ZHCSHO9P July 2006 – February 2018 TLK2711-SP
PRODUCTION DATA.
Standard high-speed differential routing best practices must be employed. Routing should be 50-Ω matched impedance and length for differential transmit and receive. Minimize layer transitions and stubs to reduce any impedance mismatches. Connecting the thermal pad to board ground improves device performance by supplying lower impedance path to ground minimizing ground bounce and improves thermal dissipation.