ZHCSMQ8E june   2006  – october 2020 SN65LVDS302

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Input Electrical Characteristics
    7. 6.7  Output Electrical Characteristics
    8. 6.8  Timing Requirements
    9. 6.9  Switching Characteristics
    10. 6.10 Device Power Dissipation
    11.     Typical Characteristics
  8. 7 Parameter Measurement Information
    1.     20
    2. 7.1 Power Consumption Tests
    3. 7.2 Typical IC Power Consumption Test Pattern
    4. 7.3 Maximum Power Consumption Test Pattern
    5. 7.4 Output Skew Pulse Position and Jitter Performance
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Swap Pin Functionality
      2. 8.3.2 Parity Error Detection and Handling
    4. 8.4 Device Functional Modes
      1. 8.4.1 Deserialization Modes
        1. 8.4.1.1 1-Channel Mode
        2. 8.4.1.2 2-Channel Mode
        3. 8.4.1.3 3-Channel Mode
      2. 8.4.2 Powerdown Modes
        1. 8.4.2.1 Shutdown Mode
        2. 8.4.2.2 Standby Mode
      3. 8.4.3 Active Modes
        1. 8.4.3.1 Acquire Mode (PLL Approaches Lock)
        2. 8.4.3.2 Receive Mode
      4. 8.4.4 Status Detect and Operating Modes Flow
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Application Information
      2. 9.1.2 Preventing Increased Leakage Currents in Control Inputs
      3. 9.1.3 Calculation Example: HVGA Display
      4. 9.1.4 How to Determine Interconnect Skew and Jitter Budget
      5. 9.1.5 F/S Pin Setting and Connecting the SN65LVDS302 to an LCD Driver
      6. 9.1.6 How to Determine the LCD Driver Timing Margin
      7. 9.1.7 Typical Application Frequencies
    2. 9.2 Typical Applications
      1. 9.2.1 VGA Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Power-Up and Power-Down Sequences
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Dual LCD-Display Application
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Application Curve
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
  13. 12Device and Documentation Support
    1. 12.1 Community Resource
    2. 12.2 Trademarks
  14. 13Mechanical, Packaging, and Orderable Information

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10 Power Supply Recommendations

To minimize the power supply noise floor, provide good decoupling near the SN65LVDS302 power pins. TI recommends placing one 0.01-μF ceramic capacitor at each power pin, and two 0.1-μF ceramic capacitors on each power node. The distance between the SN65LVDS302 and capacitors must be minimized to reduce loop inductance and provide optimal noise filtering. Placing the capacitor underneath the SN65LVDS302 on the bottom of the PCB is often a good choice. A 100-pF ceramic capacitor can be put at each power pin to optimize the EMI performance.