SWRU612B December   2023  – June 2026 CC3300 , CC3300MOD , CC3301 , CC3301MOD , CC3351 , CC3351MOD

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
    1. 1.1 Overview
  5. 2Schematic Considerations – CC33xx Devices
    1. 2.1 Schematic Reference Design
    2. 2.2 Power Supply
      1. 2.2.1 Power Input/Output Requirements
      2. 2.2.2 Boot Sequence
        1. 2.2.2.1 SOP Modes
      3. 2.2.3 Power Down Sequence
    3. 2.3 Clock Source
      1. 2.3.1 Fast Clock
      2. 2.3.2 Slow Clock
        1. 2.3.2.1 Slow Clock Generated Internally
        2. 2.3.2.2 Slow Clock Using an External Oscillator
    4. 2.4 Radio Frequency (RF)
    5. 2.5 Digital Interfaces
      1. 2.5.1 Reset
      2. 2.5.2 Secure Digital Input Output (SDIO)
        1. 2.5.2.1 SDIO Timing Diagram: Default Speed
        2. 2.5.2.2 SDIO Timing Diagram: High Speed
      3. 2.5.3 Serial Peripheral Interface (SPI)
        1. 2.5.3.1 SPI Timing Diagram
      4. 2.5.4 Universal Asynchronous Receiver-Transmitter (UART)
        1. 2.5.4.1 UART Timing Diagram
      5. 2.5.5 Serial Wire Debug (SWD)
      6. 2.5.6 WLAN Interrupt Request (HOST_IRQ_WL)
      7. 2.5.7 Logger
      8. 2.5.8 Coexistence
  6. 3Layout Considerations – CC33xx Devices
    1. 3.1 Layout Reference Design
      1. 3.1.1 Reference Design – CC330x Single Band Layout
      2. 3.1.2 Reference Design – CC335x Dual Band Layout
      3. 3.1.3 BP-CC3351 Design Layout
      4. 3.1.4 M2-CC3351 Design Layout
    2. 3.2 IC Thermal Pad
    3. 3.3 Radio Frequency (RF)
    4. 3.4 XTAL
    5. 3.5 Power Supplies
    6. 3.6 SDIO
  7. 4Schematic Considerations – CC33xxMOD
    1. 4.1 Schematic Reference Design – CC33xxMOD
    2. 4.2 Power Supply
  8. 5Layout Considerations – CC33xxMOD
    1. 5.1 CC33xxMOD RF Layout Recommendations
  9. 6 CC33xxMOD Regulatory Compliance
    1. 6.1 CC33xxMOD OEM Integration Manual
  10. 7Revision History

3.1 Layout Reference Design

TI recommends following the reference design and guidelines for the CC33xx devices as closely as possible to achieve the full capabilities of the CC33xx devices (as listed in the device-specific data sheet) and to pass certification. These layout guidelines are especially important in the engine area, which includes the sensitive RF components and traces.

The following list of designs incorporate the layout guidelines given throughout this document. Refer to these as reference sources:

The figures below include the engine area of the CC33xx devices on the top layer (layer 1) and ground layer (layer 2) for all three designs.

Note:

Before proceeding with any hardware build involving the CC33xx devices, TI recommends reviewing the CC33x1 Design Checklist before submitting the design for review.

Additionally, the engine area (as shown in the reference design) can be rotated according to the design requirements.