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UCC5870-Q1

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适用于 IGBT/SiC MOSFET 的汽车类 3.75kVrms 30A 单通道功能安全隔离式栅极驱动器

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UCC5870-Q1

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产品详细信息

Number of channels (#) 1 Isolation rating (Vrms) 3750 Power switch IGBT, SiCFET Peak output current (A) 30 DIN V VDE V 0884-10 transient overvoltage rating (Vpk) 5250 DIN V VDE V 0884-10 working voltage (Vpk) 1000 Output VCC/VDD (Max) (V) 30 Output VCC/VDD (Min) (V) 15 Input VCC (Min) (V) 3 Input VCC (Max) (V) 5.5 Prop delay (ns) 150 Operating temperature range (C) -40 to 125 Undervoltage lockout (Typ) 12
Number of channels (#) 1 Isolation rating (Vrms) 3750 Power switch IGBT, SiCFET Peak output current (A) 30 DIN V VDE V 0884-10 transient overvoltage rating (Vpk) 5250 DIN V VDE V 0884-10 working voltage (Vpk) 1000 Output VCC/VDD (Max) (V) 30 Output VCC/VDD (Min) (V) 15 Input VCC (Min) (V) 3 Input VCC (Max) (V) 5.5 Prop delay (ns) 150 Operating temperature range (C) -40 to 125 Undervoltage lockout (Typ) 12
SSOP (DWJ) 36 96 mm² 12.8 x 7.5
  • Split output driver provides 30-A peak source and 30-A peak sink currents
  • Adjustable "on the fly" gate drive strength
  • Interlock and shoot-through protection with 150-ns(max) propagation delay and programmable minimum pulse rejection
  • Primary and Secondary side active short circuit (ASC) support
  • Configurable power transistor protections
    • DESAT based short circuit protection
    • Shunt resistor based overcurrent and short circuit protection
    • NTC based overtemperature protection
    • Programmable soft turnoff (STO) and two-level turnoff (2LTOFF) during power transistor faults
  • Functional Safety-Compliant
  • Integrated diagnostics:
    • Built-in self test (BIST) for protection comparators
    • IN+ to transistor gate path integrity
    • Power transistor threshold monitoring
    • Internal clock monitoring
    • Fault alarm (nFLT1) and warning (nFLT2) outputs
  • Integrated 4-A active Miller clamp or optional external drive for Miller clamp transistor
  • Advanced high voltage clamping control
  • Internal and external supply undervoltage and overvoltage protection
  • Active output pulldown and default low outputs with low supply or floating inputs
  • Driver die temperature sensing and overtemperature protection
  • 100-kV/µs minimum common mode transient immunity (CMTI) at VCM = 1000V
  • SPI based device reconfiguration, verification, supervision, and diagnosis
  • Integrated 10-bit ADC for power transistor temperature, voltage, and current monitoring
  • Safety-related certifications:
    • 3750– VRMS isolation for 1 minute per UL1577 (planned)
  • AEC-Q100 qualified with the following results:
    • Device temperature grade 0: –40°C to 125°C ambient operating temperature
    • Device HBM ESD classification level 2
    • Device CDM ESD classification level C4b
  • Split output driver provides 30-A peak source and 30-A peak sink currents
  • Adjustable "on the fly" gate drive strength
  • Interlock and shoot-through protection with 150-ns(max) propagation delay and programmable minimum pulse rejection
  • Primary and Secondary side active short circuit (ASC) support
  • Configurable power transistor protections
    • DESAT based short circuit protection
    • Shunt resistor based overcurrent and short circuit protection
    • NTC based overtemperature protection
    • Programmable soft turnoff (STO) and two-level turnoff (2LTOFF) during power transistor faults
  • Functional Safety-Compliant
  • Integrated diagnostics:
    • Built-in self test (BIST) for protection comparators
    • IN+ to transistor gate path integrity
    • Power transistor threshold monitoring
    • Internal clock monitoring
    • Fault alarm (nFLT1) and warning (nFLT2) outputs
  • Integrated 4-A active Miller clamp or optional external drive for Miller clamp transistor
  • Advanced high voltage clamping control
  • Internal and external supply undervoltage and overvoltage protection
  • Active output pulldown and default low outputs with low supply or floating inputs
  • Driver die temperature sensing and overtemperature protection
  • 100-kV/µs minimum common mode transient immunity (CMTI) at VCM = 1000V
  • SPI based device reconfiguration, verification, supervision, and diagnosis
  • Integrated 10-bit ADC for power transistor temperature, voltage, and current monitoring
  • Safety-related certifications:
    • 3750– VRMS isolation for 1 minute per UL1577 (planned)
  • AEC-Q100 qualified with the following results:
    • Device temperature grade 0: –40°C to 125°C ambient operating temperature
    • Device HBM ESD classification level 2
    • Device CDM ESD classification level C4b

