ZHCSMX7A August   2021  – December 2021 TPS92519-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Buck Converter Switching Operation
      2. 7.3.2  Switching Frequency and Adaptive On-Time Control
      3. 7.3.3  Minimum On-Time, Off-Time, and Inductor Ripple
      4. 7.3.4  Enable
      5. 7.3.5  LED Current Regulation and Error Amplifier
      6. 7.3.6  Start-up Sequence
      7. 7.3.7  Analog Dimming and Forced Continuous Conduction Mode
      8. 7.3.8  External PWM Dimming and Input Undervoltage Lockout (UVLO)
      9. 7.3.9  Shunt FET Dimming or Matrix Beam Application
      10. 7.3.10 Bias Supply
      11. 7.3.11 Bootstrap Supply
      12. 7.3.12 Faults and Diagnostics
      13. 7.3.13 Output Short Circuit Fault
      14. 7.3.14 Output Open Circuit Fault
      15. 7.3.15 Parallel Operation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power On Reset (POR)
      2. 7.4.2 Run Mode
      3. 7.4.3 Sleep Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1  Duty Cycle Consideration
      2. 8.1.2  Switching Frequency Selection
      3. 8.1.3  LED Current Set Point
      4. 8.1.4  Inductor Selection
      5. 8.1.5  Output Capacitor Selection
      6. 8.1.6  Input Capacitor Selection
      7. 8.1.7  Bootstrap Capacitor Selection
      8. 8.1.8  Compensation Capacitor Selection
      9. 8.1.9  Input Undervoltage Protection
      10. 8.1.10 CSN Protection Diode
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Calculating Duty Cycle
        2. 8.2.2.2 Calculating Minimum On-Time and Off-Time
        3. 8.2.2.3 Minimum Switching Frequency
        4. 8.2.2.4 LED Current Set Point
        5. 8.2.2.5 Inductor Selection
        6. 8.2.2.6 Output Capacitor Selection
        7. 8.2.2.7 Bootstrap Capacitor Selection
        8. 8.2.2.8 Compensation Capacitor Selection
        9. 8.2.2.9 PWM Dimming and Input Voltage Protection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Compact Layout for EMI Reduction
        1. 10.1.1.1 Ground Plane
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 术语表
  12. 12Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
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订购信息

6.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply Voltage V5A, V5D to GND –0.3 5.5 V
Boot voltage BSTx to SWx –0.3 5.5 V
BSTx to PGND –0.3 70 V
Switch node voltage SWx to PGND –0.5 65 V
SWx to PGND (< 10ns) –3.5 V
Drain node voltage VINx to PGND –0.3 65 V
Current CSNx to VINx (< 10µs) 1.5 A
GND to CSPx, GND to CSNx (< 10µs) 430 mA
Inputs CSNx - VINx 0.5 V
CSPx, CSNx to GND –0.5 65 V
CSPx to CSNx –0.3 0.3 V
UDIMx to GND –0.3 65 V
COMPx, IADJx, FSET, EN to GND –0.3 5.5 V
Outputs  FLTx to GND –0.3 5.5 V
Junction temperature TJ 150 °C
Lead temperature Soldering, 10 s 260 °C
Storage temperature Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.