SWRU612B December   2023  – June 2026 CC3300 , CC3300MOD , CC3301 , CC3301MOD , CC3351 , CC3351MOD

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
    1. 1.1 Overview
  5. 2Schematic Considerations – CC33xx Devices
    1. 2.1 Schematic Reference Design
    2. 2.2 Power Supply
      1. 2.2.1 Power Input/Output Requirements
      2. 2.2.2 Boot Sequence
        1. 2.2.2.1 SOP Modes
      3. 2.2.3 Power Down Sequence
    3. 2.3 Clock Source
      1. 2.3.1 Fast Clock
      2. 2.3.2 Slow Clock
        1. 2.3.2.1 Slow Clock Generated Internally
        2. 2.3.2.2 Slow Clock Using an External Oscillator
    4. 2.4 Radio Frequency (RF)
    5. 2.5 Digital Interfaces
      1. 2.5.1 Reset
      2. 2.5.2 Secure Digital Input Output (SDIO)
        1. 2.5.2.1 SDIO Timing Diagram: Default Speed
        2. 2.5.2.2 SDIO Timing Diagram: High Speed
      3. 2.5.3 Serial Peripheral Interface (SPI)
        1. 2.5.3.1 SPI Timing Diagram
      4. 2.5.4 Universal Asynchronous Receiver-Transmitter (UART)
        1. 2.5.4.1 UART Timing Diagram
      5. 2.5.5 Serial Wire Debug (SWD)
      6. 2.5.6 WLAN Interrupt Request (HOST_IRQ_WL)
      7. 2.5.7 Logger
      8. 2.5.8 Coexistence
  6. 3Layout Considerations – CC33xx Devices
    1. 3.1 Layout Reference Design
      1. 3.1.1 Reference Design – CC330x Single Band Layout
      2. 3.1.2 Reference Design – CC335x Dual Band Layout
      3. 3.1.3 BP-CC3351 Design Layout
      4. 3.1.4 M2-CC3351 Design Layout
    2. 3.2 IC Thermal Pad
    3. 3.3 Radio Frequency (RF)
    4. 3.4 XTAL
    5. 3.5 Power Supplies
    6. 3.6 SDIO
  7. 4Schematic Considerations – CC33xxMOD
    1. 4.1 Schematic Reference Design – CC33xxMOD
    2. 4.2 Power Supply
  8. 5Layout Considerations – CC33xxMOD
    1. 5.1 CC33xxMOD RF Layout Recommendations
  9. 6 CC33xxMOD Regulatory Compliance
    1. 6.1 CC33xxMOD OEM Integration Manual
  10. 7Revision History

3.2 IC Thermal Pad

Underneath the IC is one continuous ground plane on the top layer with 25 vias evenly distributed, as shown in Figure 3-9. This is important for thermal dissipation and RF performance.

Figure 3-9 is sampled from the CC330x reference design files.

M2-CC3351 CC3351MOD CC3351 CC3301MOD CC3301 CC3300MOD CC3300 BP-CC3351 Reference Design Thermal Pad Figure 3-9 Reference Design Thermal Pad