ZHCSRW1A february   2023  – august 2023 AM69 , AM69A

ADVANCE INFORMATION  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
    1. 3.1 功能方框图
  5. 4 Revision History
  6. 5 Device Comparison
  7. 6 Terminal Configuration and Functions
    1. 6.1 Pin Diagrams
    2. 6.2 Pin Attributes
      1.      11
      2.      12
    3. 6.3 Signal Descriptions
      1.      14
      2. 6.3.1  ADC
        1. 6.3.1.1 MCU Domain
          1.        17
          2.        18
          3.        19
      3. 6.3.2  DDRSS
        1. 6.3.2.1 MAIN Domain
          1.        22
          2.        23
          3.        24
          4.        25
      4. 6.3.3  GPIO
        1. 6.3.3.1 MAIN Domain
          1.        28
        2. 6.3.3.2 WKUP Domain
          1.        30
      5. 6.3.4  I2C
        1. 6.3.4.1 MAIN Domain
          1.        33
          2.        34
          3.        35
          4.        36
          5.        37
          6.        38
          7.        39
        2. 6.3.4.2 MCU Domain
          1.        41
          2.        42
        3. 6.3.4.3 WKUP Domain
          1.        44
      6. 6.3.5  I3C
        1. 6.3.5.1 MCU Domain
          1.        47
      7. 6.3.6  MCAN
        1. 6.3.6.1 MAIN Domain
          1.        50
          2.        51
          3.        52
          4.        53
          5.        54
          6.        55
          7.        56
          8.        57
          9.        58
          10.        59
          11.        60
          12.        61
          13.        62
          14.        63
          15.        64
          16.        65
          17.        66
          18.        67
        2. 6.3.6.2 MCU Domain
          1.        69
          2.        70
      8. 6.3.7  MCSPI
        1. 6.3.7.1 MAIN Domain
          1.        73
          2.        74
          3.        75
          4.        76
          5.        77
          6.        78
          7.        79
        2. 6.3.7.2 MCU Domain
          1.        81
          2.        82
      9. 6.3.8  UART
        1. 6.3.8.1 MAIN Domain
          1.        85
          2.        86
          3.        87
          4.        88
          5.        89
          6.        90
          7.        91
          8.        92
          9.        93
          10.        94
        2. 6.3.8.2 MCU Domain
          1.        96
        3. 6.3.8.3 WKUP Domain
          1.        98
      10. 6.3.9  MDIO
        1. 6.3.9.1 MAIN Domain
          1.        101
          2.        102
        2. 6.3.9.2 MCU Domain
          1.        104
      11. 6.3.10 UFS
        1. 6.3.10.1 MAIN Domain
          1.        107
      12. 6.3.11 CPSW2G
        1. 6.3.11.1 MAIN Domain
          1.        110
        2. 6.3.11.2 MCU Domain
          1.        112
      13. 6.3.12 SGMII
        1. 6.3.12.1 MAIN Domain
          1.        115
      14. 6.3.13 ECAP
        1. 6.3.13.1 MAIN Domain
          1.        118
