ZHCSMQ8E june 2006 – october 2020 SN65LVDS302
PRODUCTION DATA
THERMAL METRIC(1) | SN65LVDS302 | UNIT | |
---|---|---|---|
ZXH (nFBGA) | |||
80 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 41.5 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 29.4 | °C/W |
RθJB | Junction-to-board thermal resistance | 23.8 | °C/W |
ψJT | Junction-to-top characterization parameter | 0.5 | °C/W |
ψJB | Junction-to-board characterization parameter | 23.9 | °C/W |