ZHCSEW6G may   2013  – november 2020 DS90UB913A-Q1

PRODUCTION DATA  

  1.   1
  2. 1特性
  3. 2应用
  4. 3说明
  5. 4Revision History
  6.   Device Comparison Table
  7. 5Pin Configuration and Functions
    1.     Pin Functions: DS90UB913A-Q1 Serializer
  8. 6Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Recommended Serializer Timing For PCLK
    7. 6.7  AC Timing Specifications (SCL, SDA) - I2C-Compatible
    8. 6.8  Bidirectional Control Bus DC Timing Specifications (SCL, SDA) - I2C-Compatible
    9. 6.9  Timing Diagrams
    10. 6.10 Serializer Switching Characteristics
    11. 6.11 Typical Characteristics
  9. 7Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Serial Frame Format
      2. 7.3.2 Line Rate Calculations for the DS90UB913A/914A
      3. 7.3.3 Error Detection
      4. 7.3.4 Synchronizing Multiple Cameras
      5. 7.3.5 General Purpose I/O (GPIO) Descriptions
      6. 7.3.6 LVCMOS VDDIO Option
      7. 7.3.7 Pixel Clock Edge Select (TRFB / RRFB)
      8. 7.3.8 Power Down
    4. 7.4 Device Functional Modes
      1. 7.4.1 DS90UB913A/914A Operation with External Oscillator as Reference Clock
      2. 7.4.2 DS90UB913A/914A Operation with Pixel Clock from Imager as Reference Clock
      3. 7.4.3 MODE Pin on Serializer
      4. 7.4.4 Internal Oscillator
      5. 7.4.5 Built In Self Test
      6. 7.4.6 BIST Configuration and Status
      7. 7.4.7 Sample BIST Sequence
    5. 7.5 Programming
      1. 7.5.1 Programmable Controller
      2. 7.5.2 Description of Bidirectional Control Bus and I2C Modes
      3. 7.5.3 I2C Pass-Through
      4. 7.5.4 Slave Clock Stretching
      5. 7.5.5 ID[x] Address Decoder on the Serializer
      6. 7.5.6 Multiple Device Addressing
    6. 7.6 Register Maps
  10.   Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Power Over Coax
      2. 8.1.2 Power-Up Requirements and PDB Pin
      3. 8.1.3 AC Coupling
      4. 8.1.4 Transmission Media
    2. 8.2 Typical Applications
      1. 8.2.1 Coax Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 STP Application
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
  11.   Power Supply Recommendations
  12. 8Layout
    1. 8.1 Layout Guidelines
      1. 8.1.1 Interconnect Guidelines
    2. 8.2 Layout Example
  13. 9Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
  14.   Mechanical, Packaging, and Orderable Information

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6.8 Bidirectional Control Bus DC Timing Specifications (SCL, SDA) - I2C-Compatible(4)

Over recommended supply and temperature ranges unless otherwise specified
PARAMETERTEST CONDITIONSMINNOMMAXUNIT
RECOMMENDED INPUT TIMING REQUIREMENTS
VIHInput High LevelSDA and SCL0.7*VDDIOVDDIOV
VILInput Low LevelSDA and SCLGND0.3*VDDIOV
VHYInput Hysteresis>50mV
VOLOutput Low Level(7)SDA, VDDIO = 1.8 V, IOL= 0.9 mA00.36V
SDA, VDDIO = 3.3 V, IOL= 1.6 mA00.4
IINInput CurrentSDA or SCL, VIN= VDDIO OR GND−1010µA
tRSDA Rise Time-READSDA, RPU = 10 kΩ, Cb ≤ 400 pF (Figure 6-1)430ns
tFSDA Fall Time-READ20ns
CINSDA or SCL<5pF
(1) The Electrical Characteristics tables list verified specifications under the listed Recommended Operating Conditions except as otherwise modified or specified by the Electrical Characteristics Conditions and/or Notes. Typical specifications are estimations only and are not verified.
(2) Current into device pins is defined as positive. Current out of a device pin is defined as negative. Voltages are referenced to ground except VOD and ΔVOD which are differential voltages.
(3) Typical values represent most likely parametric norms at 1.8 V or 3.3 V, TA = 25°C, and at the Recommended Operation Conditions at the time of product characterization and are not verified.
(4) Specification is verified by design.
(5) Recommended Input Timing Requirements are input specifications and not tested in production.
(6) T is the period of the PCLK.
(7) FPD-Link device was designed primarily for point-to-point operation and a small number of attached slave devices. As such the Minimum IOL pullup current is targeted to lower value than the minimum IOL in the I2C specification.
(8) ƒPCLK denotes input PCLK frequency to the device.
(9) ƒOSC denotes input external oscillator frequency to the device (GPO3/CLKIN).
(10) The back channel frequency (MHz) listed is the frequency of the internal clock used to generate the encoded back channel data stream. The data rate (Mbps) of the encoded back channel stream is the back channel frequency divided by 2.