The UCC5870-Q1 device is an isolated, highly configurable single-channel gate driver targeted to drive high power SiC MOSFETs and IGBTs in EV/HEV applications. Power transistor protections, such as shunt-resistor–based overcurrent, NTC-based overtemperature, and DESAT detection, include selectable soft turn-off or two-level turn-off during these faults. To further reduce the application size, the UCC5870-Q1 integrates a 4-A active Miller clamp during switching, and an active gate pulldown while the driver is unpowered. An integrated 10-bit ADC enables monitoring of up to six analog inputs and the gate driver temperature for enhanced system management. Diagnostics and detection functions are integrated to simplify the design of ASIL-D compliant systems. The parameters and thresholds for these features are configurable using the SPI interface, which allows the device to be used with nearly any SiC MOSFET or IGBT.

The UCC5870-Q1 device is an isolated, highly configurable single-channel gate driver targeted to drive high power SiC MOSFETs and IGBTs in EV/HEV applications. Power transistor protections, such as shunt-resistor–based overcurrent, NTC-based overtemperature, and DESAT detection, include selectable soft turn-off or two-level turn-off during these faults. To further reduce the application size, the UCC5870-Q1 integrates a 4-A active Miller clamp during switching, and an active gate pulldown while the driver is unpowered. An integrated 10-bit ADC enables monitoring of up to six analog inputs and the gate driver temperature for enhanced system management. Diagnostics and detection functions are integrated to simplify the design of ASIL-D compliant systems. The parameters and thresholds for these features are configurable using the SPI interface, which allows the device to be used with nearly any SiC MOSFET or IGBT.
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Functional safety compliant 30-A isolated IGBT/SiC MOSFET gate driver with advanced protection features for automotive applications with 5.7-kV isolation voltage

技术文档

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类型 项目标题 下载最新的英语版本 日期
* 数据表 具有实时功能的 UCC5870-Q1 隔离式 IGBT、SiC MOSFET 栅极驱动器 数据表 (Rev. C) 01 Sep 2021
技术文章 Understanding functional safety for gate drivers and traction inverter systems 10 Aug 2022
技术文章 Reducing power loss and thermal dissipation in SiC traction inverters 10 Jun 2022
白皮书 High-Voltage Semiconductor Solutions for Meeting Isolation Requirements...... (Rev. A) PDF | HTML 06 Jun 2022
白皮书 High-Voltage Semiconductor Solutions for Meeting Isolation Requirements........ (Rev. A) PDF | HTML 06 Jun 2022
白皮书 满足隔离要求的高电压半导体解决方案 (Rev. A) PDF | HTML 下载英文版本 (Rev.A) PDF | HTML 06 Jun 2022
应用手册 The Use and Benefits of Ferrite Beads in Bate Drive Circuits PDF | HTML 16 Dec 2021
证书 UL 1577 Certificate of Compliance 22 Oct 2021
技术文章 Driving next-generation EV systems with a distributed architecture 27 Sep 2021
白皮书 高性能集成式动力总成解决方案：电动汽车普及的关键 (Rev. A) 21 Apr 2021
白皮书 A High-Performance, Combo Box Powertrain Solution: the Key to EV Adoption (Rev. A) 15 Apr 2021
白皮书 A High-Performance, Combo Box Powertrain Solution: the Key to EV Adoption. 14 Apr 2021
白皮书 A High-Performance, Combo Box Powertrain Solution: the Key to EV Adoption... 14 Apr 2021
更多文献资料 Protecting Power Devices in Electric Vehicle Applications 23 Mar 2021
证书 UCC5870QEVM-045 EU Declaration of Conformity (DoC) 22 Feb 2021
应用手册 HEV/EV Traction Inverter Design Guide Using Isolated IGBT and SiC Gate Drivers (Rev. A) 26 Jun 2020
EVM 用户指南 UCC5870QEVM-045 User's Guide PDF | HTML 04 Feb 2020
EVM 用户指南 UCC5870-Q1 Evaluaiton Module User's Guide 01 Oct 2019
技术文章 How to achieve higher system robustness in DC drives, part 3: minimum input pulse 19 Sep 2018

