SWRU612B December   2023  – June 2026 CC3300 , CC3300MOD , CC3301 , CC3301MOD , CC3351 , CC3351MOD

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
    1. 1.1 Overview
  5. 2Schematic Considerations – CC33xx Devices
    1. 2.1 Schematic Reference Design
    2. 2.2 Power Supply
      1. 2.2.1 Power Input/Output Requirements
      2. 2.2.2 Boot Sequence
        1. 2.2.2.1 SOP Modes
      3. 2.2.3 Power Down Sequence
    3. 2.3 Clock Source
      1. 2.3.1 Fast Clock
      2. 2.3.2 Slow Clock
        1. 2.3.2.1 Slow Clock Generated Internally
        2. 2.3.2.2 Slow Clock Using an External Oscillator
    4. 2.4 Radio Frequency (RF)
    5. 2.5 Digital Interfaces
      1. 2.5.1 Reset
      2. 2.5.2 Secure Digital Input Output (SDIO)
        1. 2.5.2.1 SDIO Timing Diagram: Default Speed
        2. 2.5.2.2 SDIO Timing Diagram: High Speed
      3. 2.5.3 Serial Peripheral Interface (SPI)
        1. 2.5.3.1 SPI Timing Diagram
      4. 2.5.4 Universal Asynchronous Receiver-Transmitter (UART)
        1. 2.5.4.1 UART Timing Diagram
      5. 2.5.5 Serial Wire Debug (SWD)
      6. 2.5.6 WLAN Interrupt Request (HOST_IRQ_WL)
      7. 2.5.7 Logger
      8. 2.5.8 Coexistence
  6. 3Layout Considerations – CC33xx Devices
    1. 3.1 Layout Reference Design
      1. 3.1.1 Reference Design – CC330x Single Band Layout
      2. 3.1.2 Reference Design – CC335x Dual Band Layout
      3. 3.1.3 BP-CC3351 Design Layout
      4. 3.1.4 M2-CC3351 Design Layout
    2. 3.2 IC Thermal Pad
    3. 3.3 Radio Frequency (RF)
    4. 3.4 XTAL
    5. 3.5 Power Supplies
    6. 3.6 SDIO
  7. 4Schematic Considerations – CC33xxMOD
    1. 4.1 Schematic Reference Design – CC33xxMOD
    2. 4.2 Power Supply
  8. 5Layout Considerations – CC33xxMOD
    1. 5.1 CC33xxMOD RF Layout Recommendations
  9. 6 CC33xxMOD Regulatory Compliance
    1. 6.1 CC33xxMOD OEM Integration Manual
  10. 7Revision History

2.1 Schematic Reference Design

TI recommends following the reference design and guidelines for the CC33xx devices as closely as possible to achieve the full capabilities of the CC33xx devices (as listed in the device-specific data sheet) and to pass certification. The schematic designs recommended for the CC33xx and CC335x devices are accessed here:

CC330x Reference Design Files

CC335x Reference Design Files

Figure 2-1 and Figure 2-2 show the reference schematics for the CC330x and CC335x devices.

M2-CC3351 CC3351MOD CC3351 CC3301MOD CC3301 CC3300MOD CC3300 BP-CC3351 CC33xx Reference Schematic
A. TI recommends RF Shield for optimal regulatory compliance.
Figure 2-1 CC33xx Reference Schematic
M2-CC3351 CC3351MOD CC3351 CC3301MOD CC3301 CC3300MOD CC3300 BP-CC3351 CC335x Reference Schematic
A. TI recommends RF Shield for optimal regulatory compliance.
Figure 2-2 CC335x Reference Schematic

The only difference between the schematics for the CC33xx and CC335x devices is the added diplexer U1 for 5GHz support in the CC335x devices. For more information on the RF section of the schematic, see Section 2.4.

Table 2-1 Bill of Materials
Item Designator
of
Reference		 Quantity Value Part Number Manufacturer Description Package Reference
1 C1, C2, C3,
C4, C5		 5 0.1μF GRM033C71A104KE14D Murata CAP, CERM, 0.1μF, 10V, ±10%, X7S, 0201
Matching component:
CAP, CERM, 10pF, 50V, ±5%, C0G/NP0, 0201		 0201
2 C6, C7 2 1μF GRM033D70J105ME01D Murata Chip Multilayer Ceramic Capacitors for General Purpose, 0201, 1.0μF, X7T, +22%/-33%, 20%, 6.3V 0201
3 C8 1 1μF GRM155R70J105MA12D Murata CAP, CERM, 1μF, 6.3V, ±20%, X7R, 0402 0402
4 C9 1 10pF GJM0335C1E100JB01D Murata CAP, CERM, 10pF, 25V, ±5%, C0G/NP0, 0201 0201
5 C10, C11 2 6.8pF GJM0335C1H6R8BB01 Murata Chip Multilayer Ceramic Capacitors for General Purpose, 0201, 6.8pF, C0G, 30ppm/°C, 0.25pF, 50V 0201
6 R1 1 150Ω RC0201FR-7D150RL YAGEO RES, 150, 1%, 0.05W, 0201 0201
7 CC1 1 CC33x1NG0ARSBR Texas Instruments CC33x1NG0ARSBR – Wi-Fi 6 and Bluetooth Low Energy 5.2 Combo Transceiver WQFN40
8 Y2 1 TZ3877AAAO44 Tia-Saw Technology Crystal Unit SMD 2.0 x 1.6 40.0MHz SMT4_2MM05_1MM65
9 FL1 1 DEA162450BT-1295A1 TDK 2.45GHz Center Frequency Band Pass RF Filter, 100MHz Bandwidth, 1.8dB 0603, 3 PC Pad SMT_FILTER_1MM60_0MM80
10 Only for CC335x: U1 1 DPX167125DT-8197B1 TDK Multilayer Diplexer for 2.4-2.5GHz W-LAN and Bluetooth / 5-7GHz W-LAN SMD6
11 Optional:
Y1(1)		 1 LFSPX0073707REEL IQD Frequency Products Optional: 32.768kHz XO (Standard) CMOS Oscillator 1.8V Enable/Disable 4-SMD, No Lead SMT4_2MM0_1MM6
(1) The slow clock can be generated internally. An external slow clock can be optionally used to consume less power than sourcing the slow clock internally.