ZHCSHO9P July   2006  – February 2018 TLK2711-SP

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     外部组件互连
  4. 修订历史记录
  5. 说明 (续)
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 TTL Input Electrical Characteristics
    6. 7.6 Transmitter/Receiver Electrical Characteristics
    7. 7.7 Reference Clock (TXCLK) Timing Requirements
    8. 7.8 TTL Output Switching Characteristics
    9. 7.9 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Transmit Interface
      2. 8.3.2  Transmit Data Bus
      3. 8.3.3  Data Transmission Latency
      4. 8.3.4  8-Bit/10-Bit Encoder
      5. 8.3.5  Pseudo-Random Bit Stream (PRBS) Generator
      6. 8.3.6  Parallel to Serial
      7. 8.3.7  High-Speed Data Output
      8. 8.3.8  Receive Interface
      9. 8.3.9  Receive Data Bus
      10. 8.3.10 Data Reception Latency
      11. 8.3.11 Serial to Parallel
      12. 8.3.12 Comma Detect and 8-Bit/10-Bit Decoding
      13. 8.3.13 LOS Detection
      14. 8.3.14 PRBS Verification
      15. 8.3.15 Reference Clock Input
      16. 8.3.16 Operating Frequency Range
      17. 8.3.17 Testability
      18. 8.3.18 Loopback Testing
      19. 8.3.19 BIST
      20. 8.3.20 Power-On Reset
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down Mode
      2. 8.4.2 High-Speed I/O Directly-Coupled Mode
      3. 8.4.3 High-Speed I/O AC-Coupled Mode
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 接收文档更新通知
    2. 12.2 社区资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

修订历史记录

Changes from O Revision (March 2016) to P Revision

  • Changed column header of Table 4 indicating correct order of receive data bus bitsGo
  • Added 接收文档更新通知 部分Go

Changes from N Revision (December 2015) to O Revision

  • Changed reference to table note (2) Internal 10-kΩ pulldown for TKLSB and TKMSBGo

Changes from M Revision (October 2014) to N Revision

  • Updated the frequency range of TXCLK Go
  • Updated Handling Ratings table to an ESD Ratings table and moved Tstg to the Absolute Maximum Ratings tableGo
  • 添加了社区资源Go

Changes from L Revision (August 2014) to M Revision

Changes from K Revision (July 2014) to L Revision

  • Updated Power-On/Reset Timing Diagram optionsGo

Changes from J Revision (May 2014) to K Revision

  • Updated pin description for ENABLEGo
  • Updated pin voltages in Absolute Maximum RatingsGo
  • Added more information to Power-On Reset detailing two power-on/reset timing options Go

Changes from I Revision (January 2014) to J Revision

  • Changed 格式符合最新的数据表标准;添加了新的部分并移动了现有部分 Go
  • Changed 说明Go
  • Changed 有关 LCKREFN 的段落:说明 (续)Go
  • Changed Description of LCKREFN in Go
  • Changed Power-On Reset section Go

Changes from H Revision (December 2013) to I Revision

  • Added 将 /EM 列表项添加到了特性Go
  • Deleted Ordering Information tableGo