ZHCSGN9D February   2016  – March 2018 LM36274

PRODUCTION DATA.  

  1. 特性
  2. 应用
    1.     简化原理图
  3. 说明
    1.     背光效率,4P6S
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Timing Requirements (Fast Mode)
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Features Description
      1. 7.3.1 Enabling the LM36274
      2. 7.3.2 Backlight
        1. 7.3.2.1 Current Sink Enable
        2. 7.3.2.2 Brightness Mapping
          1. 7.3.2.2.1 Linear Mapping
          2. 7.3.2.2.2 Exponential Mapping
        3. 7.3.2.3 Backlight Brightness Control Modes
          1. 7.3.2.3.1 I2C Brightness Control (PWM Pin Disabled)
          2. 7.3.2.3.2 I2C × PWM Brightness Control (PWM Pin Enabled)
            1. 7.3.2.3.2.1 PWM Ramper
        4. 7.3.2.4 Boost Switching Frequency
          1. 7.3.2.4.1 Minimum Inductor Select
        5. 7.3.2.5 Boost Feedback Gain Select
        6. 7.3.2.6 Auto Switching Frequency
        7. 7.3.2.7 PWM Input
          1. 7.3.2.7.1 PWM Sample Frequency
            1. 7.3.2.7.1.1 PWM Resolution and Input Frequency Range
            2. 7.3.2.7.1.2 PWM Sample Rate and Efficiency
              1. 7.3.2.7.1.2.1 PWM Sample Rate Example
          2. 7.3.2.7.2 PWM Hysteresis
          3. 7.3.2.7.3 PWM Step Response
          4. 7.3.2.7.4 PWM Timeout
          5. 7.3.2.7.5 PWM-to-Digital Code Readback
        8. 7.3.2.8 Regulated Headroom Voltage
        9. 7.3.2.9 Backlight Fault Protection and Faults
          1. 7.3.2.9.1 Backlight Overvoltage Protection (OVP)
          2. 7.3.2.9.2 Backlight Overcurrent Protection (OCP)
      3. 7.3.3 LCM Bias
        1. 7.3.3.1 Display Bias Boost Converter (VVPOS, VVNEG)
        2. 7.3.3.2 Auto Sequence Mode
        3. 7.3.3.3 Wake-up Mode
          1. 7.3.3.3.1 Wake1 Mode
          2. 7.3.3.3.2 Wake2 Mode
        4. 7.3.3.4 Active Discharge
        5. 7.3.3.5 LCM Bias Protection and Faults
          1. 7.3.3.5.1 LCM Overvoltage (OVP) Protection
          2. 7.3.3.5.2 VPOS Short-Circuit Protection
          3. 7.3.3.5.3 VNEG Short-Circuit Protection
      4. 7.3.4 Software Reset
      5. 7.3.5 HWEN Input
      6. 7.3.6 Thermal Shutdown (TSD)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Modes of Operation
    5. 7.5 Programming
      1. 7.5.1 I2C-Compatible Serial Bus Interface
        1. 7.5.1.1 Interface Bus Overview
        2. 7.5.1.2 Data Transactions
        3. 7.5.1.3 Acknowledge Cycle
        4. 7.5.1.4 Acknowledge After Every Byte Rule
        5. 7.5.1.5 Addressing Transfer Formats
        6. 7.5.1.6 Register Programming
    6. 7.6 Register Maps
      1. 7.6.1  Revision Register (Address = 0x01)[Reset = 0x01]
        1. Table 11. Revision Register Field Descriptions
      2. 7.6.2  Backlight Configuration1 Register (Address = 0x02)[Reset = 0x28]
        1. Table 12. Backlight Configuration 1 Register Field Descriptions
      3. 7.6.3  Backlight Configuration 2 Register (Address = 0x03)[Reset = 0x8D]
        1. Table 13. Backlight Configuration 2 Register Field Descriptions
      4. 7.6.4  Backlight Brightness LSB Register (Address = 0x04)[Reset = 0x07]
        1. Table 14. Backlight Brightness LSB Register Field Descriptions
      5. 7.6.5  Backlight Brightness MSB Register (Address = 0x05)[Reset = 0xFF]
        1. Table 15. Backlight Brightness MSB Register Field Descriptions
      6. 7.6.6  Backlight Auto-Frequency Low Threshold Register (Address = 0x06)[Reset = 0x00]
        1. Table 16. Backlight Auto-Frequency Low Threshold Field Descriptions
      7. 7.6.7  Backlight Auto-Frequency High Threshold Register (Address = 0x07)[Reset = 0x00]
        1. Table 17. Backlight Auto-Frequency High Threshold Field Descriptions
      8. 7.6.8  Backlight Enable Register (Address = 0x08)[Reset = 0x00]
        1. Table 18. Backlight Enable Register Field Descriptions
      9. 7.6.9  Bias Configuration 1 Register (Address = 0x09)[Reset = 0x18]
        1. Table 19. Bias Configuration 1 Register Field Descriptions
      10. 7.6.10 Bias Configuration 2 register (Address = 0x0A)[Reset = 0x11]
        1. Table 20. Bias Configuration 2 Register Field Descriptions
      11. 7.6.11 Bias Configuration 3 Register (Address = 0x0B)[Reset = 0x00]
        1. Table 21. Bias Configuration 3 Register Field Descriptions
      12. 7.6.12 LCM Boost Bias Register (Address = 0x0C)[Reset = 0x28]
        1. Table 22. LCM Boost Bias Register Field Descriptions
      13. 7.6.13 VPOS Bias Register (Address = 0x0D)[Reset = 0x1E]
        1. Table 23. VPOS Bias Register Field Descriptions
      14. 7.6.14 VNEG Bias Register (Address = 0x0E)[Reset = 0x1C]
        1. Table 24. VNEG Bias Register Field Descriptions
      15. 7.6.15 Flags Register (Address = 0x0F)[Reset = 0x00]
        1. Table 25. Flags Register Field Descriptions
      16. 7.6.16 Option 1 Register (Address = 0x10)[Reset = 0x06]
        1. Table 26. Option 1 Register Field Descriptions
      17. 7.6.17 Option 2 Register (Address = 0x11)[Reset = 0x35]
        1. Table 27. Option 2 Register Field Descriptions
      18. 7.6.18 PWM-to-Digital Code Readback LSB Register (Address = 0x12)[Reset = 0x00]
        1. Table 28. PWM-to-Digital Code Readback LSB Register Field Descriptions
      19. 7.6.19 PWM-to-Digital Code Readback MSB Register (Address = 0x13)[Reset = 0x00]
        1. Table 29. PWM-to-Digital Code Readback MSB Register Field Descriptions
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Component Selection
          1. 8.2.2.1.1 Inductor Selection
          2. 8.2.2.1.2 Boost Output Capacitor Selection
          3. 8.2.2.1.3 Input Capacitor Selection
      3. 8.2.3 Application Curves
        1. 8.2.3.1 Backlight Curves
          1. 8.2.3.1.1 Two LED Strings
          2. 8.2.3.1.2 Three LED Strings
          3. 8.2.3.1.3 Four LED Strings
        2. 8.2.3.2 LCM Bias Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 第三方产品免责声明
      2. 11.1.2 开发支持
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Inductor Selection

