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SIMPLELINK-LOWPOWER-F2-SDK

SimpleLink™ Low Power F2 software development kit (SDK) for the CC13xx and CC26xx devices

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版本: 7.10.00.98
发布日期: 05 五月 2023
产品
低功耗 2.4GHz 产品
CC2642R 具有 352kB 闪存的 SimpleLink™ 32 位 Arm Cortex-M4F 低功耗 Bluetooth® 无线 MCU CC2651P3 具有 352kB 闪存的 SimpleLink™ 32 位 Arm® Cortex®-M4 单协议 2.4GHz 无线 MCU CC2651R3 具有 352kB 闪存的 SimpleLink™ 32 位 Arm® Cortex®-M4 单协议 2.4GHz 无线 MCU CC2651R3SIPA 具有集成天线的 SimpleLink™ 多协议 2.4GHz 无线系统级封装模块 CC2652P 具有集成式功率放大器的 SimpleLink™ Arm Cortex-M4F 多协议 2.4GHz 无线 MCU CC2652P7 具有集成式功率放大器的 SimpleLink™ Arm® Cortex®-M4F 多协议 2.4GHz 无线 MCU、704kB 闪存 CC2652PSIP 具有集成式功率放大器的 SimpleLink™ 多协议 2.4GHz 无线系统级封装模块 CC2652R 具有 352kB 闪存的 SimpleLink™ 32 位 Arm Cortex-M4F 多协议 2.4GHz 无线 MCU CC2652R7 具有 704kB 闪存的 SimpleLink™ Arm® Cortex®-M4F 多协议 2.4GHz 无线 MCU CC2652RB 具有无晶振 BAW 谐振器的 SimpleLink™ 32 位 Arm Cortex-M4F 多协议 2.4GHz 无线 MCU CC2652RSIP 具有 352KB 内存的 SimpleLink™ 多协议 2.4GHz 无线系统级封装模块
Sub-1GHz 无线 MCU
CC1311P3 具有 352KB 闪存和集成 +20dBm 功率放大器的 SimpleLink™ Arm® Cortex®-M4 Sub-1GHz 无线 MCU CC1311R3 具有 352kB 闪存的 SimpleLink™ Arm® Cortex®-M4 Sub-1GHz 无线 MCU CC1312PSIP 具有集成功率放大器的 Sub-1GHz 系统级封装 (SIP) 模块 CC1312R 具有 352kB 闪存的 SimpleLink™ 32 位 Arm Cortex-M4F 低于 1GHz 无线 MCU CC1312R7 具有 704kB 闪存的 SimpleLink™ Arm® Cortex®-M4F 多协议 Sub-1GHz 无线 MCU CC1352P 具有集成式功率放大器的 SimpleLink™ Arm Cortex-M4F 多协议低于 1GHz 和 2.4GHz 无线 MCU CC1352P7 具有集成式功率放大器的 SimpleLink™ Arm® Cortex®-M4F 多协议 Sub-1GHz 和 2.4GHz 无线 MCU CC1352R 具有 352kB 闪存的 SimpleLink™ 32 位 Arm Cortex-M4F 多协议低于 1GHz 和 2.4GHz 无线 MCU
汽车类无线连接产品
CC2642R-Q1 符合汽车标准的 SimpleLink™ 低功耗 Bluetooth® 无线 MCU
硬件开发
评估板
LAUNCHXL-CC1352P CC1352P SimpleLink™ 多频带无线 MCU LaunchPad™ 开发套件 LAUNCHXL-CC26X2R1 CC26x2R SimpleLink™ 多标准无线 MCU LaunchPad™ 开发套件 LP-CC1352P7 SimpleLink™ 多频带 CC1352P7 无线 MCU LaunchPad™ 开发套件 LP-CC2651R3SIPA CC2651R3SIPA SimpleLink™ 多协议 2.4GHz 无线 SIP 模块 LaunchPad™ 开发套件 LP-CC2652PSIP CC2562PSIP SimpleLink™ 多协议 2.4GHz 无线 SIP 模块 LaunchPad™ 开发套件 LP-CC2652R7 适用于 SimpleLink™ 多标准无线 MCU 的 CC2652R7 LaunchPad™ 开发套件 LP-CC2652RSIP CC2652RSIP SimpleLink™ 多标准无线 MCU LaunchPad™ 开发套件 LPSTK-CC1352R SimplElink™ 多频带 CC1352R 无线 MCU LaunchPad™ SensorTag 套件
开发套件
LAUNCHXL-CC1312R1 CC1312R LaunchPad™ development kit for sub-1-GHz SimpleLink™ wireless MCU LAUNCHXL-CC1352R1 CC1352R LaunchPad™ development kit for SimpleLink™ multi-band wireless MCU LP-CC1312R7 适用于 SimpleLink™ 多标准无线 MCU 的 CC1312R7 LaunchPad™ 开发套件 LP-CC2652RB CC2652RB LaunchPad™ development kit for BAW multi-protocol 2.4-GHz SimpleLink™ wireless MCU

