ZHCSMU5A July   2020  – December 2020 TPS25814

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Recommended Capacitance
    5. 6.5  Thermal Information
    6. 6.6  Power Supply Characteristics
    7. 6.7  Power Consumption
    8. 6.8  PP_5V Power Switch Characteristics
    9. 6.9  Power Path Supervisory
    10. 6.10 CC Cable Detection Parameters
    11. 6.11 CC VCONN Parameters
    12. 6.12 Thermal Shutdown Characteristics
    13. 6.13 Input/Output (I/O) Characteristics
    14. 6.14 BC1.2 Characteristics
    15. 6.15 I2C Requirements and Characteristics
    16. 6.16 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power Paths
        1. 8.3.1.1 Internal Sourcing Power Paths
          1. 8.3.1.1.1 PP_5V Current Clamping
          2. 8.3.1.1.2 PP_5V Local Overtemperature Shut Down (OTSD)
          3. 8.3.1.1.3 PP_5V OVP
          4. 8.3.1.1.4 PP_5V UVLO
          5. 8.3.1.1.5 PP_5Vx Reverse Current Protection
          6. 8.3.1.1.6 PP_CABLE Current Clamp
          7. 8.3.1.1.7 PP_CABLE Local Overtemperature Shut Down (OTSD)
          8. 8.3.1.1.8 PP_CABLE UVLO
      2. 8.3.2 Cable Plug and Orientation Detection
        1. 8.3.2.1 Configured as a Source
      3. 8.3.3 Overvoltage Protection (CC1, CC2)
      4. 8.3.4 Default Behavior Configuration (ADCIN1, ADCIN2)
      5. 8.3.5 BC 1.2 (USB_P, USB_N)
      6. 8.3.6 Digital Interfaces
        1. 8.3.6.1 Fault Indicators ( FAULT )
        2. 8.3.6.2 Sink Attachment Indicator ( SINK )
        3. 8.3.6.3 Polarity Indicator ( POL )
        4. 8.3.6.4 Power Management ( CHG_HI)
        5. 8.3.6.5 Battery Charging Control (CTL)
        6. 8.3.6.6 Debug Accessory Detection ( DEBUG)
        7. 8.3.6.7 Disable the Port (EN)
        8. 8.3.6.8 I2C Interface
      7. 8.3.7 I2C Interface
        1. 8.3.7.1 I2C Interface Description
        2. 8.3.7.2 I2C Clock Stretching
        3. 8.3.7.3 I2C Address Setting
        4. 8.3.7.4 Unique Address Interface
    4. 8.4 Device Functional Modes
      1. 8.4.1 Pin Strapping to Configure Default Behavior
      2. 8.4.2 Power States
      3. 8.4.3 Schottky for Current Surge Protection
      4. 8.4.4 Thermal Shutdown
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Type C DFP Port Implementation with Embedded Controller
        1. 9.2.1.1 Detailed Design Procedure
          1. 9.2.1.1.1 Type-C Connector VBUS Capacitors
          2. 9.2.1.1.2 VBUS Schottky and TVS Diodes
          3. 9.2.1.1.3 VBUS Snubber Circuit
        2. 9.2.1.2 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 3.3-V Power
      1. 10.1.1 VIN_3V3 Input Switch
    2. 10.2 1.5-V Power
    3. 10.3 Recommended Supply Load Capacitance
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Top TPS25814 Placement and Bottom Component Placement and Layout
    2. 11.2 Layout Example
    3. 11.3 Component Placement
    4. 11.4 Routing and View Placement
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 第三方产品免责声明
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 静电放电警告
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
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订购信息

12.5 静电放电警告

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif 静电放电 (ESD) 会损坏这个集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理和安装程序，可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级，大至整个器件故障。精密的集成电路可能更容易受到损坏，这是因为非常细微的参数更改都可能会导致器件与其发布的规格不相符。