ZHCSIS3B
September 2018 – December 2022
DP83869HM
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
说明(续)
6
Device Comparison Table
7
Pin Configuration and Functions
8
Specifications
8.1
Absolute Maximum Ratings
8.2
ESD Ratings
8.3
Recommended Operating Conditions
8.4
Thermal Information
8.5
Electrical Characteristics
8.6
Timing Requirements
8.7
Timing Diagrams
8.8
Typical Characteristics
9
Detailed Description
9.1
Overview
9.2
Functional Block Diagram
9.3
Feature Description
9.3.1
WoL (Wake-on-LAN) Packet Detection
9.3.1.1
Magic Packet Structure
9.3.1.2
Magic Packet Example
9.3.1.3
Wake-on-LAN Configuration and Status
9.3.2
Start of Frame Detect for IEEE 1588 Time Stamp
9.3.2.1
SFD Latency Variation and Determinism
9.3.2.1.1
1000-Mb SFD Variation in Master Mode
9.3.2.1.2
1000-Mb SFD Variation in Slave Mode
9.3.2.1.3
100-Mb SFD Variation
9.3.3
Clock Output
9.3.4
Loopback Mode
9.3.4.1
Near-End Loopback
9.3.4.1.1
MII Loopback
9.3.4.1.2
PCS Loopback
9.3.4.1.3
Digital Loopback
9.3.4.1.4
Analog Loopback
9.3.4.1.5
External Loopback
9.3.4.1.6
Far-End (Reverse) Loopback
39
9.3.5
BIST Configuration
9.3.6
Interrupt
9.3.7
Power-Saving Modes
9.3.7.1
IEEE Power Down
9.3.7.2
Active Sleep
9.3.7.3
Passive Sleep
9.3.8
Mirror Mode
9.3.9
Speed Optimization
9.3.10
Cable Diagnostics
9.3.10.1
TDR
9.3.11
Fast Link Drop
9.3.12
Jumbo Frames
9.4
Device Functional Modes
9.4.1
Copper Ethernet
9.4.1.1
1000BASE-T
9.4.1.2
100BASE-TX
9.4.1.3
10BASE-Te
9.4.2
Fiber Ethernet
9.4.2.1
1000BASE-X
9.4.2.2
100BASE-FX
9.4.3
Serial GMII (SGMII)
9.4.4
Reduced GMII (RGMII)
9.4.4.1
1000-Mbps Mode Operation
9.4.4.2
1000-Mbps Mode Timing
9.4.4.3
10- and 100-Mbps Mode
9.4.5
Media Independent Interface (MII)
9.4.6
Bridge Modes
9.4.6.1
RGMII-to-SGMII Mode
9.4.6.2
SGMII-to-RGMII Mode
69
9.4.7
Media Convertor Mode
9.4.8
Register Configuration for Operational Modes
9.4.8.1
RGMII-to-Copper Ethernet Mode
9.4.8.2
RGMII-to-1000Base-X Mode
9.4.8.3
RGMII-to-100Base-FX Mode
9.4.8.4
RGMII-to-SGMII Bridge Mode
9.4.8.5
1000M Media Convertor Mode
9.4.8.6
100M Media Convertor Mode
9.4.8.7
SGMII-to-Copper Ethernet Mode
9.4.9
Serial Management Interface
9.4.9.1
Extended Address Space Access
9.4.9.1.1
Write Address Operation
9.4.9.1.2
Read Address Operation
9.4.9.1.3
Write (No Post Increment) Operation
9.4.9.1.4
Read (No Post Increment) Operation
9.4.9.1.5
Write (Post Increment) Operation
9.4.9.1.6
Read (Post Increment) Operation
9.4.9.1.7
Example of Read Operation Using Indirect Register Access
9.4.9.1.8
Example of Write Operation Using Indirect Register Access
9.4.10
Auto-Negotiation
9.4.10.1
Speed and Duplex Selection - Priority Resolution
9.4.10.2
Master and Slave Resolution
9.4.10.3
Pause and Asymmetrical Pause Resolution