          2.        119
          3.        120
      15. 6.3.14 EQEP
        1. 6.3.14.1 MAIN Domain
          1.        123
          2.        124
          3.        125
      16. 6.3.15 EPWM
        1. 6.3.15.1 MAIN Domain
          1.        128
          2.        129
          3.        130
          4.        131
          5.        132
          6.        133
          7.        134
      17. 6.3.16 USB
        1. 6.3.16.1 MAIN Domain
          1.        137
      18. 6.3.17 Display Port
        1. 6.3.17.1 MAIN Domain
          1.        140
      19. 6.3.18 Hyperlink
        1. 6.3.18.1 MAIN Domain
          1.        143
          2.        144
          3.        145
      20. 6.3.19 PCIE
        1. 6.3.19.1 MAIN Domain
          1.        148
      21. 6.3.20 SERDES
        1. 6.3.20.1 MAIN Domain
          1.        151
          2.        152
          3.        153
          4.        154
      22. 6.3.21 DSI
        1. 6.3.21.1 MAIN Domain
          1.        157
          2.        158
      23. 6.3.22 CSI
        1. 6.3.22.1 MAIN Domain
          1.        161
          2.        162
          3.        163
      24. 6.3.23 MCASP
        1. 6.3.23.1 MAIN Domain
          1.        166
          2.        167
          3.        168
          4.        169
          5.        170
      25. 6.3.24 DMTIMER
        1. 6.3.24.1 MAIN Domain
          1.        173
        2. 6.3.24.2 MCU Domain
          1.        175
      26. 6.3.25 CPTS
        1. 6.3.25.1 MAIN Domain
          1.        178
        2. 6.3.25.2 MCU Domain
          1.        180
      27. 6.3.26 DSS
        1. 6.3.26.1 MAIN Domain
          1.        183
      28. 6.3.27 GPMC
        1. 6.3.27.1 MAIN Domain
          1.        186
      29. 6.3.28 MMC
        1. 6.3.28.1 MAIN Domain
          1.        189
          2.        190
      30. 6.3.29 OSPI
        1. 6.3.29.1 MCU Domain
          1.        193
          2.        194
      31. 6.3.30 Hyperbus
        1. 6.3.30.1 MCU Domain
          1.        197
      32. 6.3.31 Emulation and Debug
        1. 6.3.31.1 MAIN Domain
          1.        200
          2.        201
      33. 6.3.32 System and Miscellaneous
        1. 6.3.32.1 Boot Mode configuration
          1.        204
        2. 6.3.32.2 Clock
          1.        206
          2.        207
        3. 6.3.32.3 System
          1.        209
          2.        210
        4. 6.3.32.4 EFUSE
          1.        212
        5. 6.3.32.5 VMON
          1.        214
      34. 6.3.33 Power
        1.       216
    4. 6.4 Pin Connectivity Requirements
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Power-On-Hour (POH) Limits
    4. 7.4  Recommended Operating Conditions
    5. 7.5  运行性能点
    6. 7.6  Electrical Characteristics
      1. 7.6.1  I2C, Open-Drain, Fail-Safe (I2C OD FS) Electrical Characteristics
      2. 7.6.2  Fail-Safe Reset (FS Reset) Electrical Characteristics