The LM36274 backlight boost requires a typical inductance in the range of 4.7 µH to 15 µH. To ensure boost stability the Backlight Boost L Select bit (register 0x11 bits [7:6]) must be selected depending on the value of inductance chosen. Use the 4.7-µH setting with a 6.8-µH inductor.

The LCM boost is internally compensated for a typical inductance in the range of 1 µH to 2.2 µH. If the LCM boost output setting is greater than 6.3 V a 2.2-µH inductor must be used.

There are two main considerations when choosing an inductor: the inductor RMS current rating must be greater than the RMS inductor current for the application, and the inductor saturation current must be greater than the peak inductor current for the application. Different saturation current rating specifications are followed by different manufacturers so attention must be given to details. Saturation current ratings are typically specified at 25°C. However, ratings at the maximum ambient temperature of the application should be requested from the manufacturer. The saturation current must be greater than the sum of the maximum load current and the worst-case average-to-peak inductor current. When the boost device is boosting (VOUT> VIN) the inductor is one of the largest area of efficiency loss in the circuit. Therefore, choosing an inductor with the lowest possible series resistance is important, especially for an LCM bias converter. For proper inductor operation and circuit performance, ensure that the inductor saturation and the peak current limit setting of the LM36274 are greater than IPEAK in Equation 5:

Equation 5. LM36274 IND_IPEAK.gif

See detailed information in Understanding Boost Power Stages in Switch Mode Power Supplieshttp://focus.ti.com/lit/an/slva061/slva061.pdf. Power Stage Designer™ Tools can be used for the boost calculation: http://www.ti.com/tool/powerstage-designer.

Also, the peak current calculated in Equation 5 is different from the peak inductor current setting (ISAT). The NMOS switch current limit setting (ICL_MIN) must be greater than IPEAK from Equation 5.