ZHCSNO0B April   2021  – November 2021 DP83561-SP

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1. 5.1 Pin States
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
      1. 6.6.1 Timing Requirement Diagrams
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Engineering Model (Parts With /EM Suffix)
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Copper Ethernet
        1. 7.3.1.1 1000BASE-T
        2. 7.3.1.2 100BASE-TX
        3. 7.3.1.3 10BASE-Te
      2. 7.3.2 MAC Interfaces
        1. 7.3.2.1 Reduced GMII (RGMII)
          1. 7.3.2.1.1 RGMII-TX Requirements
          2. 7.3.2.1.2 RGMII-RX Requirements
          3. 7.3.2.1.3 1000-Mbps Mode Operation
          4. 7.3.2.1.4 1000-Mbps Mode Timing
          5. 7.3.2.1.5 10- and 100-Mbps Mode
        2. 7.3.2.2 Media Independent Interface (MII)
      3. 7.3.3 Auto-Negotiation
        1. 7.3.3.1 Speed and Duplex Selection - Priority Resolution
        2. 7.3.3.2 Master and Slave Resolution
        3. 7.3.3.3 Pause and Asymmetrical Pause Resolution
        4. 7.3.3.4 Next Page Support
        5. 7.3.3.5 Parallel Detection
        6. 7.3.3.6 Restart Auto-Negotiation
        7. 7.3.3.7 Enabling Auto-Negotiation Through Software
        8. 7.3.3.8 Auto-Negotiation Complete Time
        9. 7.3.3.9 Auto-MDIX Resolution
      4. 7.3.4 Speed Optimization
      5. 7.3.5 Radiation Performance
        1. 7.3.5.1 Total Ionizing Dose (TID)
        2. 7.3.5.2 Single-Event Effects (SEE)
        3. 7.3.5.3 Single Event Functional Interrupt (SEFI) Monitor Suite
          1. 7.3.5.3.1 PCS State Machine Monitors
          2. 7.3.5.3.2 Configuration Register Monitors
          3. 7.3.5.3.3 Temperature Monitor
          4. 7.3.5.3.4 PLL Lock Monitor
      6. 7.3.6 WoL (Wake-on-LAN) Packet Detection
        1. 7.3.6.1 Magic Packet Structure
        2. 7.3.6.2 Magic Packet Example
        3. 7.3.6.3 Wake-on-LAN Configuration and Status
      7. 7.3.7 Start of Frame Detect for IEEE 1588 Time Stamp
        1. 7.3.7.1 SFD Latency Variation and Determinism
          1. 7.3.7.1.1 1000M SFD Variation in Master Mode
          2. 7.3.7.1.2 1000M SFD Variation in Slave Mode
          3. 7.3.7.1.3 100M SFD Variation
      8. 7.3.8 Cable Diagnostics
        1. 7.3.8.1 TDR
        2. 7.3.8.2 Fast Link Drop
        3. 7.3.8.3 Fast Link Detect
        4. 7.3.8.4 Energy Detect
        5. 7.3.8.5 IEEE 802.3 Test Modes
        6. 7.3.8.6 Jumbo Frames
      9. 7.3.9 Clock Output
    4. 7.4 Device Functional Modes
      1. 7.4.1 Mirror Mode
      2. 7.4.2 Loopback Mode
        1. 7.4.2.1 Near-End Loopback
          1. 7.4.2.1.1 MII Loopback
          2. 7.4.2.1.2 PCS Loopback
          3. 7.4.2.1.3 Digital Loopback
          4. 7.4.2.1.4 Analog Loopback
          5. 7.4.2.1.5 External Loopback
          6. 7.4.2.1.6 Far-End (Reverse) Loopback
        2. 7.4.2.2 Loopback Availability Exception
      3. 7.4.3 Power-Saving Modes
        1. 7.4.3.1 IEEE Power Down
        2. 7.4.3.2 Deep Power-Down Mode
        3. 7.4.3.3 Active Sleep
        4. 7.4.3.4 Passive Sleep
    5. 7.5 Programming
      1. 7.5.1 Serial Management Interface
        1. 7.5.1.1 Extended Address Space Access
          1. 7.5.1.1.1 Write Address Operation
          2. 7.5.1.1.2 Read Address Operation
          3. 7.5.1.1.3 Write (No Post Increment) Operation
          4. 7.5.1.1.4 Read (No Post Increment) Operation
          5. 7.5.1.1.5 Write (Post Increment) Operation
          6. 7.5.1.1.6 Read (Post Increment) Operation
          7. 7.5.1.1.7 Example of Read Operation Using Indirect Register Access
          8. 7.5.1.1.8 Example of Write Operation Using Indirect Register Access
      2. 7.5.2 Interrupt
      3. 7.5.3 BIST Configuration