发布信息

The SimpleLink™ Low Power F2 Software Development Kit (SDK), formerly known as the CC13xx and CC26xx SDK, delivers components that enable engineers to develop applications on the Texas Instruments SimpleLink CC13xx and CC26xx family of wireless microcontrollers (MCUs). This software toolkit provides a cohesive and consistent software experience for all SimpleLink CC13xx and CC26xx wireless MCU users by packaging essential software components, such as a Bluetooth® Low Energy (BLE) protocol stack supporting Bluetooth 5.2, Bluetooth Mesh, Thread 1.1.1 networking stack based on OpenThread, Zigbee 3.0 compliant protocol suite, RF-Proprietary examples, TI’s 15.4 Stack, TI Wi-SUN FAN, as well as the TI-RTOS7 kernel and TI Drivers in one easy-to-use software package along with example applications and documentation. In addition, the Dynamic Multi-Protocol Manager (DMM) software component enables multiprotocol development on a single SimpleLink wireless MCU. Although not included in the SDK, SimpleLink CC13xx and CC26xx wireless MCUs are also capable of supporting the Matter standard. Please refer to the TI Matter open source repository for resources and more information: https://github.com/TexasInstruments/matter

The SimpleLink MCU portfolio offers a single development environment that delivers flexible hardware, software, and tool options for customers developing wired and wireless applications. With 100 percent code reuse across host MCUs, Wi-Fi™, Bluetooth Low Energy, Sub-1GHz devices and more, choose the MCU or connectivity standard that fits your design. A one-time investment with the SimpleLink software development kit allows you to reuse often, opening the door to create unlimited applications. For more information, visit www.ti.com/simplelink.

Features:

  • Supports proprietary  Sub-1 GHz and 2.4 GHz applications using basic RX and TX examples
  • TI 15.4-Stack, an IEEE 802.15.4-based star topology networking solution for the Sub-1 GHz and 2.4 GHz bands
  • Certified Wi-SUN® FAN 1.0 compliant Sub-1 GHz mesh stack (learn more at TI.com/wisun or download the Wi-SUN software brief)
  • Bluetooth® Low Energy (BLE) software protocol stack supporting Bluetooth 5.2 and Bluetooth mesh (learn more at TI.com/ble)
  • Matter 1.0 and Thread 1.3 networking protocol based on open-source Matter project and Openthread (learn more at TI.com/matter)
  • Zigbee software protocol stack (Z-stack - learn more at TI.com/Zigbee)
  • Supports concurrent operation of BLE + Sub-1 GHz (TI 15.4-Stack or proprietary Sub-1 GHz) and BLE + Zigbee using the Dynamic Multi-Protocol
  • Supports Amazon Sidewalk Sub-1 GHz FSK and Bluetooth Low Energy

最新动态

  • Full support for CC13x4 devices.
  • TI's 15.4 & RF-Proprietary stacks now support the use of secure key storage and cryptographic services provided by TF-M Trusted Execution Environment for CC13x4 devices.
  • MCUBoot support added for CC13x4/CC26x4 & CC13x2x7/CC26x2x7 devices.
  • Zigbee PHY/MAC (Certified Version: TI 15.4 Core Stack 6.10) completed on CC13x4/CC26x4 devices.
  • BLE5 Stack certification (Bluetooth Core Specification 5.3) completed on CC13x4/CC26x4 devices.
  • Amazon Sidewalk Software Component support on CC1352R7 & CC2652R7 devices.
  • Wi-SUN Over the Air Download (OAD) support.
  • Optimized RF settings added for CC1312PSIP.