      3. 7.6.3  HFOSC/LFOSC Electrical Characteristics
      4. 7.6.4  eMMCPHY Electrical Characteristics
      5. 7.6.5  SDIO Electrical Characteristics
      6. 7.6.6  CSI2/DSI D-PHY Electrical Characteristics
      7. 7.6.7  ADC12B Electrical Characteristics
      8. 7.6.8  LVCMOS Electrical Characteristics
      9. 7.6.9  USB2PHY Electrical Characteristics
      10. 7.6.10 SerDes 2-L-PHY/4-L-PHY Electrical Characteristics
      11. 7.6.11 UFS M-PHY Electrical Characteristics
      12. 7.6.12 eDP/DP AUX-PHY Electrical Characteristics
      13. 7.6.13 DDR0 Electrical Characteristics
    7. 7.7  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 7.7.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 7.7.2 Hardware Requirements
      3. 7.7.3 Programming Sequence
      4. 7.7.4 Impact to Your Hardware Warranty
    8. 7.8  Thermal Resistance Characteristics
      1. 7.8.1 Thermal Resistance Characteristics for ALY Package
    9. 7.9  Temperature Sensor Characteristics
    10. 7.10 Timing and Switching Characteristics
      1. 7.10.1 Timing Parameters and Information
      2. 7.10.2 Power Supply Sequencing
        1. 7.10.2.1 Power Supply Slew Rate Requirement
        2. 7.10.2.2 Combined MCU and Main Domains Power- Up Sequencing
        3. 7.10.2.3 Combined MCU and Main Domains Power- Down Sequencing
        4. 7.10.2.4 Isolated MCU and Main Domains Power- Up Sequencing
        5. 7.10.2.5 Isolated MCU and Main Domains Power- Down Sequencing
        6. 7.10.2.6 Independent MCU and Main Domains, Entry and Exit of MCU Only Sequencing
        7. 7.10.2.7 Independent MCU and Main Domains, Entry and Exit of DDR Retention State
        8. 7.10.2.8 Independent MCU and Main Domains, Entry and Exit of GPIO Retention Sequencing
      3. 7.10.3 System Timing
        1. 7.10.3.1 Reset Timing
        2. 7.10.3.2 Safety Signal Timing
        3. 7.10.3.3 Clock Timing
      4. 7.10.4 Clock Specifications
        1. 7.10.4.1 Input and Output Clocks / Oscillators
          1. 7.10.4.1.1 WKUP_OSC0 Internal Oscillator Clock Source
            1. 7.10.4.1.1.1 Load Capacitance
            2. 7.10.4.1.1.2 Shunt Capacitance
          2. 7.10.4.1.2 WKUP_OSC0 LVCMOS Digital Clock Source
          3. 7.10.4.1.3 Auxiliary OSC1 Internal Oscillator Clock Source
            1. 7.10.4.1.3.1 Load Capacitance
            2. 7.10.4.1.3.2 Shunt Capacitance
          4. 7.10.4.1.4 Auxiliary OSC1 LVCMOS Digital Clock Source
          5. 7.10.4.1.5 Auxiliary OSC1 Not Used
        2. 7.10.4.2 Output Clocks
        3. 7.10.4.3 PLLs
        4. 7.10.4.4 Module and Peripheral Clocks Frequencies
      5. 7.10.5 Peripherals
        1. 7.10.5.1  ATL
          1. 7.10.5.1.1 ATL_PCLK Timing Requirements
          2. 7.10.5.1.2 ATL_AWS[x] Timing Requirements
          3. 7.10.5.1.3 ATL_BWS[x] Timing Requirements
          4. 7.10.5.1.4 ATCLK[x] Switching Characteristics
        2. 7.10.5.2  CPSW2G
