ZHCSD20G October   2014  – November 2023 DLPC900

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  System Oscillators Timing Requirements #GUID-909D0FD3-84C7-4481-924A-4FDE7EB548A1/DLPS0373944
    7. 5.7  Power-Up and Power-Down Timing Requirements
      1. 5.7.1 Power-Up
      2. 5.7.2 Power-Down
    8. 5.8  JTAG Interface: I/O Boundary Scan Application Timing Requirements
    9. 5.9  JTAG Interface: I/O Boundary Scan Application Switching Characteristics
    10. 5.10 Programmable Output Clocks Switching Characteristics
    11. 5.11 Port 1 and 2 Input Pixel Interface Timing Requirements
    12. 5.12 Two Pixels Per Clock (48-Bit Bus) Timing Requirements
    13. 5.13 Synchronous Serial Port (SSP) Switching Characteristics
    14. 5.14 DMD Interface Switching Characteristics #GUID-A1639D57-2918-4D83-ADD0-B21B369F4B9B/DLPS0379327
    15. 5.15 DMD LVDS Interface Switching Characteristics
    16. 5.16 Source Input Blanking Requirements
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 DMD Configurations
      2. 6.3.2 Video Timing Input Blanking Specification
      3. 6.3.3 Board-Level Test Support
      4. 6.3.4 Two Controller Considerations
      5. 6.3.5 Memory Design Considerations
        1. 6.3.5.1 Flash Memory Optimization
        2. 6.3.5.2 Operating Modes
        3. 6.3.5.3 DLPC900 External Memory Space
        4. 6.3.5.4 Minimizing Memory Space
        5. 6.3.5.5 Minimizing Board Size
          1. 6.3.5.5.1 Package Selection
          2. 6.3.5.5.2 Large Density Flash
            1. 6.3.5.5.2.1 Combining Two Chip-Selects with One 32-Megabyte Flash
            2. 6.3.5.5.2.2 Combining Three Chip-Selects with One 64-Megabyte Flash
            3. 6.3.5.5.2.3 Combining Three Chip-Selects with One 128-Megabyte Flash
        6. 6.3.5.6 Minimizing Board Space
        7. 6.3.5.7 Flash Memory
    4. 6.4 Device Functional Modes
      1. 6.4.1 Structured Light Application
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Typical Two Controller Chipset
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 DLPC900 System Interfaces
            1. 7.2.1.2.1.1 Control Interface
            2. 7.2.1.2.1.2 Input Data Interfaces
            3. 7.2.1.2.1.3 DLPC900 System Output Interfaces
              1. 7.2.1.2.1.3.1 Illumination Interface
              2. 7.2.1.2.1.3.2 Trigger and Sync Interface
            4. 7.2.1.2.1.4 DLPC900 System Support Interfaces
              1. 7.2.1.2.1.4.1 Reference Clock and PLL
              2. 7.2.1.2.1.4.2 Program Memory Flash Interface
              3. 7.2.1.2.1.4.3 DMD Interface
      2. 7.2.2 Typical Single Controller Chipset
  9. 8 Power Supply Recommendations
    1. 8.1 System Power Regulation
      1. 8.1.1 Power Distribution System
        1. 8.1.1.1 1.15-V System Power
        2. 8.1.1.2 1.8-V System Power
        3. 8.1.1.3 3.3-V System Power
    2. 8.2 System Environment and Defaults
      1. 8.2.1 DLPC900 System Power-Up and Reset Default Conditions
    3. 8.3 System Power-Up Sequence
      1. 8.3.1 Power-On Sense (POSENSE) Support
      2. 8.3.2 Power Good (PWRGOOD) Support
      3. 8.3.3 5-V Tolerant Support
    4. 8.4 System Reset Operation
      1. 8.4.1 Power-Up Reset Operation
      2. 8.4.2 System Reset Operation
  10. 9 Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1  General PCB Recommendations
      2. 9.1.2  PCB Layout Guidelines for Internal Controller PLL Power
      3. 9.1.3  PCB Layout Guidelines for Quality Video Performance
      4. 9.1.4  Recommended MOSC Crystal Oscillator Configuration
      5. 9.1.5  Spread Spectrum Clock Generator Support
      6. 9.1.6  GPIO Interface
      7. 9.1.7  General Handling Guidelines for Unused CMOS-Type Pins
      8. 9.1.8  DMD Interface Considerations
        1. 9.1.8.1 Flex Connector Plating
      9. 9.1.9  PCB Design Standards
      10. 9.1.10 Signal Layers
      11. 9.1.11 Trace Widths and Minimum Spacing
      12. 9.1.12 Trace Impedance and Routing Priority
      13. 9.1.13 Power and Ground Planes
      14. 9.1.14 Power Vias
      15. 9.1.15 去耦合
      16. 9.1.16 Fiducials
    2. 9.2 Layout Example
    3. 9.3 Thermal Considerations
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Device Nomenclature
      2. 10.1.2 Device Markings
      3. 10.1.3 DEFINITIONS—Video Timing Parameters
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 接收文档更新通知
    4. 10.4 支持资源
    5. 10.5 Trademarks
    6. 10.6 静电放电警告
    7. 10.7 术语表
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

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11 Revision History

Changes from Revision F (June 2021) to Revision G (November 2023)

