SPRAAV1C May 2009 – March 2020 AM3703 , AM3715 , OMAP3503 , OMAP3515 , OMAP3525 , OMAP3530
The challenge with fine pitch board design is to insure that traces and vias do not pull heat away from the solder ball pad. This means that common sense routing circuit board guidelines are still useable. Also beware of etch traps.
Small BGA pads do not have much solder and depend on uniform heating for a good joint. Here are some additional tips to insure that traces and vias do not serve as heatsinks:
The OMAP35x processors are relatively low power devices so the smaller traces are appropriate.