 Reference Buffers
      4. 7.3.4  Power-Scalable Speed Modes
      5. 7.3.5  Clock Source
      6. 7.3.6  Delta-Sigma Modulator
      7. 7.3.7  Digital Filter
        1. 7.3.7.1 Sinc3 and Sinc4 Filters
        2. 7.3.7.2 Sinc4 + Sinc1 Filter
        3. 7.3.7.3 FIR Filter
        4. 7.3.7.4 50Hz and 60Hz Line Cycle Rejection
        5. 7.3.7.5 Digital Filter Latency
        6. 7.3.7.6 Global-Chop Mode
      8. 7.3.8  Excitation Current Sources (IDACs)
      9. 7.3.9  Burn-Out Current Sources (BOCS)
      10. 7.3.10 Bias Voltage Generator (VBIAS)
      11. 7.3.11 General Purpose IOs (GPIOs)
        1. 7.3.11.1 ALERT Output
        2. 7.3.11.2 FAULT Output
      12. 7.3.12 Offset and Gain Calibration Coefficients
      13. 7.3.13 Digital Comparator
      14. 7.3.14 System Monitors
        1. 7.3.14.1 Internal Short (Offset Calibration)
        2. 7.3.14.2 Internal Temperature Sensor
        3. 7.3.14.3 External Reference Voltage Readback
        4. 7.3.14.4 Power-Supply Readback
      15. 7.3.15 Monitors and Status Flags
        1. 7.3.15.1 Reset (RESETn flag)
        2. 7.3.15.2 AVDD Undervoltage Monitor (AVDD_UVn flag)
        3. 7.3.15.3 Reference Undervoltage Monitor (REF_UVn flag)
        4. 7.3.15.4 SPI CRC Fault (SPI_CRC_FAULTn flag)
        5. 7.3.15.5 Register Map CRC Fault (REG_MAP_CRC_FAULTn flag)
        6. 7.3.15.6 Internal Memory Fault (MEM_FAULTn flag)
        7. 7.3.15.7 Register Write Fault (REG_WRITE_FAULTn flag)
        8. 7.3.15.8 Digital Comparator Alert (COMP_ALERTn flag)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-up and Reset
        1. 7.4.1.1 Power-On Reset (POR)
        2. 7.4.1.2 RESET Pin
        3. 7.4.1.3 Reset by Register Write
        4. 7.4.1.4 Reset by SPI Input Pattern
      2. 7.4.2 Operating Modes
        1. 7.4.2.1 Idle and Standby Mode
        2. 7.4.2.2 Power-Down Mode
        3. 7.4.2.3 Sequencer Mode
          1. 7.4.2.3.1 Configuring the Sequencer
          2. 7.4.2.3.2 Starting and Stopping the Sequencer (START/STOP bits and START pin)
          3. 7.4.2.3.3 Sequencer Status Bits
    5. 7.5 Programming
      1. 7.5.1  Serial Interface (SPI)
      2. 7.5.2  Serial Interface Signals
        1. 7.5.2.1 Chip Select (CS)
        2. 7.5.2.2 Serial Clock (SCLK)
        3. 7.5.2.3 Serial Data Input (SDI)
        4. 7.5.2.4 Serial Data Output/Data Ready (SDO/DRDY)
        5. 7.5.2.5 Data Ready (DRDY) Pin
      3. 7.5.3  Serial Interface Communication Structure
        1. 7.5.3.1 SPI Frame
        2. 7.5.3.2 STATUS Header
        3. 7.5.3.3 SPI CRC
      4. 7.5.4  Device Commands
        1. 7.5.4.1 No Operation (Read Conversion Data)
        2. 7.5.4.2 Read Register Command
        3. 7.5.4.3 Write Register Command
      5. 7.5.5  Continuous-Read Mode
        1. 7.5.5.1 Read Registers in Continuous-Read Mode
      6. 7.5.6  Daisy-Chain Operation
      7. 7.5.7  3-Wire SPI Mode
        1. 7.5.7.1 3-Wire SPI Mode Frame Re-Alignment
      8. 7.5.8  Monitoring for New Conversion Data
        1. 7.5.8.1 DRDY Pin or SDO/DRDY Pin Monitoring
        2. 7.5.8.2 Reading DRDY Bit and Conversion Counter
        3. 7.5.8.3 Clock Counting
      9. 7.5.9  DRDY Pin Behavior
      10. 7.5.10 Register Map CRC
      11. 7.5.11 Conversion Data Format
  9. 8 Register Map
    1. 8.1 Status and General Configuration Page Registers
    2. 8.2 Step Configuration Page Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Serial Interface Connections
      2. 9.1.2 Unused Inputs and Outputs
      3. 9.1.3 Interfacing With Multiple Devices
      4. 9.1.4 Device Initialization and Starting the Sequencer
      5. 9.1.5 Sequencer Configuration Strategy Example
    2. 9.2 Typical Applications
      1. 9.2.1 Software-Configurable RTD Measurement Input
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Performance Plots
        4. 9.2.1.4 Design Variant – 3-Wire RTD Measurement With Automatic Lead-Wire Compensation Using Two IDACs
      2. 9.2.2 Thermocouple Measurement With Cold-Junction Compensation Using a 2-wire RTD
      3. 9.2.3 Resistive Bridge Sensor Measurement With Temperature Compensation
      4. 9.2.4 Autonomous Power Supply Monitoring
        1. 9.2.4.1 Design Requirements
        2. 9.2.4.2 Detailed Design Procedure
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Power Supplies
      2. 9.3.2 Power-Supply Sequencing
      3. 9.3.3 Power-Supply Decoupling
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

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9.2.2 Thermocouple Measurement With Cold-Junction Compensation Using a 2-wire RTD

Figure 9-9 shows the implementation of a thermocouple measurement using a 2-wire RTD for cold-junction temperature measurement. Other ways to measure the cold-junction temperature can be used with the ADS1x4S1x as well, such as a thermistor (for example TMP61), an analog output temperature sensor (for example LMT70A), or using the integrated temperature sensor.

Equation 32 provides the relationship between ADC codes and the thermocouple voltage (VTC) measured between AIN4 and AIN5.

Equation 32. Code / 2n = (VTC × Gain) / VREF

Where n follows the guidelines of Equation 24.

An important aspect of the circuit implementation is the biasing of the thermocouple so that the voltages at the thermocouple terminals meet the input voltage requirements of the ADS1x4S1x. In this example pullup and pulldown resistors (typically in the range of 1MΩ to 10MΩ) in front of the RC filter are used to bias the thermocouple output voltage to AVDD / 2. At the same time, the pullup and pulldown resistors serve as a means to detect an open sensor connection. In case of an open sensor connection, the positive analog input (AIN4) is pulled to AVDD, and the negative analog input (AIN5) to GND. This condition leads to a measurement result which is outside the normal measurement range for the thermocouple.

Many other ways to bias the thermocouple can be used as well. For example the reference output voltage can be used by connecting REFOUT to the negative thermocouple terminal instead of the pulldown resistor. For more information about thermocouple measurement circuits and the implementation using TI ADCs see the A Basic Guide to Thermocouple Measurements application note. A software library using C code showing how to implement the thermocouple linearization and cold-junction compensation algorithms in the host controller is available here.

ADS114S14 ADS114S18 ADS124S14 ADS124S18 Thermocouple Measurement With Cold-Junction Compensation Using a 2-wire RTD Figure 9-9 Thermocouple Measurement With Cold-Junction Compensation Using a 2-wire RTD