          1. 7.10.5.2.1 CPSW2G MDIO Interface Timings
          2. 7.10.5.2.2 CPSW2G RMII Timings
            1. 7.10.5.2.2.1 CPSW2G RMII[x]_REF_CLK Timing Requirements – RMII Mode
            2. 7.10.5.2.2.2 CPSW2G RMII[x]_RXD[1:0], RMII[x]_CRS_DV, and RMII[x]_RX_ER Timing Requirements – RMII Mode
            3. 7.10.5.2.2.3 CPSW2G RMII[x]_TXD[1:0], and RMII[x]_TX_EN Switching Characteristics – RMII Mode
          3. 7.10.5.2.3 CPSW2G RGMII Timings
            1. 7.10.5.2.3.1 RGMII[x]_RXC Timing Requirements – RGMII Mode
            2. 7.10.5.2.3.2 CPSW2G Timing Requirements for RGMII[x]_RD[3:0], and RGMII[x]_RCTL – RGMII Mode
            3. 7.10.5.2.3.3 CPSW2G RGMII[x]_TXC Switching Characteristics – RGMII Mode
            4. 7.10.5.2.3.4 RGMII[x]_TD[3:0], and RGMII[x]_TX_CTL Switching Characteristics – RGMII Mode
        3. 7.10.5.3  CSI-2
        4. 7.10.5.4  DDRSS
        5. 7.10.5.5  DSS
        6. 7.10.5.6  eCAP
          1. 7.10.5.6.1 Timing Requirements for eCAP
          2. 7.10.5.6.2 Switching Characteristics for eCAP
        7. 7.10.5.7  EPWM
          1. 7.10.5.7.1 Timing Requirements for eHRPWM
          2. 7.10.5.7.2 Switching Characteristics for eHRPWM
        8. 7.10.5.8  eQEP
          1. 7.10.5.8.1 Timing Requirements for eQEP
          2. 7.10.5.8.2 Switching Characteristics for eQEP
        9. 7.10.5.9  GPIO
          1. 7.10.5.9.1 GPIO Timing Requirements
          2. 7.10.5.9.2 GPIO Switching Characteristics
        10. 7.10.5.10 GPMC
          1. 7.10.5.10.1 GPMC and NOR Flash — Synchronous Mode
            1. 7.10.5.10.1.1 GPMC and NOR Flash Timing Requirements — Synchronous Mode
            2. 7.10.5.10.1.2 GPMC and NOR Flash Switching Characteristics – Synchronous Mode
          2. 7.10.5.10.2 GPMC and NOR Flash — Asynchronous Mode
            1. 7.10.5.10.2.1 GPMC and NOR Flash Timing Requirements – Asynchronous Mode
            2. 7.10.5.10.2.2 GPMC and NOR Flash Switching Characteristics – Asynchronous Mode
          3. 7.10.5.10.3 GPMC and NAND Flash — Asynchronous Mode
            1. 7.10.5.10.3.1 GPMC and NAND Flash Timing Requirements – Asynchronous Mode
            2. 7.10.5.10.3.2 GPMC and NAND Flash Switching Characteristics – Asynchronous Mode
          4. 7.10.5.10.4 GPMC0 IOSET
        11. 7.10.5.11 HyperBus
          1. 7.10.5.11.1 Timing Requirements for HyperBus
          2. 7.10.5.11.2 HyperBus 166 MHz Switching Characteristics
          3. 7.10.5.11.3 HyperBus 100 MHz Switching Characteristics
        12. 7.10.5.12 I2C
        13. 7.10.5.13 I3C
        14. 7.10.5.14 MCAN
        15. 7.10.5.15 MCASP
        16. 7.10.5.16 MCSPI
          1. 7.10.5.16.1 MCSPI — Controller Mode
          2. 7.10.5.16.2 MCSPI — Peripheral Mode
        17. 7.10.5.17 MMCSD
          1. 7.10.5.17.1 MMC0 - eMMC Interface
            1. 7.10.5.17.1.1 Legacy SDR Mode
            2. 7.10.5.17.1.2 High Speed SDR Mode
            3. 7.10.5.17.1.3 High Speed DDR Mode