设计和开发

如需其他信息或资源，请查看下方列表，点击标题即可进入详情页面。

评估板

UCC5870QDWJEVM-026 — UCC5870-Q1 functional safety compliant 15-A isolated IGBT/SiC MOSFET gate driver evaluation module

UCC5870-Q1 评估模块适用于评估 TI 的 UCC5870-Q1 这款具有高级保护功能的 15A 隔离式单通道栅极驱动器。此驱动器专用于驱动 EV/HEV 应用中的大功率 SiC MOSFET 和 IGBT。包含多种保护功能，如有源米勒钳位、DESAT 检测、分流电流感应支持、软关断、VCE 过压保护、栅极驱动器电源 UVLO 和 OVLO 保护、温度监测和热关断以及栅极监测等，适用于具有高可靠性要求的系统。该驱动器还通过串行外设接口 (SPI) 集成了先进的诊断、保护和监控功能。
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评估板

UCC5870QEVM-045 — UCC5870-Q1 符合功能安全标准的 15A 隔离式 IGBT/SiC MOSFET 栅极驱动器三相 EVM

UCC5870-Q1 三相评估模块 (EVM) 适用于评估 TI 这款具有高级保护功能的 15A 隔离式单通道栅极驱动器。此 EVM 专用于驱动 EV/HEV 应用中的大功率 SiC MOSFET 和 IGBT。这款三相 EVM 可用于调试软件以适应驱动器的串行外设接口 (SPI)，还可评估驱动器先进的诊断、保护和监控功能。

TI.com 無法提供
评估模块 (EVM) 用 GUI

UCC5870-Q1 EVM GUI Software (Rev. A)

SLUC700A.ZIP (31568 KB)
lock = 需要导出审批（1分钟）
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仿真模型

Simplis functional model for UCC5870-Q1 Simplis functional model for UCC5870-Q1

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模拟工具

PSPICE-FOR-TI 适用于 TI 设计和模拟工具的 PSpice®

PSpice® for TI 可提供帮助评估模拟电路功能的设计和仿真环境。此功能齐全的设计和仿真套件使用 Cadence® 的模拟分析引擎。PSpice for TI 可免费使用，包括业内超大的模型库之一，涵盖我们的模拟和电源产品系列以及精选的模拟行为模型。

借助 PSpice for TI 的设计和仿真环境及其内置的模型库，您可对复杂的混合信号设计进行仿真。创建完整的终端设备设计和原型解决方案，然后再进行布局和制造，可缩短产品上市时间并降低开发成本。

在 PSpice for TI 设计和仿真工具中，您可以搜索 TI (...)
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计算工具

UCC5870-Q1 XL Calculator Tool UCC5870-Q1 XL Calculator Tool

lock = 需要导出审批（1分钟）
lock 下载
参考设计

TIDM-02009 — 经过 ASIL D 等级功能安全认证的高速牵引和双向直流/直流转换参考设计

此参考设计演示了如何通过一个 TMS320F28388D 实时 C2000™ MCU 控制 HEV/EV 牵引逆变器和双向直流/直流转换器。牵引控制利用基于软件的旋转变压器转数字转换器 (RDC)，使电机转速高达 20,000RPM。直流/直流转换器结合了峰值电流模式控制 (PCMC) 技术、相移全桥 (PSFB) 拓扑以及同步整流 (SR) 机制。牵引逆变器级采用碳化硅 (SiC) 功率级，由 UCC5870-Q1 智能栅极驱动器驱动。利用比较器子系统 (CMPSS) 中先进的 PWM 模块和内置斜坡补偿功能，可生成 PCMC 波形。该系统基于 ASIL (...)
document-generic 原理图
参考设计

PMP22817 — 带集成变压器的汽车类 SPI 可编程栅极驱动器和偏置电源参考设计

此参考设计为牵引逆变器和车载充电器中的电源开关提供隔离式偏置电源和隔离式栅极驱动器。偏置电源和驱动器均可提供 800VDC 总线应用所需的高隔离（3kV RMS 持续一分钟）。隔离式偏置提供 24VDC，包括 +15V 和 -5V 栅极驱动偏置。隔离式驱动器提供快速开通和关断这些大功率开关所需的高电流（峰值电流高达 30A），并提供高级保护功能。PMP22817 还提供经过测试的直流/直流单端初级电感器转换器 SEPIC，以便关断汽车类电池电压（6V 至 42V，包括浪涌/突降），从而提供稳定的 24V 电压。
封装 引脚数 下载
SSOP (DWJ) 36 了解详情

订购和质量

包含信息：
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 认证摘要
  • 持续可靠性监测

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