      4. 7.5.4 Strap Configuration
      5. 7.5.5 LED Configuration
      6. 7.5.6 LED Operation From 1.8-V I/O VDD Supply
      7. 7.5.7 Reset Operation
        1. 7.5.7.1 Hardware Reset
        2. 7.5.7.2 IEEE Software Reset
        3. 7.5.7.3 Global Software Reset
        4. 7.5.7.4 Global Software Restart
        5. 7.5.7.5 PCS Restart
    6. 7.6 Register Maps
      1. 7.6.1 DP83561SP Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Clock Input
          1. 8.2.2.1.1 Crystal Recommendations
          2. 8.2.2.1.2 External Clock Source Recommendations
        2. 8.2.2.2 MAC Interface
          1. 8.2.2.2.1 RGMII Layout Guidelines
          2. 8.2.2.2.2 MII Layout Guidelines
        3. 8.2.2.3 Media Dependent Interface (MDI)
          1. 8.2.2.3.1 MDI Layout Guidelines
        4. 8.2.2.4 Magnetics Requirements
          1. 8.2.2.4.1 Magnetics Connection
  9. 9 Power Supply Recommendations
    1. 9.1 Two-Supply Configuration
    2. 9.2 Three-Supply Configuration
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Signal Traces
      2. 10.1.2 Return Path
      3. 10.1.3 Transformer Layout
      4. 10.1.4 Metal Pour
      5. 10.1.5 PCB Layer Stacking
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information

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6.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)(1)(3)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
IEEE Tx CONFORMANCE (1000BaseT)
Output Differential Voltage Normal Mode, All channels 0.67 0.745 0.82 V
IEEE Tx CONFORMANCE (100BaseTx)
Output Differential Voltage Normal Mode, Channels A and B (2) 0.95 1.00 1.05 V
IEEE Tx CONFORMANCE (10BaseTe)
Output Differential Voltage 1.75 V
POWER CONSUMPTION Copper mode (100m cable)
I(1V1) RGMII to Copper (1G) Traffic: 100%,  Packet Size: 1512, Content: Random, VT range 215 mA
RGMII to Copper (100M) Traffic: 100%,  Packet Size: 1512, Content: Random, VT range 115 mA
RGMII to Copper (10M) Traffic: 100%,  Packet Size: 1512, Content: Random, VT range 100 mA
MII to Copper (100M) Traffic: 100%,  Packet Size: 1512, Content: Random, VT range 120 mA
MII to Copper (10M) Traffic: 100%,  Packet Size: 1512, Content: Random, VT range 90 mA
I(1V8) RGMII to Copper (1G) Traffic: 100%,  Packet Size: 1512, Content: Random, VT range 60 mA
RGMII to Copper (100M) Traffic: 100%,  Packet Size: 1512, Content: Random, VT range 25 mA
RGMII to Copper (10M) Traffic: 100%,  Packet Size: 1512, Content: Random, VT range 15 mA
MII to Copper (100M) Traffic: 100%,  Packet Size: 1512, Content: Random, VT range 25 mA
MII to Copper (10M) Traffic: 100%,  Packet Size: 1512, Content: Random, VT range 15 mA
I(2V5) RGMII to Copper (1G) Traffic: 100%,  Packet Size: 1512, Content: Random, VT range 90 mA
RGMII to Copper (100M) Traffic: 100%,  Packet Size: 1512, Content: Random, VT range 50 mA
RGMII to Copper (10M) Traffic: 100%,  Packet Size: 1512, Content: Random, VT range 76 mA
MII to Copper (100M) Traffic: 100%,  Packet Size: 1512, Content: Random, VT range 50 mA
MII to Copper (10M) Traffic: 100%,  Packet Size: 1512, Content: Random, VT range 85 mA
I(VDDIO=3.3V) RGMII to Copper (1G) Traffic: 100%,  Packet Size: 1512, Content: Random, VT range 80 mA
RGMII to Copper (100M) Traffic: 100%,  Packet Size: 1512, Content: Random, VT range 45 mA
RGMII to Copper (10M) Traffic: 100%,  Packet Size: 1512, Content: Random, VT range 35 mA
MII to Copper (100M) Traffic: 100%,  Packet Size: 1512, Content: Random, VT range 50 mA
MII to Copper (10M) Traffic: 100%,  Packet Size: 1512, Content: Random, VT range 35 mA
I(VDDIO=1.8V) RGMII to Copper (1G) Traffic: 100%,  Packet Size: 1512, Content: Random, VT range 35 mA
