ZHCS916I March   2009  – December 2018 TMP112

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      方框图
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Digital Temperature Output
      2. 7.3.2 Serial Interface
        1. 7.3.2.1 Bus Overview
        2. 7.3.2.2 Serial Bus Address
        3. 7.3.2.3 Writing and Reading Operation
        4. 7.3.2.4 Slave Mode Operations
          1. 7.3.2.4.1 Slave Receiver Mode
          2. 7.3.2.4.2 Slave Transmitter Mode
        5. 7.3.2.5 SMBus Alert Function
        6. 7.3.2.6 General Call
        7. 7.3.2.7 High-Speed (Hs) Mode
        8. 7.3.2.8 Timeout Function
        9. 7.3.2.9 Timing Diagrams
          1. 7.3.2.9.1 Two-Wire Timing Diagrams
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuos-Conversion Mode
      2. 7.4.2 Extended Mode (EM)
      3. 7.4.3 One-Shot/Conversion Ready Mode (OS)
      4. 7.4.4 Thermostat Mode (TM)
        1. 7.4.4.1 Comparator Mode (TM = 0)
        2. 7.4.4.2 Interrupt Mode (TM = 1)
    5. 7.5 Programming
      1. 7.5.1 Pointer Register
      2. 7.5.2 Temperature Register
      3. 7.5.3 Configuration Register
        1. 7.5.3.1 Shutdown Mode (SD)
        2. 7.5.3.2 Thermostat Mode (TM)
        3. 7.5.3.3 Polarity (POL)
        4. 7.5.3.4 Fault Queue (F1/F0)
        5. 7.5.3.5 Converter Resolution (R1 and R0)
        6. 7.5.3.6 One-Shot (OS)
        7. 7.5.3.7 Extended Mode (EM)
        8. 7.5.3.8 Alert (AL)
      4. 7.5.4 High- and Low-Limit Register
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档
    2. 11.2 社区资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 术语表
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Overview

The TMP112 family of devices are digital temperature sensors that are optimal for thermal-management and thermal-protection applications. The TMP112 family is two-wire, SMBus, and I2C interface-compatible. The device is specified over an operating temperature range of –40°C to 125°C. Figure 8 shows a block diagram of the TMP112 family. Figure 9 shows the ESD protection circuitry contained in the TMP112 family.

The temperature sensor in the TMP112 family is the chip itself. Thermal paths run through the package leads as well as the plastic package. The package leads provide the primary thermal path because of the lower thermal resistance of the metal.

An alternative version of the TMP112 family is available. The TMP102 device has reduced accuracy, the same micro-package, and is pin-to-pin compatible.

Table 1. Advantages of TMP112 family Versus TMP102

DEVICE COMPATIBLE INTERFACES PACKAGE SUPPLY CURRENT SUPPLY VOLTAGE (MIN) SUPPLY VOLTAGE (MAX) RESOLUTION LOCAL SENSOR ACCURACY (MAX) SPECIFIED CALIBRATION DRIFT SLOPE
TMP112 family I2C
SMBus
SOT563
1.2 × 1.6 × 0.6
10 µA 1.4 V 3.6 V 12 Bit
0.0625°C
0.5°C: (0°C to 65°C)
1°C: (-40°C to 125°C)
Yes
TMP102 I2C
SMBus
SOT563
1.2 × 1.6 × 0.6
10 µA 1.4 V 3.6 V 12 Bit
0.0625°C
2°C: (25°C to 85°C)
3°C: (-40°C to 125°C)
No