ZHCSQT5 July   2022 TPS7A57

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Voltage Setting and Regulation
      2. 7.3.2 Low-Noise, Ultra-High Power-Supply Rejection Ratio (PSRR)
      3. 7.3.3 Programmable Soft-Start (NR/SS Pin)
      4. 7.3.4 Precision Enable and UVLO
      5. 7.3.5 Charge Pump Enable and BIAS Rail
      6. 7.3.6 Power-Good Pin (PG Pin)
      7. 7.3.7 Active Discharge
      8. 7.3.8 Thermal Shutdown Protection (TSD)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
      3. 7.4.3 Disabled
      4. 7.4.4 Current-Limit Operation
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1  Precision Enable (External UVLO)
      2. 8.1.2  Undervoltage Lockout (UVLO) Operation
        1. 8.1.2.1 IN Pin UVLO
        2. 8.1.2.2 BIAS UVLO
        3. 8.1.2.3 Typical UVLO Operation
        4. 8.1.2.4 UVLO(IN) and UVLO(BIAS) Interaction
      3. 8.1.3  Dropout Voltage (VDO)
      4. 8.1.4  Input and Output Capacitor Requirements (CIN and COUT)
      5. 8.1.5  Recommended Capacitor Types
      6. 8.1.6  Soft-Start, Noise Reduction (NR/SS Pin), and Power-Good (PG Pin)
      7. 8.1.7  Optimizing Noise and PSRR
      8. 8.1.8  Adjustable Operation
      9. 8.1.9  Load Transient Response
      10. 8.1.10 Current Limit and Foldback Behavior
      11. 8.1.11 Charge Pump Operation
      12. 8.1.12 Sequencing
      13. 8.1.13 Power-Good Functionality
      14. 8.1.14 Output Impedance
      15. 8.1.15 Paralleling for Higher Output Current and Lower Noise
      16. 8.1.16 Current Mode Margining
      17. 8.1.17 Voltage Mode Margining
      18. 8.1.18 Power Dissipation (PD)
      19. 8.1.19 Estimating Junction Temperature
      20. 8.1.20 TPS7A57EVM-081 Thermal Analysis
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  9. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 商标
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 术语表
  10. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Mechanical Data

封装选项

机械数据 (封装 | 引脚)
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订购信息

Recommended Capacitor Types

The device is designed to be stable using low equivalent series resistance (ESR) and low equivalent series inductance (ESL) ceramic capacitors at the input, output, and noise-reduction pin. Multilayer ceramic capacitors have become the industry standard for these types of applications and are recommended, but must be used with good judgment. Ceramic capacitors that employ X7R-, X5R-, and COG-rated dielectric materials provide relatively good capacitive stability across temperature. The use of Y5V-rated capacitors is discouraged because of large variations in capacitance.

Regardless of the ceramic capacitor type selected, ceramic capacitance varies with operating voltage and temperature. Make sure to derate ceramic capacitors by at least 50%. The input and output capacitors recommended herein account for a capacitance derating of approximately 50%, but at high VIN and VOUT conditions (VIN = 5.5 V to VOUT = 5.0 V) and temperature extremes, the derating can be greater than 50%, and must be taken into consideration.

The device requires input, output, and noise-reduction capacitors for proper operation of the LDO. Use the nominal or larger than nominal input and output capacitors as specified in the Section 6.3 table. Place input and output capacitors as close as possible to the corresponding pin and make the capacitor GND connections are as close as possible to the device GND pin to shorten transient currents on the return path. Using a larger input capacitor or a bank of capacitors with various values is always good design practice to counteract input trace inductance, improve transient response, and reduce input ripple and noise. Similarly, multiple capacitors on the output reduce charge pump ripple and optimize PSRR; see the Section 8.1.7 section.

Use the nominal noise-reduction CNR/SS capacitor because using a larger CNRSS capacitor can lengthen the start-up time as mentioned previously.