RGMII to Copper (100M) Traffic: 100%,  Packet Size: 1512, Content: Random, VT range 20 mA
RGMII to Copper (10M) Traffic: 100%,  Packet Size: 1512, Content: Random, VT range 15 mA
MII to Copper (100M) Traffic: 100%,  Packet Size: 1512, Content: Random, VT range 16 mA
MII to Copper (10M) Traffic: 100%,  Packet Size: 1512, Content: Random, VT range 11 mA
I(VDDIO=2.5V) RGMII to Copper (1G) Traffic: 100%,  Packet Size: 1512, Content: Random, VT range 50 mA
RGMII to Copper (100M) Traffic: 100%,  Packet Size: 1512, Content: Random, VT range 27 mA
RGMII to Copper (10M) Traffic: 100%,  Packet Size: 1512, Content: Random, VT range 20 mA
MII to Copper (100M) Traffic: 100%,  Packet Size: 1512, Content: Random, VT range 26 mA
MII to Copper (10M) Traffic: 100%,  Packet Size: 1512, Content: Random, VT range 17 mA
POWER CONSUMPTION Low power modes
I(1V1) IEEE Power Down 90 mA
Active Sleep 110 mA
RESET 95 mA
I(1V8) IEEE Power Down 1 mA
Active Sleep 10 mA
RESET 1 mA
I(2V5) IEEE Power Down 5 mA
Active Sleep 30 mA
RESET 5 mA
I(VDDIO=3.3) IEEE Power Down 20 mA
Active Sleep 20 mA
RESET 20 mA
Monitors
Temperature Sensor Temperature Sensor Range -55oC to 125oC -55 125C ℃
Temperature Sensor Resolution (LSB) -55oC to 125oC 9 ℃
Temperature Sensor Accuracy ( Voltage and Temperature Variation on single part) -55oC to 125oC 9.5 ℃
Temperature Sensor Accuracy Part-to-Part (Voltage, Temperature and part to part variation) -55oC to 125oC 12 ℃
BOOTSTRAP DC CHARACTERISTICS (4 Level) (PHY address pins)
VMODE0 Mode 0 Strap Voltage Range 0 0.093 x VDDIO V
VMODE1 Mode 1 Strap Voltage Range 0.136 x VDDIO 0.184 x VDDIO V
VMODE2 Mode 2 Strap Voltage Range 0.219 x VDDIO 0.280 x VDDIO V
VMODE3 Mode 3 Strap Voltage Range 0.6 x VDDIO 0.888 x VDDIO V
BOOTSTRAP DC CHARACTERISTICS (2 Level)
VMODE0 Mode 0 Strap Voltage Range  0 0.18 x VDDIO V
VMODE1 Mode 1 Strap Voltage Range 0.5 x VDDIO 0.88 x VDDIO V
IO CHARACTERISTICS (DC Specifications)
VIH High Level Input Voltage VDDIO = 3.3V ±5% 2 V
VIL Low Level Input Voltage VDDIO = 3.3V ±5% 0.8 V
VOH High Level Output Voltage IOH = -2mA, VDDIO = 3.3V ±5% 2.4 V
VOL Low Level Output Voltage IOL = 2mA, VDDIO = 3.3V ±5% 0.4 V
VIH High Level Input Voltage VDDIO = 2.5V ±5% 1.7 V
VIL Low Level Input Voltage VDDIO = 2.5V ±5% 0.7 V
VOH High Level Output Voltage IOH = -2mA, VDDIO = 2.5V ±5% 2 V
VOL Low Level Output Voltage IOL = 2mA, VDDIO = 2.5V ±5% 0.4 V
VIH High Level Input Voltage VDDIO = 1.8V ±5% 0.65*VDDIO V
VIL Low Level Input Voltage VDDIO = 1.8V ±5% 0.35*VDDIO V
VOH High Level Output Voltage IOH = -2mA, VDDIO = 1.8V ±5% VDDIO-0.45 V
VOL Low Level Output Voltage IOL = 2mA, VDDIO = 1.8V ±5% 0.45 V
IIH Input High Current Input High Current -55 55 µA
IIL Input Low Current TA = -55℃ to 125℃, VIN=GND -35 35 µA
Iozh Tri-state Output High Current TA = -55℃ to 125℃, VOUT=VDDIO -55 55 µA
Iozl Tri-state Output Low Current TA = -55℃ to 125℃, VOUT=GND -35 35 µA
Rpulldn Internal Pull Down Resistor 6.75 9 13.5 kΩ
Rpullup Internal Pull Up Resistor 6 10 14 kΩ
XI VIH High Level Input Voltage 1.2 VDDIO V
XI VIL Low Level Input Voltage 0.6 V
CIN Input Capacitance XI 1.5 pF
CIN Input Capacitance INPUT PINS 5.5 pF
COUT Output Capacitance XO 1.5 pF
COUT Output Capacitance OUTPUT PINS 5.5 pF
Rseries Integrated MAC Series Termination Resistor RX_D[3:0], RX_ER, RX_DV, RX_CLK 50 Ω
(1) Power Dissipation Measurements :Traffic : 100%, Packet Size: 1512, Random Content, Temp : -55 to 125C, Voltage Range : +/-5%
(2) In Mirror Mode, Channel D & C are used for Tx and Rx. Please refer to Mirror Mode section for additonal configuration for Output Differential Voltage 
(3) For RGMII interface, please refer to section "Reduced GMII" forRGMII timing and IBIS model based Signal Integrity simulation guidelines