ZHCSIS3B September   2018  – December 2022 DP83869HM

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 说明（续）
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Timing Requirements
    7. 8.7 Timing Diagrams
    8. 8.8 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  WoL (Wake-on-LAN) Packet Detection
        1. 9.3.1.1 Magic Packet Structure
        2. 9.3.1.2 Magic Packet Example
        3. 9.3.1.3 Wake-on-LAN Configuration and Status
      2. 9.3.2  Start of Frame Detect for IEEE 1588 Time Stamp
        1. 9.3.2.1 SFD Latency Variation and Determinism
          1. 9.3.2.1.1 1000-Mb SFD Variation in Master Mode
          2. 9.3.2.1.2 1000-Mb SFD Variation in Slave Mode
          3. 9.3.2.1.3 100-Mb SFD Variation
      3. 9.3.3  Clock Output
      4. 9.3.4  Loopback Mode
        1. 9.3.4.1 Near-End Loopback
          1. 9.3.4.1.1 MII Loopback
          2. 9.3.4.1.2 PCS Loopback
          3. 9.3.4.1.3 Digital Loopback
          4. 9.3.4.1.4 Analog Loopback
          5. 9.3.4.1.5 External Loopback
          6. 9.3.4.1.6 Far-End (Reverse) Loopback
        2.       39
      5. 9.3.5  BIST Configuration
      6. 9.3.6  Interrupt
      7. 9.3.7  Power-Saving Modes
        1. 9.3.7.1 IEEE Power Down
        2. 9.3.7.2 Active Sleep
        3. 9.3.7.3 Passive Sleep
      8. 9.3.8  Mirror Mode
      9. 9.3.9  Speed Optimization
      10. 9.3.10 Cable Diagnostics
        1. 9.3.10.1 TDR
      11. 9.3.11 Fast Link Drop
      12. 9.3.12 Jumbo Frames
    4. 9.4 Device Functional Modes
      1. 9.4.1  Copper Ethernet
        1. 9.4.1.1 1000BASE-T
        2. 9.4.1.2 100BASE-TX
        3. 9.4.1.3 10BASE-Te
      2. 9.4.2  Fiber Ethernet
        1. 9.4.2.1 1000BASE-X
        2. 9.4.2.2 100BASE-FX
      3. 9.4.3  Serial GMII (SGMII)
      4. 9.4.4  Reduced GMII (RGMII)
        1. 9.4.4.1 1000-Mbps Mode Operation
        2. 9.4.4.2 1000-Mbps Mode Timing
        3. 9.4.4.3 10- and 100-Mbps Mode
      5. 9.4.5  Media Independent Interface (MII)
      6. 9.4.6  Bridge Modes
        1. 9.4.6.1 RGMII-to-SGMII Mode
        2. 9.4.6.2 SGMII-to-RGMII Mode
        3.       69
      7. 9.4.7  Media Convertor Mode
      8. 9.4.8  Register Configuration for Operational Modes
        1. 9.4.8.1 RGMII-to-Copper Ethernet Mode
        2. 9.4.8.2 RGMII-to-1000Base-X Mode
        3. 9.4.8.3 RGMII-to-100Base-FX Mode
        4. 9.4.8.4 RGMII-to-SGMII Bridge Mode
        5. 9.4.8.5 1000M Media Convertor Mode
        6. 9.4.8.6 100M Media Convertor Mode
        7. 9.4.8.7 SGMII-to-Copper Ethernet Mode
      9. 9.4.9  Serial Management Interface
        1. 9.4.9.1 Extended Address Space Access
          1. 9.4.9.1.1 Write Address Operation
          2. 9.4.9.1.2 Read Address Operation
          3. 9.4.9.1.3 Write (No Post Increment) Operation
          4. 9.4.9.1.4 Read (No Post Increment) Operation
          5. 9.4.9.1.5 Write (Post Increment) Operation
          6. 9.4.9.1.6 Read (Post Increment) Operation
          7. 9.4.9.1.7 Example of Read Operation Using Indirect Register Access
          8. 9.4.9.1.8 Example of Write Operation Using Indirect Register Access
      10. 9.4.10 Auto-Negotiation
        1. 9.4.10.1 Speed and Duplex Selection - Priority Resolution
        2. 9.4.10.2 Master and Slave Resolution
        3. 9.4.10.3 Pause and Asymmetrical Pause Resolution
        4. 9.4.10.4 Next Page Support
