4 Revision History
Changes from March 2, 2023 to August 18, 2023 (from Revision * (MARCH 2023) to Revision A (AUGUST 2023))
-
通篇:将文档标题从“AM69Ax”更新/更改为“AM69x”Go
-
通篇:删除了所有 OLDI/LVDS 内容;不适用于此器件套件Go
-
通篇:将 3D 图形处理单元 (GPU) 的“BSX”、“BSX-64-4”和“BXS-64-4”更新/更改为“IMG BXS-4-64”Go
- (封装信息):更新了表以与新的内容标准一致Go
- (Device Comparison): Added AM69 and AM69A part numbers to the table.
Merged table cells to show commonality/differences and to improve
readability.Go
- (Device Comparison): Added software build sheet
NoteGo
- (Device Comparison): Added footnotes to clarify LPDDR instance usage
for a) pin compatibility with 27 mm package, and b) requirements for using fewer
than 4 DDR instancesGo
- (Device Comparison): Added the "Device security features including
Secure Boot …" footnoteGo
- (Pin Attributes): Added "VDDA_0P8_DLL_MMC0" power supply to the MMC0 IO Power GroupGo
- (DDRSS0 Signal Descriptions): Added "DDRSS incremental order" footnoteGo
- (DDRSS1 Signal Descriptions): Added "DDRSS incremental order" footnoteGo
- (DDRSS2 Signal Descriptions): Added "DDRSS incremental order" footnoteGo
- (DDRSS2 Signal Descriptions): Added DDRSS2, DDRSS3, and SERDES2 availability footnoteGo
- (DDRSS3 Signal Descriptions): Added "DDRSS incremental order" footnoteGo
- (DDRSS3 Signal Descriptions): Added DDRSS2, DDRSS3, and SERDES2 availability footnoteGo
- (SERDES2 Signal Descriptions): Added DDRSS2, DDRSS3, and SERDES2 availability footnoteGo
- (Pin Connectivity Requirements) Updated ADC AIN recommendation to
allow the tie-off of signals directly to ground.Go
- (Pin Connectivity Requirements): Added requirement for DDR
interfaces to be used in incrementing orderGo
- (Recommended Operating Conditions): Added clarification to the "…
supply inputs" footnote, specifically for VDD_CORE, VDD_MCU, and VDD_CPU domains
plus, added cross-references to the MIN/MAX valuesGo
- (Recommended Operating Conditions): Added vdda_* noise
specificationGo
- (USB VBUS Design Guidelines): Updated/Changed USB VBUS Detect Voltage Divider
/ Clamp Circuit figureGo