SPRAAV1C
May 2009 – March 2020
AM3703
,
AM3715
,
OMAP3503
,
OMAP3515
,
OMAP3525
,
OMAP3530
PCB Design Guidelines for 0.4mm Package-On-Package (PoP) Packages, Part I
Trademarks
1
Using This Guide
2
A Word of Caution
3
A Team Sport
4
Be Wary of Quotes
5
Don’t Forget Your CAD Tools
6
Metric Vs English
7
PCB Fab Limits
8
Routing and Layer Stackup
9
OMAP35x 0.4mm Pitch
10
Pad Type
11
PCB Pad Dimensions for 0.4mm BGA Package
12
Multiple BGA Packages
13
Etch Traps and Heat Sinks
14
Vias and VIP
15
Laser Blind Vias
16
Filled Vias
17
Know Your Tools
18
BeagleBoard
19
BeagleBoard Views
19.1
Top Layer – Signal - Area Underneath the OMAP35x
19.2
Layer 2 – Ground
19.3
Layer 3 – Signal
19.4
Layer 4 – Signal
19.5
Layer 5 – Power (VDD2)
19.6
Layer 6 – Signal – Bottom Copper – Bottom Component Outlines
20
OMAP35x Decoupling
21
PCB Finishes for High Density Interconnect (HDI)
22
Real World Second Opinion
23
Acknowledgments
24
References
Revision History
23
Acknowledgments
Clint Cooley and Franklin Troung, CircuitCo, 675 N. Glenville #195, Richardson, TX 75081, 214-466-6690,
www.CircuitCo.com
Elcoteq, Sinimaentie 8B, P.O. Box 8, FI-02631 Espoo, Finland
Micron Technology, Inc., 8000 South Federal Way, Post Office Box 6, Boise, ID 83707-0006