            4. 7.10.5.17.1.4 HS200 Mode
            5. 7.10.5.17.1.5 HS400 Mode
          2. 7.10.5.17.2 MMC1/2 - SD/SDIO Interface
            1. 7.10.5.17.2.1 Default Speed Mode
            2. 7.10.5.17.2.2 High Speed Mode
            3. 7.10.5.17.2.3 UHS–I SDR12 Mode
            4. 7.10.5.17.2.4 UHS–I SDR25 Mode
            5. 7.10.5.17.2.5 UHS–I SDR50 Mode
            6. 7.10.5.17.2.6 UHS–I DDR50 Mode
            7. 7.10.5.17.2.7 UHS–I SDR104 Mode
        18. 7.10.5.18 CPTS
          1. 7.10.5.18.1 CPTS Timing Requirements
          2. 7.10.5.18.2 CPTS Switching Characteristics
        19. 7.10.5.19 OSPI
          1. 7.10.5.19.1 OSPI0 PHY Mode
            1. 7.10.5.19.1.1 OSPI With Data Training
              1. 7.10.5.19.1.1.1 OSPI Switching Characteristics – Data Training
            2. 7.10.5.19.1.2 OSPI Without Data Training
              1. 7.10.5.19.1.2.1 OSPI Timing Requirements – SDR Mode
              2. 7.10.5.19.1.2.2 OSPI Switching Characteristics – SDR Mode
              3. 7.10.5.19.1.2.3 OSPI Timing Requirements – DDR Mode
              4. 7.10.5.19.1.2.4 OSPI Switching Characteristics – DDR Mode
          2. 7.10.5.19.2 OSPI0 Tap Mode
            1. 7.10.5.19.2.1 OSPI0 Tap SDR Timing
            2. 7.10.5.19.2.2 OSPI0 Tap DDR Timing
        20. 7.10.5.20 OLDI
          1. 7.10.5.20.1 OLDI Switching Characteristics
        21. 7.10.5.21 PCIE
        22. 7.10.5.22 Timers
          1. 7.10.5.22.1 Timing Requirements for Timers
          2. 7.10.5.22.2 Switching Characteristics for Timers
        23. 7.10.5.23 UART
          1. 7.10.5.23.1 Timing Requirements for UART
          2. 7.10.5.23.2 UART Switching Characteristics
        24. 7.10.5.24 USB
      6. 7.10.6 Emulation and Debug
        1. 7.10.6.1 Trace
        2. 7.10.6.2 JTAG
          1. 7.10.6.2.1 JTAG Electrical Data and Timing
            1. 7.10.6.2.1.1 JTAG Timing Requirements
            2. 7.10.6.2.1.2 JTAG Switching Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 功能方框图
    3. 8.3 Processor Subsystems
      1. 8.3.1 Arm Cortex-A72
      2. 8.3.2 Arm Cortex-R5F
      3. 8.3.3 DSP C71x
    4. 8.4 Accelerators and Coprocessors
      1. 8.4.1 GPU
      2. 8.4.2 VPAC
      3. 8.4.3 DMPAC
    5. 8.5 Other Subsystems
      1. 8.5.1 MSMC
      2. 8.5.2 NAVSS
        1. 8.5.2.1 NAVSS0
        2. 8.5.2.2 MCU_NAVSS
      3. 8.5.3 PDMA Controller
      4. 8.5.4 Power Supply
      5. 8.5.5 Peripherals
        1. 8.5.5.1  ADC
        2. 8.5.5.2  ATL
        3. 8.5.5.3  CSI
          1. 8.5.5.3.1 Camera Streaming Interface Receiver (CSI_RX_IF) and MIPI DPHY Receiver (DPHY_RX)
          2. 8.5.5.3.2 Camera Streaming Interface Transmitter (CSI_TX_IF)
        4. 8.5.5.4  CPSW2G
        5. 8.5.5.5  CPSW9G
        6. 8.5.5.6  DCC
        7. 8.5.5.7  DDRSS
        8. 8.5.5.8  DSS
          1. 8.5.5.8.1 DSI
          2. 8.5.5.8.2 eDP
        9. 8.5.5.9  VPFE
        10. 8.5.5.10 eCAP
        11. 8.5.5.11 EPWM
        12. 8.5.5.12 ELM