  • 重新排列了列表并向支持的器件列表中添加了 DLP5500 DMDGo
  • 编辑了高速图形速率的措辞，并添加了有关 DLP500YX 的澄清信息Go
  • 移除了闪存存储器可保存的图形数量Go
  • 将“视频模式”部分中的 SVGA 更正为 XGAGo
  • 在 DLPC900 控制器支持的器件列表中添加了 DLP5500 DMDGo
  • 删除了指向 TI.com 上不再显示的页面的链接Go
  • 从#GUID-C35E90CC-29C8-4C72-96EB-B606BFE9E169/GUID-9D7DA0C9-F3AC-4E67-9EF9-A68D32A5F3B8 中删除了风扇块Go
  • 枚举了可用于 DLP5500 和所有其他 DMD 的 1 位图形数量Go
  • Moved placement of footnote 3 in the Trigger Control Pin Function table Go
  • Moved pins H23 and G23 from the Reserved Pin Functions table to Port1 and Port2 Channel Data and Control Pin Functions table.Go
  • Moved pins E8, B4, C4, E7, D5, E6, D3, C2, A4, B5, C6, A5, and D7 from Reserved Pin Functions table to Board-Level Test and Debug Pin Functions tableGo
  • Moved pins AD8, AE8, AF9, G24, D26, F23, F22, E24, and D25 from the Reserved Pin Functions table to the Peripheral Interface Pin Functions tableGo
  • Removed extraneous YCbCr referenceGo
  • Added the tSB parameter to Table 5-1 tableGo
  • Removed tEW from Table 5-1 table - duplicates tPH Go
  • Added DLPA200 to Figure 5-3 Go
  • PWRGOOD cannot be uses as an early warning signal for an anticipated power down.Go
  • Changed Power Mode = 1 "Standby" instructions for anticipated power down.Go
  • Changed Anticipated Power Down Sequence and Unanticipated Power Down Sequence diagrams to match the behavior of the DLPC900 controller.Go
  • Added DLP5500 DMD to list of supported devicesGo
  • Added XGA resolution to single DLPC900 controller systems for the DLP5500Go
  • Changed phrasing from 'normal' to 'default'Go
  • Changed the section name from DLPC900 Memory Space to DLPC900 External Memory SpaceGo
  • Updated GPIO signal namesGo
  • Updated GPIO signal namesGo
  • Removed lists of flash memory components and added links to the appropriate BOMs on TI.com Go
  • Added information about the number of 1-bit patterns the DLP5500 can pre-load and corrected the 1-bit depth of the DLP670S DMDGo
  • Added information to the tables about minimum exposure times for the DLP5500Go
  • Added table listing the number of 1-bit prestored patterns for each DMDGo
  • Updated Section to include DLP5500 DMD and reordered the DMD names.Go
  • Updated block diagram and added Table 7-1 Go
  • Updated DMD interface lists to include support for the DLP5500Go
  • Corrected P1_ bits to [0:9]Go
  • Added information about optional GPIOs for extended external memory accessGo
  • Updated the schematic to reflect the DLP5500Go
  • Updated Related Documents Table (added DLPLCR55EVM)Go

Changes from Revision E (March 2020) to Revision F ( June 2021)

  • 更新了整个文档中的表格、图和交叉参考的编号格式Go
  • Updated terminology to primary and secondary.Go
  • Updated "DLP LightCrafter 9000 EVM" to "DLP LightCrafter Dual DLPC900 Evaluation Module (EVM)"Go
  • Added 10 kΩ pulldown resistor requirement to the FAULT-STATUS pin description.Go
  • Updated H22, T22, and U23 to be Flash Address line extensionsGo
  • Updated terminology to primary and secondaryGo
  • DLPC900A ESD Human body model (HBM) and Charged device model (CDM) information added.Go
  • Updated terminology to primary and secondary.Go
  • Updated section to include DLP500YX and DLP670S DMDs.Go
  • Updated terminology to primary and secondary.Go
  • Included DLP500YX and DLP670S DMDs in sectionGo
  • Modified section to update DLPC900 Memory Space diagram and add new information about design and layout for larger flash devices up to 128-Megabytes.Go
  • Edited information regarding the amount of memory the DLPC900 can accessGo
  • Updated Section 7.3.5.5.2.2 to "Combining Three Chip Selects with One 128-Megabyte Flash" Go
  • Changed "LightCrafter 6500 and the LightCrafter 9000" to "Single DLPC900 Evaluation Module" and "Dual DLPC900 Evaluation Module".Go
  • Added 2-Gigabit Flash Memory device to Micron and Spansion devices listGo
  • Updated link to DLP® LightCrafter™ Single DLPC900 Evaluation Module (EVM) User's Guide (DLPU101) or DLP® LightCrafter™ Dual DLPC900 Evaluation Module (EVM) User's Guide (DLPU102)Go
  • Updated Minimum Exposure in Any Pattern Mode table to include DLP500YX and DLP670S DMDsGo
  • Updated Minimum Exposures for Number of Active DMD Blocks table to include DLP500YX and DLP670S DMDsGo
  • Updated Section to include DLP500YX and DLP670S DMDs.Go
  • Updated terminology to primary and secondary. Go
  • Updated section to include DLP500YX and DLP670S DMDs. Go
  • Updated Boot Flash Memory Layout to reflect updated flash design.Go
  • Updated terminology to primary and secondaryGo
  • Updated Related Documents TableGo