SPRS357D August 2006 – June 2020 TMS320F28044
PRODUCTION DATA.
请参考 PDF 数据表获取器件具体的封装图。
Based on the end application design and operational profile, the IDD and IDDIO currents could vary. Systems with more than 1 Watt power dissipation may require a product level thermal design. Care should be taken to keep Tj within specified limits. In the end applications, Tcase should be measured to estimate the operating junction temperature Tj. Tcase is normally measured at the center of the package top side surface. The thermal application note Semiconductor and IC Package Thermal Metrics helps to understand the thermal metrics and definitions.