        13. 8.5.5.13 ESM
        14. 8.5.5.14 eQEP
        15. 8.5.5.15 GPIO
        16. 8.5.5.16 GPMC
        17. 8.5.5.17 Hyperbus
        18. 8.5.5.18 I2C
        19. 8.5.5.19 I3C
        20. 8.5.5.20 MCAN
        21. 8.5.5.21 MCASP
        22. 8.5.5.22 MCRC Controller
        23. 8.5.5.23 MCSPI
        24. 8.5.5.24 MMC/SD
        25. 8.5.5.25 OSPI
        26. 8.5.5.26 PCIE
        27. 8.5.5.27 SerDes
        28. 8.5.5.28 WWDT
        29. 8.5.5.29 Timers
        30. 8.5.5.30 UART
        31. 8.5.5.31 USB
        32. 8.5.5.32 UFS
  10. 9 Applications, Implementation, and Layout
  11. 10Device Connection and Layout Fundamentals
    1. 10.1 Power Supply Decoupling and Bulk Capacitors
      1. 10.1.1 Power Distribution Network Implementation Guidance
    2. 10.2 External Oscillator
    3. 10.3 JTAG and EMU
    4. 10.4 Reset
    5. 10.5 Unused Pins
    6. 10.6 Hardware Design Guide for JacintoTM 7 Devices
  12. 11Peripheral- and Interface-Specific Design Information
    1. 11.1 LPDDR4 Board Design and Layout Guidelines
    2. 11.2 OSPI and QSPI Board Design and Layout Guidelines
      1. 11.2.1 No Loopback and Internal Pad Loopback
      2. 11.2.2 External Board Loopback
      3. 11.2.3 DQS (only available in Octal Flash devices)
    3. 11.3 USB VBUS Design Guidelines
    4. 11.4 System Power Supply Monitor Design Guidelines using VMON/POK
    5. 11.5 High Speed Differential Signal Routing Guidance
    6. 11.6 Thermal Solution Guidance
  13. 12Device and Documentation Support
    1. 12.1 Device Nomenclature
      1. 12.1.1 Standard Package Symbolization
      2. 12.1.2 Device Naming Convention
    2. 12.2 Tools and Software
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 静电放电警告
    6. 12.6 术语表
  14. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Packaging Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • ALY|1414
散热焊盘机械数据 (封装 | 引脚)
订购信息

3 说明

AM69 可扩展处理器系列采用不断发展的 Jacinto™ 7 架构，面向智能视觉摄像头应用，基于 TI 在视觉处理器市场上十多年所积累的广泛先进市场知识而构建。AM69x 系列专为工厂自动化、楼宇自动化和其他市场中广泛的成本敏感型高性能计算应用而构建。

AM69 以业界卓越的功耗/性能比为传统和深度学习算法提供高性能计算技术，并且系统集成度高，可为高级视觉摄像头应用实现可扩展性和更低的成本。关键内核包括用于常规计算的新款 Arm 和 GPU 处理器、具有标量和矢量内核的下一代 DSP、专用深度学习和传统算法加速器、集成的下一代成像子系统 (ISP)、视频编解码器和隔离式 MCU 岛。所有这些都由工业级安全硬件加速器提供保护。

通用计算内核和集成概述：Arm® Cortex®-A72 的两个四核集群配置（共 8 个内核）有助于实现多操作系统应用，且对软件管理程序的需求非常低。最多两个双核（共 4 个内核）Arm® Cortex®-R5F 子系统能够管理低级的时序关键型处理任务，使 Arm® Cortex®-A72 内核不受应用的影响。TI 的第 7 代 ISP 以现有出色的 ISP 为基础，能够灵活地处理更广泛的传感器套件，支持更高的位深度，并且具有面向分析应用的特性。集成的诊断和安全功能可支持高达 SIL-2 级别的运行，同时集成的安全功能可保护数据免受现代攻击。CSI2.0 端口支持多传感器输入。

主要高性能内核概述：C7000™ DSP 下一代内核（“C7x”）将 TI 先进的 DSP 和 EVE 内核整合到性能更高的单个内核中，并增加了浮点矢量计算功能，可实现对旧代码的向后兼容性，同时简化软件编程。即使在 105°C 和 125°C 的最坏情况结温下运行，四个“MMA”深度学习加速器也可在业界超低功率范围内实现高达 32 万亿次每秒运算 (TOPS) [每内核 8TOPS] 的性能。专用的视觉硬件加速器可提供视觉预处理，而不会影响系统性能。C7x/MMA 内核仅可用于 AM69 级处理器中的深度学习功能。

封装信息
器件型号 封装(1) 封装尺寸(2)
AM69x ALY（FCBGA，1414） 31mm x 31mm
XJ784S4 ALY（FCBGA，1414） 31mm x 31mm
(1) 有关更多信息，请参阅机械、封装和可订购信息 部分。
(2) 封装尺寸（长 × 宽）为标称值，并包括引脚（如适用）。