ZHCSB89H
May 2013 – December 2021
TPS65310A-Q1
PRODUCTION DATA
1
特性
2
应用
3
说明
4
Revision History
5
说明(续)
6
Pin Configuration and Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
SPI Timing Requirements
7.7
Typical Characteristics
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Buck Controller (Buck1)
8.3.1.1
Operating Modes
8.3.1.2
Normal Mode PWM Operation
8.3.2
Synchronous Buck Converters Buck2 And Buck3
8.3.3
BOOST Converter
8.3.4
Frequency-Hopping Spread Spectrum
8.3.5
Linear Regulator LDO
8.3.6
Gate Driver Supply
8.4
Device Functional Modes
8.4.1
RESET
8.4.2
Soft Start
8.4.3
INIT
8.4.4
TESTSTART
8.4.5
TESTSTOP
8.4.6
VTCHECK
8.4.7
RAMP
8.4.8
Power-Up Sequencing
8.4.9
Power-Down Sequencing
8.4.10
Active
8.4.11
ERROR
8.4.12
LOCKED
8.4.13
LPM0
8.4.14
Shutdown
8.4.14.1
Power-On Reset Flag
8.4.15
Wake Pin
8.4.16
IRQ Pin
8.4.17
VBAT Undervoltage Warning
8.4.18
VIN Over Or Undervoltage Protection
8.4.19
External Protection
8.4.20
Overtemperature Detection And Shutdown
8.4.21
Independent Voltage Monitoring
8.4.22
GND Loss Detection
8.4.23
Reference Voltage
8.4.24
Shutdown Comparator
8.4.25
LED And High-Side Switch Control
8.4.26
Window Watchdog
8.4.27
Timeout In Start-Up Modes
8.5
Programming
8.5.1
SPI
8.5.1.1
FSI Bit
8.6
Register Maps
8.6.1
Register Description
8.6.2
NOP0X00
8.6.2.1
SPI_SCK_FAIL 0x03
8.6.2.2
LPMO_CMD 0x11
8.6.2.3
LOCK_CMD 0x12
8.6.2.4
PWR_STAT 0x21
8.6.2.5
SYS_STAT 0x22
8.6.2.6
SPI_STAT 0x23
8.6.2.7
COMP_STAT 0x24
8.6.2.8
DEV_REV 0x2F
8.6.2.9
PWR_CONFIG 0x31
8.6.2.10
DEV_CONFIG 0x32
8.6.2.11
CLOCK_CONFIG 0x33
9
Application and Implementation
9.1
Application Information
9.2
Typical Applications
9.2.1
Buck Controller 1
9.2.1.1
Design Requirements
9.2.1.2
Detailed Design Procedure
9.2.1.2.1
Adjusting the Output Voltage for the BUCK1 Controller
9.2.1.2.2
Output Inductor, Sense Resistor and Capacitor Selection for the BUCK1 Controller
9.2.1.2.3
Compensation of the Buck Controller
9.2.1.2.4
Bootstrap Capacitor for the BUCK1 Controller
9.2.1.3
BUCK 1 Application Curve
9.2.2
Synchronous Buck Converters BUCK2 and BUCK3
9.2.2.1
Design Requirements
9.2.2.2
Detailed Design Procedure
9.2.2.2.1
Adjusting the Output Voltage for the BUCK2 and BUCK3 Converter
9.2.2.2.2
Output Inductor Selection for the BUCK2 and BUCK3 Converter
9.2.2.2.3
Compensation of the BUCK2 and BUCK3 Converters
9.2.2.2.4
Bootstrap Capacitor for the BUCK2/3 Converters
9.2.2.3
Application Curves
9.2.3
BOOST Converter
9.2.3.1
Design Requirements
9.2.3.2
Detailed Design Procedure
9.2.3.2.1
Adjusting the Output Voltage for the Boost Converter
9.2.3.2.2
Output Inductor and Capacitor Selection for the BOOST Converter
9.2.3.2.3
Compensation of the BOOST Converter
9.2.3.2.4
Output Diode for the BOOST Converter
9.2.3.3
BOOST Converter Application Curves
9.2.4
Linear Regulator
9.2.4.1
Design Requirements
9.2.4.2
Detailed Design Procedure
9.2.4.2.1
Adjusting the Output Voltage for the Linear Regulator
9.2.4.2.2
Output Capacitance for the Linear Regulator
9.2.4.3
Linear Regulator Application Curve
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.1.1
Buck Controller
11.1.2
Buck Converter
11.1.3
Boost Converter
11.1.4
Linear Regulator
11.1.5
Other Considerations
11.2
Layout Example
12
Device and Documentation Support
12.1
Documentation Support
12.1.1
Related Documentation
12.2
接收文档更新通知
12.3
支持资源
12.4
Trademarks
12.5
Electrostatic Discharge Caution
12.6
术语表
13
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
RVJ|56
MPQF275C
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsb89h_oa
zhcsb89h_pm
1
特性
符合汽车应用要求
AEC-Q100 测试指导结果如下:
器件温度等级 1:–40°C 至 125°C 的工作环境温度范围
器件 HBM ESD 分类等级 H1B
器件 CDM ESD 分类等级 C3B
输入电压范围:4V 至 40V,瞬态高达 60V;当使用外部 P 通道金属氧化物半导体 (PMOS) 时达到 80V
单输出同步降压控制器
峰值栅极驱动电流 0.6A
490kHz 固定开关频率
假随机跳频展频或三角模式
双路同步降压转换器
设计用于高达 2A 的输出电流
异相开关
开关频率:0.98 MHz
可调 350mA 线性稳压器
可调异步升压转换器
1A 集成开关
开关频率:0.98 MHz
所有稳压器输出的软启动功能
独立电压监控
欠压 (UV) 检测和过压 (OV) 保护
可为降压控制器、栅极驱动器、降压转换器、升压转换器和线性稳压器输出提供短路、过流和热保护
用于控制和诊断的串行外设接口 (SPI)
集成窗口安全装置 (WD)
基准电压输出
高侧 (HS) 驱动器,用于外部场效应晶体管 (FET) 和发光二极管 (LED) 驱动器
外部温度传感器输入,集成电路 (IC) 在 T
A
< -40°C 时关断
热增强型封装
56 引脚 QFN
(RVJ)