        5. 9.4.10.5 Parallel Detection
        6. 9.4.10.6 Restart Auto-Negotiation
        7. 9.4.10.7 Enabling Auto-Negotiation Through Software
        8. 9.4.10.8 Auto-Negotiation Complete Time
        9. 9.4.10.9 Auto-MDIX Resolution
    5. 9.5 Programming
      1. 9.5.1 Strap Configuration
        1. 9.5.1.1 Straps for PHY Address
        2. 9.5.1.2 Strap for DP83869HM Functional Mode Selection
        3. 9.5.1.3 LED Default Configuration Based on Device Mode
        4. 9.5.1.4 Straps for RGMII/SGMII to Copper
        5. 9.5.1.5 Straps for RGMII to 1000Base-X
        6. 9.5.1.6 Straps for RGMII to 100Base-FX
        7. 9.5.1.7 Straps for Bridge Mode (SGMII-RGMII)
        8. 9.5.1.8 Straps for 100M Media Convertor
        9. 9.5.1.9 Straps for 1000M Media Convertor
      2. 9.5.2 LED Configuration
      3. 9.5.3 Reset Operation
        1. 9.5.3.1 Hardware Reset
        2. 9.5.3.2 IEEE Software Reset
        3. 9.5.3.3 Global Software Reset
        4. 9.5.3.4 Global Software Restart
    6. 9.6 Register Maps
      1. 9.6.1 DP83869 Registers
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Copper Ethernet Typical Application
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Clock Input
            1. 10.2.1.2.1.1 Crystal Recommendations
            2. 10.2.1.2.1.2 External Clock Source Recommendation
          2. 10.2.1.2.2 Magnetics Requirements
            1. 10.2.1.2.2.1 Magnetics Connection
        3. 10.2.1.3 Application Curves
      2. 10.2.2 Fiber Ethernet Typical Ethernet
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
          1. 10.2.2.2.1 Transceiver Connections
        3. 10.2.2.3 Application Curves
  11. 11Power Supply Recommendations
    1. 11.1 Two-Supply Configuration
    2. 11.2 Three-Supply Configuration
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Signal Traces
        1. 12.1.1.1 MAC Interface Layout Guidelines
          1. 12.1.1.1.1 SGMII Layout Guidelines
          2. 12.1.1.1.2 RGMII Layout Guidelines
        2. 12.1.1.2 MDI Layout Guidelines
      2. 12.1.2 Return Path
      3. 12.1.3 Transformer Layout
      4. 12.1.4 Metal Pour
      5. 12.1.5 PCB Layer Stacking
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 支持资源
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 术语表
  14. 14Mechanical, Packaging, and Orderable Information

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11.1 Two-Supply Configuration

Figure 11-1 shows the connection diagram for a two-supply configuration.

Figure 11-1 Two-Supply Configuration

For a two-supply configuration, both VDDA1P8 pins must be left unconnected.

Place 1-μF and 0.1-μF decoupling capacitors as close as possible to component VDD pins, placing the 0.1-μF capacitor closest to the pin.

The strap (SUPPLYMODE_SEL, pin 23) shall be pulled low to set double supply mode. VDDIO may be 3.3 V, 2.5 V, or 1.8 V. VDDIO_SEL strap shall be selected appropriately to VDDIO voltage applied.

For two-supply configuration, the recommendation is to power all supplies together. If that is not possible, then the following power sequencing must be used.

Figure 11-2 Two-Supply Sequence Diagram
Table 11-1 Two-Supply Sequence

PARAMETER

TEST CONDITIONS

MIN

NOM

MAX

UNIT

t1

Supply ramp time

Applicable to all supplies0.5100ms
t2Time instance at which VDDIO starts upMeasured with respect to start of VDDA2P5 and VDD1P1

50

ms