LP-EM-CC2340R5
CC2340R5 SimpleLink™ 低功耗 Bluetooth® 5.3 MCU LaunchPad™ 开发套件
LP-EM-CC2340R5
概述
该 LaunchPad 开发套件可借助支持低功耗 (LE) 蓝牙 5 和 2.4GHz 专有协议的 SimpleLink 低功耗蓝牙 MCU 加快开发速度。SimpleLink 低功耗 F3 软件开发套件 (SDK) 提供软件支持。
特性
- 通过 BoosterPack™ 插件模块连接器访问所有 I/O 信号
- 使用 TI SimpleLink Connect 将 LaunchPad 开发套件连接到智能手机
- 需要单独购买用于软件开发和射频评估的调试器 LP-XDS110ET 或 LP-XDS110
- 用于 JTAG 连接的 10 引脚扁平带状电缆
- 2 线插座到插座电缆
- 快速入门指南
蓝牙产品
立即订购并开发
LP-EM-CC2340R5
— CC2340R5 SimpleLink™ 低功耗 Bluetooth® 5.3 MCU LaunchPad™ 开发套件
SIMPLELINK-CONNECT — SimpleLink Connect App for the SimpleLink Low Power SDKs
Apple App Store
Google App Store
Github
产品
蓝牙产品
硬件开发
开发套件
发布信息
The SimpleLink Connect Mobile app is an example Bluetooth® Low Energy application for mobile devices that works with CC23XX devices running the SimpleLink Low Power F3 SDK. The app provides a baseline for users to quickly build their own mobile apps, using iOS or Android. Source code is provided enabling easy customization.
Features:
- iOS compatible Bluetooth® Low Energy phone app and source code
- Android™ compatibly Bluetooth® Low Energy phone app and source code
SIMPLELINK-LOWPOWER-F3-SDK — SimpleLink™ Low Power F3 software development kit (SDK) for the CC23xx devices
SIMPLELINK-LOWPOWER-F3-SDK — SimpleLink™ Low Power F3 software development kit (SDK) for the CC23xx devices
产品
蓝牙产品
硬件开发
开发套件
发布信息
The SimpleLink™ Low Power F3 Software Development Kit (SDK) delivers components that enable engineers to develop applications on the Texas Instruments SimpleLink CC23xx family of wireless microcontrollers (MCUs). This software toolkit provides a cohesive and consistent software experience for all SimpleLink CC23xx wireless MCU users by packaging essential software components, such as a Bluetooth® Low Energy (BLE) protocol stack supporting Bluetooth, Proprietary RF examples, and TI Drivers in one easy-to-use software package along with example applications and documentation.
The SimpleLink MCU portfolio offers a single development environment that delivers flexible hardware, software, and tool options for customers developing wired and wireless applications. With 100 percent code reuse across host MCUs, Wi-Fi™, Bluetooth Low Energy, Sub-1GHz devices and more, choose the MCU or connectivity standard that fits your design. A one-time investment with the SimpleLink software development kit allows you to reuse often, opening the door to create unlimited applications. For more information, visit www.ti.com/simplelink.
Features:
- Industry leading Bluetooth Low Energy (BLE) software protocol stack supporting Bluetooth 5.3 (learn more at TI.com/ble)
- Support for Proprietary 2.4 GHz applications supporting basic RX and TX examples
最新信息
- [BLE5Stack] OAD Dual Image Support added to SDK
- CC2340R5 4x4 package (RGE) support implemented.
- Further optimizations have been implemented to the RF settings of the SimpleLink™ Low Power F3 SDK release.
CC23XX-REPORTS — CC23xx regulatory certification reports
CC23XX-REPORTS — CC23xx regulatory certification reports
产品
蓝牙产品
硬件开发
开发套件
文档
Link to LP-EM-CC2340R5 Reference-Only CE & FCC Certification Reports
发布信息
This page provides access to the CC23XX certiification reports for teh CC23XX EVMs. EVM certification reports are provided for reference only. When using a chip down design, the customer is responsible for their own certification.
最新信息
- Added LP-EM-CC2340R5 FCC and CE information only certification reports
设计文件
技术文档
| 类型 | 标题 | 下载最新的英文版本 | 日期 | |||
|---|---|---|---|---|---|---|
| 更多文献资料 | LP-EM-CC2340R5 快速入门指南 (Rev. A) | 2023年 5月 30日 | ||||
| 证书 | LP-EM-CC2340R5 EU RoHS Declaration of Conformity (DoC) (Rev. A) | 2023年 4月 28日 |