SLAAET8A April   2025  – December 2025 MSPM0C1103 , MSPM0C1103-Q1 , MSPM0C1104 , MSPM0C1104-Q1 , MSPM0C1105 , MSPM0C1106 , MSPM0C1106-Q1 , MSPM0G1105 , MSPM0G1106 , MSPM0G1107 , MSPM0G1505 , MSPM0G1506 , MSPM0G1507 , MSPM0G1518 , MSPM0G1519 , MSPM0G3105 , MSPM0G3105-Q1 , MSPM0G3106 , MSPM0G3106-Q1 , MSPM0G3107 , MSPM0G3107-Q1 , MSPM0G3505 , MSPM0G3505-Q1 , MSPM0G3506 , MSPM0G3506-Q1 , MSPM0G3507 , MSPM0G3507-Q1 , MSPM0G3518 , MSPM0G3518-Q1 , MSPM0G3519 , MSPM0G3519-Q1 , MSPM0G3529-Q1 , MSPM0H3216 , MSPM0H3216-Q1 , MSPM0L1105 , MSPM0L1106 , MSPM0L1116 , MSPM0L1117 , MSPM0L1227 , MSPM0L1227-Q1 , MSPM0L1228 , MSPM0L1228-Q1 , MSPM0L1303 , MSPM0L1304 , MSPM0L1304-Q1 , MSPM0L1305 , MSPM0L1305-Q1 , MSPM0L1306 , MSPM0L1306-Q1 , MSPM0L1343 , MSPM0L1344 , MSPM0L1345 , MSPM0L1346 , MSPM0L2227 , MSPM0L2227-Q1 , MSPM0L2228 , MSPM0L2228-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2EMC and EMC Standards
    1. 2.1 EMC
      1. 2.1.1 EMS
      2. 2.1.2 EMI
    2. 2.2 EMC Standards
      1. 2.2.1 EMC Standards Category
    3. 2.3 EMC and IC Electrical Reliability in TI
  6. 3EMC Improvement Guidelines Summary
    1. 3.1 PCB Design Guidelines
    2. 3.2 Firmware Guidelines
  7. 4EMC Improvement Features on MSPM0
    1. 4.1 Susceptibility Protection Features
      1. 4.1.1 POR and BOR
      2. 4.1.2 NMI and Hard Fault
      3. 4.1.3 I/O ESD and Settings
    2. 4.2 Emission Reduction Features
      1. 4.2.1 Clock Source
      2. 4.2.2 Power Modes
      3. 4.2.3 Package
  8. 5Analysis for EMS Test
    1. 5.1 Root Cause Analysis
      1. 5.1.1 Permanent Damage
      2. 5.1.2 Recoverable Malfunction
    2. 5.2 Debug Flow
  9. 6Analysis for EMI Test
    1. 6.1 Root Cause Analysis
      1. 6.1.1 Power Line
      2. 6.1.2 External Vcore
    2. 6.2 Debug Flow
  10. 7Summary
  11. 8References
  12. 9Revision History

Root Cause Analysis

Considering the classification level in EMS standards, MSPM0 meets these different failure categories when doing EMC tests. Some failures can be acceptable, especially when system reset can be used in the test. More details are provided in the following sections.

Table 5-1 EMS Failure Category and Causes
Failure Category Specific Manifestation

Root Cause

EMC Test Acceptability Suggestions

Permanent damage

IO or peripheral functionality loss

Metallization defect

Unacceptable

Check whether beyond the Absolute Maximum ratings and Recommended Operating Conditions.

Leakage current

Oxide breakdown

DVCC-GND short circuit

Burn-in Defect

Recoverable malfunction

MCU reset abnormally

Trigger POR or BOOTRST

Conditionally acceptable

Check RSTCAUSE to know the reset cause.

MCU function abnormally

Trigger hard fault or register and RAM changes

Check IPSR to know the interrupt source.