ZHCSHO9P July   2006  – February 2018 TLK2711-SP

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     外部组件互连
  4. 修订历史记录
  5. 说明 (续)
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 TTL Input Electrical Characteristics
    6. 7.6 Transmitter/Receiver Electrical Characteristics
    7. 7.7 Reference Clock (TXCLK) Timing Requirements
    8. 7.8 TTL Output Switching Characteristics
    9. 7.9 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Transmit Interface
      2. 8.3.2  Transmit Data Bus
      3. 8.3.3  Data Transmission Latency
      4. 8.3.4  8-Bit/10-Bit Encoder
      5. 8.3.5  Pseudo-Random Bit Stream (PRBS) Generator
      6. 8.3.6  Parallel to Serial
      7. 8.3.7  High-Speed Data Output
      8. 8.3.8  Receive Interface
      9. 8.3.9  Receive Data Bus
      10. 8.3.10 Data Reception Latency
      11. 8.3.11 Serial to Parallel
      12. 8.3.12 Comma Detect and 8-Bit/10-Bit Decoding
      13. 8.3.13 LOS Detection
      14. 8.3.14 PRBS Verification
      15. 8.3.15 Reference Clock Input
      16. 8.3.16 Operating Frequency Range
      17. 8.3.17 Testability
      18. 8.3.18 Loopback Testing
      19. 8.3.19 BIST
      20. 8.3.20 Power-On Reset
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down Mode
      2. 8.4.2 High-Speed I/O Directly-Coupled Mode
      3. 8.4.3 High-Speed I/O AC-Coupled Mode
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 接收文档更新通知
    2. 12.2 社区资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Power-On Reset

Upon application of minimum valid power and valid GTX_CLK with device enabled (ENABLE = HIGH), the TLK2711-SP generates a power-on reset. During the power-on reset the RXD0 to RXD15, RKLSB, and RKMSB signal pins go to a high-impedance state. The RXCLK is held low. LCKREFN must be deasserted (logic high state) with active transitions on the receiver during the power-on reset period. Active transitions on receiver can be accomplished with transitions on RXP/N or by assertion of LOOPEN. For TX-only applications, LOOPEN and LCKREFN can be driven logic high together. The receiver circuit requires this to properly reset. After power-up reset period, LCKREFN can be asserted for transmit only applications. The length of the power-on reset cycle depends on the TXCLK frequency, but is less than 1 ms. See Figure 12. TI recommends that the receiver be reset immediately after power up. In some conditions, it is possible for the receiver circuit to power up in state with internal contention.

If LCKREFN cannot be deasserted high during or for the complete power-on reset period, it can be deasserted high at the end of or after the power-on reset period for minimum of 1 µs with active transitions on receiver to properly complete reset of receiver.

TLK2711-SP PowerOn_Reset2_SGLS307.gifFigure 12. Power-On/Reset Timing Diagram