SPRAAV1C May   2009  – March 2020 AM3703 , AM3715 , OMAP3503 , OMAP3515 , OMAP3525 , OMAP3530

 

  1.   PCB Design Guidelines for 0.4mm Package-On-Package (PoP) Packages, Part I
    1.     Trademarks
    2. Using This Guide
    3. A Word of Caution
    4. A Team Sport
    5. Be Wary of Quotes
    6. Don’t Forget Your CAD Tools
    7. Metric Vs English
    8. PCB Fab Limits
    9. Routing and Layer Stackup
    10. OMAP35x 0.4mm Pitch
    11. 10 Pad Type
    12. 11 PCB Pad Dimensions for 0.4mm BGA Package
    13. 12 Multiple BGA Packages
    14. 13 Etch Traps and Heat Sinks
    15. 14 Vias and VIP
    16. 15 Laser Blind Vias
    17. 16 Filled Vias
    18. 17 Know Your Tools
    19. 18 BeagleBoard
    20. 19 BeagleBoard Views
      1. 19.1 Top Layer – Signal - Area Underneath the OMAP35x
      2. 19.2 Layer 2 – Ground
      3. 19.3 Layer 3 – Signal
      4. 19.4 Layer 4 – Signal
      5. 19.5 Layer 5 – Power (VDD2)
      6. 19.6 Layer 6 – Signal – Bottom Copper – Bottom Component Outlines
    21. 20 OMAP35x Decoupling
    22. 21 PCB Finishes for High Density Interconnect (HDI)
    23. 22 Real World Second Opinion
    24. 23 Acknowledgments
    25. 24 References
  2.   Revision History

Be Wary of Quotes

Board fabrication cost estimates vary widely. There are two key parameters that go into the overall quote cost:

  • Experience with fine pitch fabrication
  • The quantity of boards in the production run

Several board design and layout options are described with some options featuring a lower price. However, the lower price assumes that a relatively large number of boards are being fabricated. For smaller volumes, or for prototyping, the cost may be the same or even higher for some options.

Also, be wary of quick quotes that seem out of line. In many cases, the board vendor may be using outdated design rules causing a relatively high dollar quote for what might now be standard technology. Press them hard for ways to lower the cost. And be sure to obtain several quotes or get a second opinion.