9.4.10.4
Next Page Support
9.4.10.5
Parallel Detection
9.4.10.6
Restart Auto-Negotiation
9.4.10.7
Enabling Auto-Negotiation Through Software
9.4.10.8
Auto-Negotiation Complete Time
9.4.10.9
Auto-MDIX Resolution
9.5
Programming
9.5.1
Strap Configuration
9.5.1.1
Straps for PHY Address
9.5.1.2
Strap for DP83869HM Functional Mode Selection
9.5.1.3
LED Default Configuration Based on Device Mode
9.5.1.4
Straps for RGMII/SGMII to Copper
9.5.1.5
Straps for RGMII to 1000Base-X
9.5.1.6
Straps for RGMII to 100Base-FX
9.5.1.7
Straps for Bridge Mode (SGMII-RGMII)
9.5.1.8
Straps for 100M Media Convertor
9.5.1.9
Straps for 1000M Media Convertor
9.5.2
LED Configuration
9.5.3
Reset Operation
9.5.3.1
Hardware Reset
9.5.3.2
IEEE Software Reset
9.5.3.3
Global Software Reset
9.5.3.4
Global Software Restart
9.6
Register Maps
9.6.1
DP83869 Registers
10
Application and Implementation
10.1
Application Information
10.2
Typical Applications
10.2.1
Copper Ethernet Typical Application
10.2.1.1
Design Requirements
10.2.1.2
Detailed Design Procedure
10.2.1.2.1
Clock Input
10.2.1.2.1.1
Crystal Recommendations
10.2.1.2.1.2
External Clock Source Recommendation
10.2.1.2.2
Magnetics Requirements
10.2.1.2.2.1
Magnetics Connection
10.2.1.3
Application Curves
10.2.2
Fiber Ethernet Typical Ethernet
10.2.2.1
Design Requirements
10.2.2.2
Detailed Design Procedure
10.2.2.2.1
Transceiver Connections
10.2.2.3
Application Curves
11
Power Supply Recommendations
11.1
Two-Supply Configuration
11.2
Three-Supply Configuration
12
Layout
12.1
Layout Guidelines
12.1.1
Signal Traces
12.1.1.1
MAC Interface Layout Guidelines
12.1.1.1.1
SGMII Layout Guidelines
12.1.1.1.2
RGMII Layout Guidelines
12.1.1.2
MDI Layout Guidelines
12.1.2
Return Path
12.1.3
Transformer Layout
12.1.4
Metal Pour
12.1.5
PCB Layer Stacking
12.2
Layout Example
13
Device and Documentation Support
13.1
Documentation Support
13.1.1
Related Documentation
13.2
Receiving Notification of Documentation Updates
13.3
支持资源
13.4
Trademarks
13.5
Electrostatic Discharge Caution
13.6
术语表
14
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
RGZ|48
MPQF123F
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsis3b_oa
1
特性
多种工作模式
支持媒介:铜缆和光纤
可在铜缆和光纤之间进行切换
在 RGMII 与 SGMII 之间建立桥接
可用的最高环境温度为 125°C
超过了 8kV IEC61000-4-2 ESD
低功耗
对于 1000Base-X,< 150mW
对于 1000Base-T,< 500mW
低 RGMII 延迟
对于 1000Base-T,总延迟 ≤ 384ns
对于 100Base-TX,总延迟 ≤ 361ns
符合时间敏感网络 (TSN) 标准
适用于 SyncE 的恢复时钟输出
可选同步时钟输出:25 MHz 和 125 MHz
SFF-8431 V4.1、1000BASE-X 和 100BASE-FX 兼容
通过 SFD 支持 IEEE1588
支持局域网唤醒
可配置的 IO 电压:1.8V、2.5V 和 3.3V
SGMII、RGMII、MII MAC 接口
巨型帧支持 1000M 和 100M 速度
电缆诊断
TDR
BIST
可编程 RGMII 终端阻抗
集成 MDI 终端电阻器
快速链路丢弃模式
符合 IEEE 802.3 1000Base-T、100Base-TX、10Base-Te、1000Base-X、100Base-FX 标准